AMD XC7VX980T-2FFG1926C
- Part No.:
- XC7VX980T-2FFG1926C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-2FFG1926C.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX980T-2FFG1926C from AMD is a high-performance 28 nm Virtex-7 FPGA with 980K logic cells, 4,860 DSP slices, and 56.5 Mb of block RAM; supports PCIe Gen3 x8, DDR3-1866 interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C) in demanding radar signal processing systems.
For engineers reviewing the XC7VX980T-2FFG1926C datasheet, pinout, applications, or equivalent options, key selection factors include validated transceiver performance up to 13.1 Gb/s, deterministic I/O timing across FFG1926 package, and support for partial reconfiguration in real-time adaptive systems.
Technical Context
The XC7VX980T-2FFG1926C implements a segmented architecture with 24 GTZ transceivers (13.1 Gb/s), 720 I/O pins, and dual-register LUTs enabling 6-input function capability. It integrates hardened IP including PCIe Gen3 x8 endpoint, 10 Gigabit Ethernet MAC, and AXI interconnect fabric.
Configuration occurs via Master SelectMAP or JTAG; bitstream encryption and HMAC authentication are supported. The device uses configuration memory with CRC error detection and single-event upset (SEU) mitigation through built-in scrubbing logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 980,000 - Enables complex digital signal processing pipelines with low-latency loop closure. |
| DSP Slices | 4,860 - Supports concurrent 256-tap FIR filtering and FFT computation at 400+ MHz. |
| Block RAM | 56.5 Mb - Provides on-chip buffering for multi-channel radar echo storage without external memory. |
| GTZ Transceivers | 24 × 13.1 Gb/s - Delivers deterministic serial connectivity for JESD204B-compliant ADC/DAC interfacing. |
| I/O Pins | 720 - Supports high-pin-count parallel bus interfaces (e.g., DDR3-1866 x72) with bank-wise voltage flexibility. |
| Speed Grade | -2 - Guarantees timing closure at maximum operating frequency under industrial temperature conditions. |
| Package | FFG1926 - 1926-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation in conduction-cooled modules. |
Pinout & Package
XC7VX980T-2FFG1926C is housed in a 1926-ball flip-chip BGA (FFG1926) with 1.0 mm ball pitch, thermal lid, and exposed thermal pad. Pin assignment follows Xilinx UG475 v1.14 (Virtex-7 Packaging and Pinout) with dedicated configuration, clock, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SelectMAP mode; requires 50 MHz max frequency. |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and initialization completion. |
| M0–M2 | Mode Selection Inputs | Set configuration mode (JTAG, Slave Serial, Master SelectMAP) at power-up; pulled high by internal resistors. |
| VRN/VRP | Differential Reference Pair | Provides on-die termination reference for SSTL/HSTL I/O standards in adjacent banks. |
| GTX_CLK0_M2F_P/N | Transceiver Reference Clock | Dedicated differential input for GTZ transceiver bank 200; supports 100–650 MHz range. |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping in deployed systems without full reconfiguration downtime. |
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and guarantees compliance with ECN 2.1 electrical and protocol requirements. |
| AXI4-Stream Interconnect | Provides low-latency, flow-controlled data movement between IP blocks without arbitration overhead. |
| SEU Detection & Correction | On-the-fly scrubbing corrects single-bit upsets in configuration memory, meeting DO-254 Level A requirements. |
| UltraScale-Compatible Bitstream | Allows migration path to UltraScale+ devices using same toolflow and constraints methodology. |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems with >1000 element arrays. IC Role / Device Role / Timing Role: Primary compute engine executing time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 4,860 DSP slices enable simultaneous 16-channel wideband FFTs at 200 MS/s per channel. | Use Scenario: Multi-channel oscilloscope front-end capturing 12-bit samples at 5 GS/s across 8 channels. IC Role / Device Role / Timing Role: JESD204B receiver aggregating serialized ADC streams and performing real-time decimation and trigger analysis. Use Value: 24 GTZ transceivers support 8× JESD204B lanes at 12.5 Gb/s, eliminating external serializer ICs. |
| Avionics Flight Control | Test & Measurement Equipment |
