AMD XC7VX980T-1FFG1926I
- Part No.:
- XC7VX980T-1FFG1926I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-1FFG1926I.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,990
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Product details
Overview
XC7VX980T-1FFG1926I from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 4,840 DSP slices, and 56.9 Mb of block RAM. It features 1,926 I/O pins in a flip-chip BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial communication in radar signal processing systems.
For engineers reviewing the XC7VX980T-1FFG1926I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal design power (39 W typical), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC7VX980T-1FFG1926I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened PCIe Gen3 x8 endpoints. It integrates 24 multi-gigabit transceivers supporting protocols including CPRI, SRIO, and 10GBASE-R.
Configuration is performed via Master SPI or SelectMAP mode using external flash or processor control. The device supports partial reconfiguration and includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 979,200 - total programmable LUT/FF pairs for complex digital logic implementation |
| DSP Slices | 4,840 - fixed-point arithmetic units with 25×18-bit multipliers and 48-bit accumulators |
| Block RAM | 56.9 Mb - distributed memory capacity usable as true dual-port RAM or FIFO buffers |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTY transceiver channel for optical interconnects |
| I/O Pins | 1,926 - user-configurable single-ended and differential I/Os with programmable drive strength |
| TDP | 39 W - typical thermal design power at full utilization, guiding heatsink and airflow requirements |
| Configuration Interface | SPIx4 / SelectMAP - determines boot source selection and programming bandwidth during startup |
Pinout & Package
XC7VX980T-1FFG1926I is housed in a 1926-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal and mechanical data comply with JEDEC MO-271AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI, BPI, or SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic timing during bitstream loading |
| DIN | Serial Data Input | Receives configuration bitstream in Master SPI mode |
| INIT_B | Initialization Status | Open-drain output indicating configuration readiness or error state |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and restarts boot sequence |
| GTYTXN/GTYTXP | Transceiver Output | Differential AC-coupled lanes supporting 13.1 Gb/s serial protocols |
| GTYRXN/GTYRXP | Transceiver Input | Differential AC-coupled lanes with built-in equalization for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime |
| PCIe Gen3 x8 Endpoint | Hard IP block compliant with PCI Express Base 3.0 specification for host interface integration |
| MMCM + PLL Clock Management | Provides jitter < 150 fs RMS and frequency synthesis across 10 MHz–810 MHz range |
| UltraScale-Compatible Architecture | Ensures migration path to newer Xilinx/AMD families with consistent toolchain and IP reuse |
| Multi-Voltage I/O Banks | Supports concurrent 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling on independent banks |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling parallel FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 4,840 DSP slices enable simultaneous 1024-point FFTs across 16 channels at 100 MHz clock rate. | Use Scenario: Offloading matrix multiplication and sparse linear algebra in edge AI inference servers. IC Role / Device Role / Timing Role: Co-processor interfacing via PCIe Gen3 x8 to host CPU, managing local DDR3/DDR4 memory subsystems. Use Value: 56.9 Mb block RAM provides on-die buffering for 32×32 tile-based GEMM operations without external DRAM access. |
| 5G Wireless Baseband | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations operating in FR1 bands. IC Role / Device Role / Timing Role: Real-time channel estimation, precoding, and OFDM modulation/demodulation engine. Use Value: 24 GTY transceivers support 24× 10.3125 Gb/s CPRI links to remote radio units. | Use Scenario: High-resolution digital oscilloscope with 10 GS/s sampling and real-time protocol decode. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and deep-pattern trigger state machine. Use Value: 1,926 I/O pins allow direct connection to 16-channel 12-bit ADCs with sub-ns skew alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, 1,053,200 logic cells, higher transceiver count (64 GTY), 2577-pin FCBGA | Better suited for multi-terabit switching and AI training acceleration requiring >1 Tb/s on-chip interconnect | Select when migrating to 16 nm node for lower static power and enhanced DSP throughput |
| XC7VX690T-1FFG1927I | Same Virtex-7 family, 693,120 logic cells, 3,600 DSP slices, identical 1927-pin FFG package footprint | Lower gate count and reduced transceiver count (16 vs. 24) limit scalability in full-bandwidth 5G baseband | Choose for cost-sensitive radar subsystems where XC7VX980T-1FFG1926I resources exceed requirements |
Compared with XC7VX690T-1FFG1927I, the XC7VX980T-1FFG1926I delivers 41% more logic cells and 33% more DSP slices while maintaining pin-compatible board layout; versus XCVU13P-2FLGA2577E, it offers proven radiation-tolerant qualification and mature toolchain support but lacks UltraScale+ memory bandwidth and PCIe Gen4 capability.
Availability
XC7VX980T-1FFG1926I is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and high-performance computing acceleration requiring stable component supply and long-term industrial temperature support (–40°C to +100°C).
Supply support for XC7VX980T-1FFG1926I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets through acquired Xilinx technology.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense, aerospace, and wired/wireless communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX980T-1FFG1926I?
The XC7VX980T-1FFG1926I supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This enables compliance with CPRI Option 10, 10GBASE-R, and SRIO Gen2 protocols. The actual achievable rate depends on PCB stackup, reference clock stability, and equalization settings configured in Vivado.
Does XC7VX980T-1FFG1926I support partial reconfiguration?
Yes, XC7VX980T-1FFG1926I fully supports partial reconfiguration through the Vivado Design Suite. This allows runtime swapping of logic modules-such as filter coefficients or protocol engines-without resetting the entire device. The feature relies on dedicated configuration logic and frame-based bitstream partitioning verified in UG909.
What configuration modes are supported by XC7VX980T-1FFG1926I?
XC7VX980T-1FFG1926I supports Master SPI (x1/x2/x4), Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPIx4 offers fastest serial boot time (~120 ms for full bitstream), while SelectMAP enables processor-driven configuration over parallel bus.
What is the thermal design power (TDP) of XC7VX980T-1FFG1926I under typical operation?
The XC7VX980T-1FFG1926I has a typical thermal design power of 39 W, measured at junction temperature of 85°C with 50% logic utilization and active transceivers. This value guides heatsink sizing and airflow requirements in conduction-cooled enclosures used in radar and telecom equipment.
Is XC7VX980T-1FFG1926I qualified for extended temperature operation?
Yes, the XC7VX980T-1FFG1926I is rated for industrial temperature range (–40°C to +100°C) and meets JESD22-A108 reliability standards. It is widely deployed in airborne radar and ground-based 5G macro base stations where ambient thermal cycling exceeds commercial-grade limits.
XC7VX980T-1FFG1926I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX980T-1FFG1926I FAQ
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The price and inventory of XC7VX980T-1FFG1926I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-1FFG1926I is usually 5 days.
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6.How does Aetrix verify that XC7VX980T-1FFG1926I is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-1FFG1926I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-1FFG1926I meets industry standards.
7.What is the process for return or replacement of XC7VX980T-1FFG1926I?
All XC7VX980T-1FFG1926I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-1FFG1926I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-1FFG1926I part is unused and in its original packaging.
Return procedure for XC7VX980T-1FFG1926I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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