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AMD XC7VX690T-L2FFG1926E
- Part No.:
- XC7VX690T-L2FFG1926E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-L2FFG1926E.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,893
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Product details
Overview
XC7VX690T-L2FFG1926E from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 3,600 DSP slices, and 48.5 Mb of block RAM, configured in a 1926-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and compute-accelerated applications in radar signal processing.
For engineers reviewing the XC7VX690T-L2FFG1926E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), thermal design power (145 W), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
This device belongs to the Virtex-7 family and implements a heterogeneous architecture integrating programmable logic, hardened transceivers, and memory controllers. It supports PCIe Gen3 x8, 10G Ethernet MAC, and DDR3/DDR4 memory interfaces up to 1866 Mbps.
The XC7VX690T-L2FFG1926E includes 48 GTs (Gigabit Transceivers) with built-in PRBS generators/checkers and supports JESD204B subclass 1 for high-speed data converter interfacing. Configuration is performed via dual-boot SPI flash or JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 3,600 - dedicated arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 48.5 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering and FIFOs |
| GT Transceivers | 48 × 13.1 Gb/s - serial I/O supporting PCIe Gen3, 10G Ethernet, and JESD204B |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage operation across 1.2 V to 3.3 V banks |
| Configuration Mode | Master SPI x4, Slave SelectMAP, JTAG - enables flexible boot and debug workflows |
| Thermal Design Power | 145 W - defines heatsink and airflow requirements for sustained operation |
Pinout & Package
XC7VX690T-L2FFG1926E is housed in a 1926-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, or SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI mode |
| DIN | Serial Data Input | Receives bitstream from SPI flash during configuration |
| INIT_B | Configuration Status | Active-low open-drain output indicating configuration readiness or error |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts boot sequence |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter clock input for GT transceiver PLLs (100–800 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process technology | Enables higher logic density and lower dynamic power versus 40 nm predecessors |
| Hardened PCIe Gen3 x8 endpoint | Reduces RTL integration effort and guarantees compliance without external PHY |
| Integrated Memory Controller | Supports DDR3/DDR4 up to 1866 Mbps with ECC and AXI4 interface |
| JESD204B Subclass 1 support | Enables deterministic latency and multi-device synchronization for ADC/DAC interfacing |
| Partial Reconfiguration capability | Allows dynamic logic module swapping without full device reboot |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 3,600 DSP slices enable concurrent 1024-point FFTs at 200 MHz clock, meeting sub-millisecond processing deadlines. | Use Scenario: Offloading matrix multiplication and convolution kernels from CPU in edge AI inference servers. IC Role / Device Role / Timing Role: Programmable accelerator tightly coupled to DDR4 memory subsystem and PCIe Gen3 host interface. Use Value: 48.5 Mb on-chip RAM reduces off-chip memory access latency, improving throughput by 3.2× over GPU-based inference at 16-bit precision. |
| 10G Optical Transport | Test & Measurement Equipment |
Use Scenario: Forward error correction (FEC) and OTU2/OTU3 framing in optical line cards. IC Role / Device Role / Timing Role: Line-side protocol processor with 13.1 Gb/s GT transceivers and deterministic SerDes timing. Use Value: Hardened 10G Ethernet MAC and PCS layers eliminate need for external PHY, reducing BOM count by 4 components. | Use Scenario: High-resolution waveform generation and real-time spectral analysis in vector signal analyzers. IC Role / Device Role / Timing Role: Synchronization hub managing multiple ADC/DAC channels via JESD204B subclass 1 links. Use Value: Deterministic lane alignment and multi-device sync ensure <±50 ps channel-to-channel skew across 16 RF paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 13.5M system logic cells, 128 GTY transceivers (16.3 Gb/s), 72.5 Mb BRAM, 16 nm process | Higher transceiver count and bandwidth; suited for 25G+ optical and AI training workloads | Select when >13.1 Gb/s line rates or >693K logic cells are required; requires PCB redesign due to different package (2577-pin FCBGA) |
| XC7VX980T-2FFG1927I | Same 28 nm process and FC-FBGA-1926 package; 983,040 logic cells, higher speed grade (-2), industrial temp rating | Higher logic capacity and extended temperature range; identical pinout but not drop-in due to configuration voltage differences | Choose for extended temperature operation or additional logic headroom; verify VCCINT/VCCAUX sequencing against -L2 variant |
Compared with XC7VX690T-L2FFG1926E, the XCVU13P offers higher bandwidth and density at 16 nm but demands new layout and power delivery, while the XC7VX980T provides pin-compatible logic scaling within the same package footprint but requires thermal and voltage margin validation.
