AMD XC7VX980T-1FFG1926C
- Part No.:
- XC7VX980T-1FFG1926C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-1FFG1926C.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX980T-1FFG1926C from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 5,376 DSP slices, and 60.8 MB of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -1 speed grade (1.0 ns CLB delay) in commercial temperature range.
For engineers reviewing the XC7VX980T-1FFG1926C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (700), transceiver line rate (13.1 Gb/s), thermal design power (44 W typical), and FFG1926 flip-chip BGA package compatibility with high-speed PCB routing requirements.
Technical Context
This FPGA implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and high-speed serial transceivers. It supports partial reconfiguration, AXI4 interconnect, and JTAG/ICAP configuration interfaces.
The device targets high-bandwidth signal processing and real-time protocol bridging, requiring deterministic timing closure across multi-clock domains and support for IEEE 1149.1/1149.6 boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 979,200 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 5,376 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate per slice |
| Block RAM | 60.8 MB - distributed as 36 Kb BRAM primitives for on-chip data buffering and FIFOs |
| Transceiver Max Rate | 13.1 Gb/s - supports 10GBASE-R, CPRI, and Interlaken protocols without gearbox |
| I/O Pins | 700 - selectable voltage standards (1.2–3.3 V) with source-synchronous timing support |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under commercial conditions |
| TDP | 44 W typical - informs thermal solution sizing and power delivery network design |
Pinout & Package
XC7VX980T-1FFG1926C uses a 1926-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density compute applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration circuitry, SelectIO banks, and transceiver analog bias |
| VCCO | I/O bank supply | Configurable 1.2–3.3 V per bank to match external interface voltage levels |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for high-speed serial transceiver analog circuitry |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error |
| CCLK | Configuration clock | Input clock for master SPI and JTAG configuration modes; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex logic eliminating soft-core resource usage and reducing latency by ≥300 ns |
| DDR3-1866 Memory Controller | Hardened controller supporting 2×64-bit interfaces with 12.8 GB/s peak bandwidth and built-in calibration |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset, reducing system downtime during field updates |
| AXI4 Interconnect Fabric | On-die crossbar supporting up to 128 AXI masters/slaves with QoS and atomic operation support |
| 13.1 Gb/s Transceivers | 16 GTs with integrated CDR, PRBS generator/checker, and eye diagram monitoring for link validation |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems with sub-microsecond latency constraints. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms using parallelized DSP slices and block RAM buffers. Use Value: 5,376 DSP slices enable simultaneous 4,096-point FFTs at 100 MHz clock; 13.1 Gb/s transceivers feed raw ADC data directly into processing pipeline. | Use Scenario: Multi-channel oscilloscopes capturing 12-bit samples at 5 GS/s across 16 channels with timestamp correlation. IC Role / Device Role / Timing Role: Central aggregation and preprocessing unit synchronizing ADC streams, applying decimation filters, and packing data for PCIe Gen3 host transfer. Use Value: PCIe Gen3 x8 hard IP delivers sustained 7.8 GB/s host transfer; 700 I/O pins route independent LVDS clock/data pairs to each ADC channel. |
| 5G Baseband Processing | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY acceleration in massive MIMO base stations handling 64×64 antenna arrays with real-time channel estimation. IC Role / Device Role / Timing Role: Offload accelerator for OFDM modulation/demodulation, MIMO precoding, and LDPC decoding using hardened IP and custom logic. Use Value: 979,200 logic cells implement dual-pipeline FFT/IFFT engines; DDR3-1866 controller buffers 2 ms of IQ samples at 200 MHz sampling rate. | Use Scenario: Protocol analyzers validating 25G Ethernet, CPRI, and OBSAI traffic with real-time pattern matching and error injection. IC Role / Device Role / Timing Role: Line-rate packet processor with embedded 10/25G Ethernet MACs and flexible pattern generation logic. Use Value: 16 transceivers operate simultaneously at 13.1 Gb/s; AXI4 fabric routes captured frames to on-chip BRAM for latency-critical analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | 16 nm UltraScale+ architecture; 1.5× higher DSP density (8,520 slices); lower TDP (32 W typical) | Better suited for AI inference acceleration and 100G+ networking where power efficiency matters more than legacy IP reuse | Select XCKU115 if migrating to newer process node and requiring higher throughput per watt |
| XC7VX690T-1FFG1927I | Same 28 nm Virtex-7 family; 690K logic cells; industrial temp range (-40°C to +100°C); FFG1927 package (1927-pin) | Preferred for extended-temperature avionics or downhole oil/gas equipment where reliability at extreme ambient is critical | Select XC7VX690T-1FFG1927I when operating outside commercial temperature range or needing reduced logic density for cost optimization |
Compared with XC7VX980T-1FFG1926C, the XCKU115 offers superior power efficiency and DSP throughput but requires RTL migration, while the XC7VX690T provides identical architecture with industrial qualification and slightly different pinout-making it suitable for ruggedized deployments without logic redesign.
Availability
XC7VX980T-1FFG1926C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-speed test equipment requiring stable component supply over multi-year production cycles.
Supply support for XC7VX980T-1FFG1926C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-7 family was engineered for high-throughput, low-latency signal and packet processing in infrastructure equipment, emphasizing hardened connectivity IP and scalable logic resources.
FAQ
What is the maximum supported memory interface speed for XC7VX980T-1FFG1926C?
The XC7VX980T-1FFG1926C supports DDR3-1866 memory interfaces with a maximum data rate of 1866 MT/s across dual 64-bit channels. This capability is implemented via hardened memory controller IP, enabling reliable operation with JEDEC-compliant DIMMs and discrete components while maintaining timing closure up to 933 MHz clock frequency.
Does XC7VX980T-1FFG1926C include built-in PCIe Gen3 support?
Yes, XC7VX980T-1FFG1926C integrates hardened PCIe Gen3 x8 endpoint and root complex logic. This eliminates the need for soft-core implementations, reduces latency by over 300 ns, and ensures compliance with PCI-SIG specifications without consuming programmable logic resources.
What is the thermal design power (TDP) of XC7VX980T-1FFG1926C under typical operating conditions?
The XC7VX980T-1FFG1926C has a typical thermal design power of 44 W under standard commercial operating conditions (25°C ambient, 100% logic utilization, DDR3 and transceivers active). This value guides heatsink sizing and airflow requirements in enclosed chassis environments.
Which configuration modes are supported by XC7VX980T-1FFG1926C?
XC7VX980T-1FFG1926C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Configuration can be initiated via external flash memory, host processor, or boundary-scan tools, with INIT_B and DONE pins providing status feedback during boot.
Is XC7VX980T-1FFG1926C compatible with Vivado Design Suite?
Yes, XC7VX980T-1FFG1926C is fully supported in AMD Vivado Design Suite 2018.3 and later versions. The device appears in the part selection list with complete timing models, IP catalog integration, and partial reconfiguration flow support.
XC7VX980T-1FFG1926C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX980T-1FFG1926C FAQ
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Please submit a Request for Quotation (RFQ) for XC7VX980T-1FFG1926C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX980T-1FFG1926C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-1FFG1926C is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX980T-1FFG1926C?
For technical support, including XC7VX980T-1FFG1926C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX980T-1FFG1926C requirements.
6.How does Aetrix verify that XC7VX980T-1FFG1926C is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-1FFG1926C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-1FFG1926C meets industry standards.
7.What is the process for return or replacement of XC7VX980T-1FFG1926C?
All XC7VX980T-1FFG1926C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-1FFG1926C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-1FFG1926C part is unused and in its original packaging.
Return procedure for XC7VX980T-1FFG1926C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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