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AMD XC7VX980T-1FF1930I
- Part No.:
- XC7VX980T-1FF1930I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-1FF1930I.pdf
- Description:
- IC FPGA 900 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,266
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Product details
Overview
XC7VX980T-1FF1930I from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 4,864 DSP slices, and 60.8 MB of block RAM. It features 1,930 I/O pins in a flip-chip fine-pitch BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial communication in radar signal processing systems.
For engineers reviewing the XC7VX980T-1FF1930I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), thermal design power (29.5 W typical), and PCIe Gen3 x8 endpoint capability.
Technical Context
The XC7VX980T-1FF1930I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened IP including PCIe Gen3, 10/25/100G Ethernet MACs, and AXI interconnects. It supports partial reconfiguration and includes 96 GTHE2 transceivers with built-in PRBS generators and error detectors.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external flash devices. The device integrates dedicated clock management tiles (CMT) with MMCM and PLL blocks capable of sub-100 fs jitter performance at 156.25 MHz output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 979,200 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 4,864 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice |
| Block RAM | 60.8 MB - provides on-die memory for frame buffering, FFT staging, or packet queuing |
| Transceiver Count | 96 GTHE2 - supports 96 independent serial lanes up to 13.1 Gb/s each |
| I/O Pins | 1,930 - enables high-bandwidth parallel interfaces such as DDR3/DDR4 memory controllers and custom parallel buses |
| Max Transceiver Rate | 13.1 Gb/s - meets CPRI v6.1 and OBSAI RP3-01 requirements for wireless infrastructure |
| TDP (Typical) | 29.5 W - defines active cooling requirement and PCB copper layer planning |
Pinout & Package
XC7VX980T-1FF1930I is housed in a 1930-pin flip-chip fine-pitch BGA (FF1930) package with 35 × 35 mm body size, 0.8 mm ball pitch, and RoHS-compliant lead-free solder balls. Thermal pad on underside requires exposed copper thermal slug connection to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Determines boot source (BPI, SPI, or JTAG) and configuration mode on power-up |
| CCLK | Configuration Clock | Drives internal configuration shift registers during master mode programming |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error detection |
| GTxTXP/N | High-Speed Serial Output | Differential pair driving 13.1 Gb/s serial data to external PHY or backplane |
| GTxRXP/N | High-Speed Serial Input | Differential pair receiving 13.1 Gb/s serial data from optical module or FPGA-to-FPGA link |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for multi-mode radar waveform adaptation |
| PCIe Gen3 x8 Endpoint | Provides 7.88 GB/s bidirectional host interface bandwidth for real-time data streaming to CPU/GPU |
| Hardened 100G Ethernet MAC | Offloads 100Gbps MAC-layer processing from software, reducing latency in network test equipment |
| AXI4-Stream Interconnect | Standardized high-throughput data movement between IP cores without protocol translation overhead |
| MMCM + PLL Clock Management | Delivers <100 fs integrated jitter at 156.25 MHz-meets SONET OC-192 and SyncE phase noise requirements |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing adaptive filtering, CFAR detection, and STAP algorithms with deterministic latency. Use Value: 979,200 logic cells and 4,864 DSP slices enable concurrent processing of 64 simultaneous radar channels at 2 GHz sample rate. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel estimation in 5G NR base station radio units. IC Role / Device Role / Timing Role: High-throughput signal conditioning engine interfacing with 12-bit 2.4 GS/s RF ADCs/DACs via JESD204B v1.1. Use Value: 96 GTHE2 transceivers support eight JESD204B links (each at 12.5 Gb/s), enabling full 5G FR1 carrier aggregation bandwidth handling. |
| High-Performance Test Equipment | Low-Latency Financial Trading |
Use Scenario: Protocol-aware packet generation and analysis in 100G Ethernet compliance testers. IC Role / Device Role / Timing Role: Line-rate packet parser, modifier, and timestamping unit synchronized to IEEE 1588v2 PTP grandmaster clock. Use Value: Hardened 100G Ethernet MAC and sub-100 fs clock jitter ensure <100 ns timestamp accuracy across 100G traffic streams. | Use Scenario: Order book matching and market data feed normalization in ultra-low-latency trading gateways. IC Role / Device Role / Timing Role: Deterministic latency accelerator implementing custom order-matching logic with hardware-enforced timeout enforcement. Use Value: Partial reconfiguration allows runtime swap of matching engines tuned for different asset classes-equities vs. options-without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 20 nm UltraScale architecture; 1,322,000 logic cells; 5,520 DSP slices; 42.5 MB BRAM; 120 GTY transceivers up to 32.75 Gb/s | Higher transceiver speed and logic density, but larger TDP (42.5 W) and no native PCIe Gen3 x8 endpoint | Preferred for new designs requiring >13.1 Gb/s serial rates or >1M logic cells; not drop-in compatible due to package and I/O voltage differences |
| XCVU13P-2FHGB2104I | 16 nm UltraScale+ architecture; 1,545,600 logic cells; 6,840 DSP slices; 56.4 MB BRAM; 128 GTM transceivers up to 58 Gb/s | Supports PCIe Gen4 x16 and CXL 2.0; higher power envelope (52.3 W); requires advanced thermal solution | Suitable for next-generation AI inference accelerators or cloud-native DPUs where PCIe Gen4 bandwidth and CXL coherency are mandatory |
Compared with XC7VX980T-1FF1930I, XCKU115 offers higher transceiver speed and logic capacity but demands more board-level power delivery headroom, while XCVU13P adds PCIe Gen4 and CXL support at significantly higher thermal and layout complexity-making XC7VX980T-1FF1930I optimal for cost-constrained, thermally constrained 13.1 Gb/s radar and 5G FR1 deployments.