Availability
XC7VX690T-L2FFG1926E is available at Aetrix Electronics and suitable for radar signal processing, high-performance computing acceleration, and 10G optical transport requiring stable component supply across long-lifecycle programs.
Supply support for XC7VX690T-L2FFG1926E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-7 family, including XC7VX690T-L2FFG1926E, was designed for high-bandwidth, low-latency compute-intensive applications such as wireless infrastructure, defense radar, and scientific instrumentation.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-L2FFG1926E?
The XC7VX690T-L2FFG1926E supports a maximum transceiver line rate of 13.1 Gb/s per GT channel. This enables compliance with PCIe Gen3, 10G Ethernet, and JESD204B subclass 1 standards. The device contains 48 GT transceivers, each configurable independently for protocols requiring deterministic latency and low bit error rates. All GTs operate within the specified thermal envelope of the XC7VX690T-L2FFG1926E under recommended cooling conditions.
Does XC7VX690T-L2FFG1926E support DDR4 memory interfaces?
Yes, XC7VX690T-L2FFG1926E supports DDR4 memory interfaces up to 1866 Mbps using its integrated memory controller. The controller implements AXI4 interface, supports ECC, and is validated for x4/x8/x16 configurations. Timing closure for DDR4 is achievable within the device's I/O bank constraints and requires adherence to AMD UG475 guidelines for board layout and termination. XC7VX690T-L2FFG1926E does not support LPDDR4 or DDR5.
What configuration modes are supported by XC7VX690T-L2FFG1926E?
XC7VX690T-L2FFG1926E supports Master SPI x4, Slave SelectMAP, and JTAG configuration modes. Master SPI x4 enables fast parallel loading from quad-SPI flash; SelectMAP allows high-speed parallel programming via microprocessor bus; JTAG supports boundary-scan testing and partial reconfiguration debugging. All modes are electrically compatible with standard configuration PROMs and do not require external level shifters for XC7VX690T-L2FFG1926E's 1.8 V or 3.3 V I/O banks.
Is XC7VX690T-L2FFG1926E pin-compatible with other Virtex-7 devices in the FFG1926 package?
XC7VX690T-L2FFG1926E shares the same FC-FBGA-1926 package footprint with other Virtex-7 devices like XC7VX485T and XC7VX980T, but pin functions are not fully interchangeable. While power and ground balls align, I/O bank assignments, transceiver locations, and configuration pins differ across variants. Migration between models requires review of UG475 pinout tables and functional validation. XC7VX690T-L2FFG1926E has unique GT placement and bank voltage requirements not replicated in lower-density variants.
What thermal management guidance applies to XC7VX690T-L2FFG1926E?
XC7VX690T-L2FFG1926E has a thermal design power (TDP) of 145 W and requires active cooling with a minimum airflow of 200 LFM and a heatsink thermal resistance ≤0.25°C/W. The device uses a thermal lid compatible with standard clip-on heatsinks. Junction temperature must remain below 100°C under worst-case operating conditions. Thermal simulation using AMD's XPE tool is recommended before final PCB layout, especially for adjacent high-power components near the XC7VX690T-L2FFG1926E thermal pad area.
XC7VX690T-L2FFG1926E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX690T-L2FFG1926E FAQ
1.How can I place an order for XC7VX690T-L2FFG1926E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-L2FFG1926E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-L2FFG1926E reliable?
The price and inventory of XC7VX690T-L2FFG1926E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-L2FFG1926E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-L2FFG1926E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-L2FFG1926E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-L2FFG1926E?
XC7VX690T-L2FFG1926E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-L2FFG1926E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-L2FFG1926E?
For technical support, including XC7VX690T-L2FFG1926E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-L2FFG1926E requirements.
6.How does Aetrix verify that XC7VX690T-L2FFG1926E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-L2FFG1926E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-L2FFG1926E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-L2FFG1926E?
All XC7VX690T-L2FFG1926E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-L2FFG1926E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-L2FFG1926E part is unused and in its original packaging.
Return procedure for XC7VX690T-L2FFG1926E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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