Use Scenario: Triple-modular redundant (TMR) flight control computer executing MIL-STD-1553 and ARINC 429 interfaces. IC Role / Device Role / Timing Role: Safety-critical controller implementing lockstep processor cores and hardware-based voting logic. Use Value: SEU scrubbing and HMAC-verified bitstream ensure certified fault containment per DO-254 DAL A. | Use Scenario: Modular PXIe chassis hosting reconfigurable RF signal generators and analyzers. IC Role / Device Role / Timing Role: PCIe Gen3 x8 root port bridging FPGA fabric to host CPU while managing local memory-mapped peripherals. Use Value: Hard PCIe endpoint eliminates PHY tuning and link training firmware development effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104E | 1.3M logic cells, 10.3 Gb/s GTY transceivers, 2104-ball FCBGA; higher density but no GTZ legacy support. | Targets next-gen 5G massive MIMO where higher bandwidth and lower latency are prioritized over JESD204B compatibility. | Select when migrating to UltraScale+ architecture with new board design and toolchain upgrade. |
| XC7VX690T-2FFG1927I | 690K logic cells, identical GTZ transceivers and FFG1927 package; -2I industrial grade with same pinout. | Suitable for cost-optimized radar subsystems requiring reduced DSP count and RAM capacity. | Choose for footprint-compatible down-bin option with verified thermal and signal integrity reuse. |
Compared with XC7VX980T-2FFG1926C, the XC7VX690T-2FFG1927I offers identical I/O and transceiver compatibility at lower logic density, while the XCVU13P-2FHGB2104E delivers higher throughput at the cost of architectural discontinuity and new PCB layout requirements.
Availability
XC7VX980T-2FFG1926C is available at Aetrix Electronics and suitable for radar signal processing, avionics flight control, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX980T-2FFG1926C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for high-performance embedded systems.
The Virtex-7 family was originally designed by Xilinx for compute-intensive, high-bandwidth applications such as aerospace radar, medical imaging, and wired communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX980T-2FFG1926C?
The XC7VX980T-2FFG1926C integrates GTZ transceivers rated for operation up to 13.1 Gb/s. This rate is validated per Xilinx DS182 and supports JESD204B subclass 1 and 2, as well as CPRI and OBSAI protocols. Performance is guaranteed across the full industrial temperature range when used with proper PCB stackup and reference clock jitter below 0.3 ps RMS.
Does XC7VX980T-2FFG1926C support partial reconfiguration?
Yes, XC7VX980T-2FFG1926C fully supports partial reconfiguration through Vivado Design Suite v2018.3 and later. The feature enables dynamic replacement of logical modules while the rest of the design remains operational, critical for adaptive radar waveform updates and field-upgradable test equipment firmware. Configuration security features remain active during partial bitstream loads.
What configuration modes are supported by XC7VX980T-2FFG1926C?
XC7VX980T-2FFG1926C supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Master SelectMAP allows autonomous boot from external SPI flash, while JTAG is used for debugging and programming during development. All modes support bitstream encryption and HMAC verification.
Is XC7VX980T-2FFG1926C qualified for automotive applications?
No, XC7VX980T-2FFG1926C is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for aerospace, defense, and industrial systems where extended temperature operation is required but automotive qualification is not mandated. For automotive ADAS applications, AMD recommends the Xilinx Automotive (XA) Virtex-7 variants with full AEC-Q100 Grade 2 certification.
What is the block RAM capacity of XC7VX980T-2FFG1926C?
XC7VX980T-2FFG1926C provides 56.5 Mb of total block RAM, distributed across 2,880 BRAM primitives (each 36 Kb). This capacity supports large FIR filter coefficient tables, multi-channel delay buffers, and real-time histogram accumulation in radar processing. Block RAM can be configured as true dual-port, simple dual-port, or single-port memory with byte-write enable.
XC7VX980T-2FFG1926C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX980T-2FFG1926C FAQ
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Please submit a Request for Quotation (RFQ) for XC7VX980T-2FFG1926C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX980T-2FFG1926C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-2FFG1926C is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX980T-2FFG1926C?
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6.How does Aetrix verify that XC7VX980T-2FFG1926C is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-2FFG1926C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-2FFG1926C meets industry standards.
7.What is the process for return or replacement of XC7VX980T-2FFG1926C?
All XC7VX980T-2FFG1926C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-2FFG1926C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-2FFG1926C part is unused and in its original packaging.
Return procedure for XC7VX980T-2FFG1926C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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