My Inquiry
My Account
AMD XC7VX690T-L2FFG1761E
- Part No.:
- XC7VX690T-L2FFG1761E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-L2FFG1761E.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,074
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX690T-L2FFG1761E from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 4,864 DSP slices, and 56.9 Mb of block RAM. It features 1,761-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging and supports transceiver line rates up to 13.1 Gb/s, targeting high-speed serial interface implementation in radar signal processing systems.
For engineers reviewing the XC7VX690T-L2FFG1761E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver voltage compliance (1.8 V/1.5 V/1.2 V), I/O bank voltage flexibility (1.2 V to 3.3 V), thermal design power (29.5 W typical), and JTAG boundary-scan support for production testability.
Technical Context
The XC7VX690T-L2FFG1761E implements a 28 nm HPL (High Performance Low Power) process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated multi-gigabit transceivers (MGTs) supporting PCIe Gen3, SRIO Gen2, and CPRI protocols. It includes hardened IP for PCI Express® Gen3 x8 endpoint/root port and 10 Gigabit Ethernet MAC.
Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG modes using external SPI flash or BPI PROM. The device supports partial reconfiguration and bitstream encryption using AES-256 with HMAC authentication for secure field updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 4,864 - enables parallel execution of fixed/floating-point multiply-accumulate operations per clock cycle |
| Block RAM | 56.9 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceiver Speed | 13.1 Gb/s - supports 10GBASE-R, OTU4, and CPRI Option 10 physical layer interfaces |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interfacing with DDR3-1866, MIPI, and video PHYs |
| Thermal Design Power | 29.5 W (typical) - defines minimum heatsink requirements under worst-case switching activity |
| Configuration Interface | Master/Slave SelectMAP, JTAG - enables in-system programming and boundary-scan testing during manufacturing |
Pinout & Package
XC7VX690T-L2FFG1761E uses a 1761-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 1.0 mm ball pitch, designed for high-density PCB layouts requiring controlled impedance routing and thermal vias under the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O with programmable slew rate and drive strength |
| HR Bank 0–3 | High-Range I/O Bank | Supports 1.2 V to 3.3 V signaling; each bank independently configurable for voltage and standard |
| HP Bank 4–15 | High-Performance I/O Bank | Optimized for 1.2 V/1.35 V/1.5 V operation with sub-100 ps skew for DDR3 interfaces |
| GTXE2_CHANNEL | Multi-Gigabit Transceiver | Each channel supports CDR, 8B/10B encoding, and PRBS pattern generation for link training |
| CONFIG_IO | Configuration Control | Dedicated pins for INIT_B, PROGRAM_B, DONE, and CCLK control configuration sequence timing and status |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical applications |
| AES-256 Bitstream Encryption | Prevents unauthorized access to FPGA configuration data during storage and in-field update over insecure channels |
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and ensures protocol compliance without external PHY or soft-core overhead |
| UltraScale+ Compatible Toolflow | Allows migration path to newer architectures using same Vivado design environment and constraint methodology |
| Production-Grade JTAG Boundary Scan | Supports IEEE 1149.1 compliance for automated test pattern generation and fault isolation in high-volume manufacturing |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms; transceivers interface with ADC/DACs at 1.25 GSPS. Use Value: 693K logic cells enable concurrent processing of multiple radar channels; 13.1 Gb/s transceivers sustain JESD204B subclass 1 links to high-speed data converters. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backend subsystems. IC Role / Device Role / Timing Role: Accelerates iterative reconstruction (IR) and compressed sensing algorithms while managing gigabit video streaming to display engines. Use Value: 56.9 Mb block RAM buffers raw k-space data; PCIe Gen3 x8 hard IP enables low-latency transfer to host CPU memory. |
| 5G Wireless Baseband | Test & Measurement Equipment |
Use Scenario: Layer 1 baseband processing for massive MIMO and mmWave front-haul in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Implements flexible numerology-aware OFDM modulation/demodulation and LDPC decoding across multiple antenna ports. Use Value: 4,864 DSP slices deliver >2 TeraMAC/s throughput; HR I/O banks interface directly with 12-bit 2.5 GSPS RF sampling ADCs. | Use Scenario: Modular signal analyzer platform supporting real-time spectrum analysis up to 26.5 GHz with deep memory capture. IC Role / Device Role / Timing Role: Captures and preprocesses wideband IF samples; manages high-speed data streaming to SSD arrays via SATA Gen3 or PCIe. Use Value: 1761-ball FC-FBGA enables dense interconnect for >100 Gbps aggregate I/O bandwidth; thermal design power supports fanless chassis operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | 10% higher logic density (1,143K LC), 16.3 Gb/s transceivers, 20 nm process, lower static power | Better suited for next-gen 5G fronthaul and AI inference acceleration where higher DSP throughput is required | Select XCKU115-2FLVD1924E when migrating to UltraScale architecture with tighter power budgets and higher serial bandwidth needs |
| XC7VX980T-2FFG1930I | Higher speed grade (-2), larger package (1930-ball), 983K logic cells, extended temperature range (-40°C to +100°C) | Targeted for aerospace and defense deployments requiring industrial temperature tolerance and radiation-hardened layout practices | Choose XC7VX980T-2FFG1930I for mission-critical environments where extended thermal margin and additional logic headroom are mandatory |
Compared with XCKU115-2FLVD1924E and XC7VX980T-2FFG1930I, the XC7VX690T-L2FFG1761E offers optimal balance of transceiver bandwidth, logic capacity, and thermal envelope for ground-based radar and medical imaging systems operating within commercial temperature ranges.
