My Inquiry
My Account
AMD XC7VX980T-2FFG1930C
- Part No.:
- XC7VX980T-2FFG1930C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-2FFG1930C.pdf
- Description:
- IC FPGA 900 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,248
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX980T-2FFG1930C from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 4,864 DSP slices, and 56.9 Mb of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -2 speed grade with industrial temperature range (0°C to 100°C) in demanding radar signal processing systems.
For engineers reviewing the XC7VX980T-2FFG1930C datasheet, pinout, applications, or equivalent options, key selection factors include validated transceiver lane count (24 GTs), I/O voltage support (1.2 V to 3.3 V), thermal design power (245 W max), and FFG1930 flip-chip BGA package compatibility.
Technical Context
This FPGA implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/100/1000 Ethernet MAC, clock management tiles), and high-speed serial transceivers operating from 600 Mbps to 13.1 Gbps. It uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
The device includes dual 36-Kb block RAMs with true dual-port capability, distributed RAM with shift register functionality, and configuration via Master SPI, Slave Parallel, or JTAG interfaces with AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 979,200 - total configurable logic resources for complex digital signal processing pipelines |
| DSP Slices | 4,864 - fixed-point arithmetic units enabling real-time FFT, filtering, and beamforming |
| Block RAM | 56.9 Mb - on-chip memory for frame buffering, coefficient storage, and FIFO implementation |
| GT Transceivers | 24 × 13.1 Gbps - validated high-speed serial links for JESD204B ADC/DAC interfacing |
| I/O Standards | SSTL-15/18, HSTL-I/II, LVCMOS, LVDS - direct interface to DDR3, ADCs, DACs, and FMC mezzanine cards |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Configuration Security | AES-256 + HMAC - prevents unauthorized bitstream cloning and ensures firmware integrity |
Pinout & Package
XC7VX980T-2FFG1930C is housed in a 1930-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog transceiver supply | Separate 1.0 V and 1.8 V supplies required for stable GT operation up to 13.1 Gbps |
| VCCINT / VCCAUX / VCCO | Core, auxiliary, I/O supplies | Independent rail control enables mixed-voltage I/O banks (1.2–3.3 V) and low-noise core domain |
| INIT_B / PROGRAM_B / DONE | Configuration control | Active-low signals managing bitstream loading, reconfiguration, and status indication |
| CLK_IN / CLK_OUT | Global clock input/output | Dedicated clock routing paths minimize skew for multi-clock domain synchronization |
| PCIE_CLK_P/N | PCIe reference clock | Differential pair routed through dedicated clock-capable pins for Gen3 compliance |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and eliminates PHY-level timing closure risk for host interface |
| JESD204B Subclass 1 Support | Enables deterministic latency and multi-device synchronization for high-channel-count RF data converters |
| UltraScale-compatible Configuration Interface | Allows reuse of existing programming infrastructure and boundary-scan test patterns |
| Partial Reconfiguration Capability | Permits dynamic logic module swapping without system reset-critical for adaptive radar waveform updates |
| Thermal Monitoring Diode | On-die sensor feeds analog-to-digital converter for real-time junction temperature feedback and thermal throttling |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing time-critical FFT, CFAR, and beamforming kernels with deterministic latency. Use Value: 4,864 DSP slices and 24 GT lanes enable concurrent multi-beam processing and JESD204B ADC data ingestion at 4 GSPS aggregate rate. | Use Scenario: FPGA-accelerated financial risk modeling using Monte Carlo simulation on low-latency trading hardware. IC Role / Device Role / Timing Role: Co-processor offloading floating-point intensive workloads from CPU while maintaining sub-microsecond PCIe Gen3 host communication. Use Value: PCIe Gen3 x8 endpoint and 979K logic cells support custom pipeline architectures with <100 ns round-trip latency to host memory. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for 128-channel ultrasound systems requiring beam synthesis and harmonic imaging. IC Role / Device Role / Timing Role: Real-time echo signal processor handling channel aggregation, filtering, and scan conversion before display rendering. Use Value: Block RAM capacity (56.9 Mb) stores full-frame line buffers; LVDS I/O supports direct connection to high-speed ADC front-ends. | Use Scenario: Modular PXIe-based oscilloscope with 10 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: High-speed data concentrator and trigger engine synchronizing multiple ADC channels and managing DDR3 memory write bursts. Use Value: DDR3-1866 interface delivers 14.9 GB/s memory bandwidth; 24 GT transceivers route digitized waveforms to host PC over PCIe Gen3. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924E | 10 nm UltraScale+ architecture; 1.1 million logic cells; lower TDP (150 W); no native PCIe Gen3 hard IP | Better suited for power-constrained edge AI inference; requires soft PCIe core | Select when thermal budget is critical and PCIe Gen3 can be implemented in logic |
| XC7VX690T-2FFG1927I | Same 28 nm Virtex-7 family; 693,120 logic cells; 16 GT transceivers; -2I industrial grade | Lower gate count and transceiver count; identical package footprint but reduced I/O count | Choose for cost-optimized radar subsystems where full XC7VX980T capacity is unused |
Compared with XC7VX980T-2FFG1930C, the XCKU115 offers higher density and efficiency at process node advantage but sacrifices hardened PCIe Gen3, while the XC7VX690T provides pin-compatible scalability within the same family at reduced resource count and cost.