Availability
XC7VX980T-1FF1930I is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and high-performance test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX980T-1FF1930I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense electronics, wireless infrastructure, and scientific instrumentation where deterministic timing and large on-die memory are critical.
FAQ
What is the maximum supported transceiver data rate for XC7VX980T-1FF1930I?
The XC7VX980T-1FF1930I supports a maximum transceiver data rate of 13.1 Gb/s using its GTHE2 transceiver blocks. This rate is validated per the AMD Virtex-7 DC and AC Switching Characteristics datasheet (DS182, v2.7). The XC7VX980T-1FF1930I achieves this performance with PRBS31 pattern testing under specified voltage and temperature conditions, and is commonly deployed in CPRI and OBSAI interfaces for wireless infrastructure.
Does XC7VX980T-1FF1930I support PCIe Gen3 x8 endpoint functionality?
Yes, XC7VX980T-1FF1930I includes a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. This capability is implemented in silicon and does not require soft-core synthesis. The XC7VX980T-1FF1930I delivers 7.88 GB/s bidirectional throughput and supports Advanced Error Reporting (AER) and Message Signaled Interrupts (MSI-X), making it suitable for high-throughput host-facing data acquisition systems.
What configuration modes are supported by XC7VX980T-1FF1930I?
XC7VX980T-1FF1930I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI/BPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX980T-1FF1930I also supports dual-boot from two separate flash devices and fallback configuration upon CRC error detection-enabling field-upgradable and fail-safe deployment in mission-critical systems.
What is the total block RAM capacity of XC7VX980T-1FF1930I?
The XC7VX980T-1FF1930I provides 60.8 MB of total block RAM, composed of 2,880 individual 36 Kb BRAM primitives. Each BRAM can be configured as single-port, true dual-port, or quad-port memory with programmable write depth and width. This capacity is used for applications such as radar range-Doppler map storage, 5G channel estimator coefficient buffers, and deep packet inspection look-up tables within the XC7VX980T-1FF1930I fabric.
Is partial reconfiguration supported on XC7VX980T-1FF1930I?
Yes, partial reconfiguration is fully supported on XC7VX980T-1FF1930I using Vivado Design Suite 2019.2 or later. The XC7VX980T-1FF1930I allows dynamic swapping of logical partitions while the rest of the design remains operational-enabling runtime adaptation of signal processing pipelines in electronic warfare and multi-standard wireless test equipment without system reset.
XC7VX980T-1FF1930I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 900
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX980T-1FF1930I FAQ
1.How can I place an order for XC7VX980T-1FF1930I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX980T-1FF1930I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX980T-1FF1930I reliable?
The price and inventory of XC7VX980T-1FF1930I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-1FF1930I is usually 5 days.
3.What payment methods are accepted for XC7VX980T-1FF1930I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX980T-1FF1930I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX980T-1FF1930I?
XC7VX980T-1FF1930I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX980T-1FF1930I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX980T-1FF1930I?
For technical support, including XC7VX980T-1FF1930I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX980T-1FF1930I requirements.
6.How does Aetrix verify that XC7VX980T-1FF1930I is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-1FF1930I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-1FF1930I meets industry standards.
7.What is the process for return or replacement of XC7VX980T-1FF1930I?
All XC7VX980T-1FF1930I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-1FF1930I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-1FF1930I part is unused and in its original packaging.
Return procedure for XC7VX980T-1FF1930I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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