Availability
XC7VX690T-L2FFG1761E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G wireless baseband, and test & measurement equipment requiring stable component supply across long product lifecycles.
Supply support for XC7VX690T-L2FFG1761E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-7 family was engineered for high-bandwidth, compute-intensive applications such as wired/wireless infrastructure, defense radar, and scientific instrumentation requiring deterministic latency and scalable I/O.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-L2FFG1761E?
The XC7VX690T-L2FFG1761E supports a maximum transceiver line rate of 13.1 Gb/s per channel, validated for protocols including CPRI Option 10, 10GBASE-R, and OTU4. This performance is guaranteed under the -2 speed grade and specified at junction temperatures up to 100°C with proper power delivery and reference clock jitter below 0.3 ps RMS.
Does XC7VX690T-L2FFG1761E support partial reconfiguration?
Yes, the XC7VX690T-L2FFG1761E supports partial reconfiguration through Xilinx Vivado Design Suite, enabling dynamic replacement of logic modules without resetting the entire device. This capability is used in XC7VX690T-L2FFG1761E-based systems for runtime adaptation of signal processing pipelines in radar and communications applications.
What configuration modes are supported by XC7VX690T-L2FFG1761E?
The XC7VX690T-L2FFG1761E supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Configuration bitstream loading is initiated via PROGRAM_B and monitored using DONE and INIT_B signals, all defined in the XC7VX690T-L2FFG1761E configuration user guide UG470.
What is the I/O voltage range supported by XC7VX690T-L2FFG1761E HP banks?
The XC7VX690T-L2FFG1761E HP (High-Performance) I/O banks support 1.2 V, 1.35 V, and 1.5 V VCCO levels, optimized for low-skew DDR3/DDR4 memory interfaces and high-speed SERDES receivers. Each HP bank must be powered at a single VCCO voltage, and bank-specific VREF is required for differential standards like LVDS.
Is XC7VX690T-L2FFG1761E compatible with Vivado Design Suite?
Yes, the XC7VX690T-L2FFG1761E is fully supported in Xilinx Vivado Design Suite 2018.3 and later versions. Synthesis, implementation, and bitstream generation for XC7VX690T-L2FFG1761E require the Virtex-7 device libraries and target-specific constraints files included in the tool installation.
XC7VX690T-L2FFG1761E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-L2FFG1761E FAQ
1.How can I place an order for XC7VX690T-L2FFG1761E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-L2FFG1761E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-L2FFG1761E reliable?
The price and inventory of XC7VX690T-L2FFG1761E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-L2FFG1761E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-L2FFG1761E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-L2FFG1761E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-L2FFG1761E?
XC7VX690T-L2FFG1761E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-L2FFG1761E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-L2FFG1761E?
For technical support, including XC7VX690T-L2FFG1761E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-L2FFG1761E requirements.
6.How does Aetrix verify that XC7VX690T-L2FFG1761E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-L2FFG1761E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-L2FFG1761E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-L2FFG1761E?
All XC7VX690T-L2FFG1761E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-L2FFG1761E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-L2FFG1761E part is unused and in its original packaging.
Return procedure for XC7VX690T-L2FFG1761E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX690T-L2FFG1761E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