Availability
XC7VX980T-2FFG1930C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, high-performance computing acceleration, and test & measurement instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XC7VX980T-2FFG1930C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace & defense markets.
The Virtex-7 family was engineered for ultra-high-bandwidth, low-latency signal processing in mission-critical systems such as phased-array radar and next-generation communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX980T-2FFG1930C?
The XC7VX980T-2FFG1930C supports DDR3-1866 (933 MHz) with 16-bit or 32-bit data bus widths per memory controller. This is achieved using dedicated memory interface logic and calibrated I/O timing, enabling sustained bandwidth up to 14.9 GB/s per controller. The device includes four independent memory controllers, each configurable for different DDR3 configurations. XC7VX980T-2FFG1930C does not support DDR4 or LPDDR3.
Does XC7VX980T-2FFG1930C include hardened PCIe Gen3 IP?
Yes, XC7VX980T-2FFG1930C integrates a hardened PCIe Gen3 x8 Endpoint block compliant with PCI Express Base Specification v3.0. This includes physical layer (PHY), data link layer, and transaction layer logic, eliminating the need for soft-core implementation. The hardened IP supports ASPM L0s/L1, MSI/MSI-X, and ECRC generation/checking. XC7VX980T-2FFG1930C does not support PCIe Gen4 or Gen5.
What is the thermal design power (TDP) rating for XC7VX980T-2FFG1930C?
The maximum thermal design power (TDP) for XC7VX980T-2FFG1930C is 245 W under worst-case operating conditions (100% utilization, industrial temperature, -2 speed grade). This value is derived from AMD's XPE (Xilinx Power Estimator) tool using typical design constraints. Actual power consumption varies significantly based on configuration, clock frequency, and I/O activity. XC7VX980T-2FFG1930C requires active cooling and a thermally robust PCB layout with internal copper planes and thermal vias.
Can XC7VX980T-2FFG1930C be configured via JTAG only?
XC7VX980T-2FFG1930C supports JTAG configuration, but it is not the sole method. Valid configuration modes include Master SPI (x1/x2/x4), Slave Parallel (x8/x16), and JTAG. JTAG is typically used for debugging and initial programming; production systems commonly use Master SPI with external flash. XC7VX980T-2FFG1930C requires external configuration memory unless using JTAG with a host controller that streams bitstream directly.
Is XC7VX980T-2FFG1930C qualified for aerospace or automotive applications?
No, XC7VX980T-2FFG1930C is rated for industrial temperature range (0°C to 100°C) and is not officially qualified to AEC-Q100, AS9100, or ESCC standards. While used in some aerospace ground-support and radar test equipment, it lacks radiation tolerance, extended temperature screening, or automotive-grade qualification. For flight-critical or automotive ECU applications, AMD offers radiation-hardened or automotive-qualified derivatives-not XC7VX980T-2FFG1930C.
XC7VX980T-2FFG1930C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 900
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX980T-2FFG1930C FAQ
1.How can I place an order for XC7VX980T-2FFG1930C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX980T-2FFG1930C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX980T-2FFG1930C reliable?
The price and inventory of XC7VX980T-2FFG1930C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-2FFG1930C is usually 5 days.
3.What payment methods are accepted for XC7VX980T-2FFG1930C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX980T-2FFG1930C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX980T-2FFG1930C?
XC7VX980T-2FFG1930C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX980T-2FFG1930C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX980T-2FFG1930C?
For technical support, including XC7VX980T-2FFG1930C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX980T-2FFG1930C requirements.
6.How does Aetrix verify that XC7VX980T-2FFG1930C is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-2FFG1930C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-2FFG1930C meets industry standards.
7.What is the process for return or replacement of XC7VX980T-2FFG1930C?
All XC7VX980T-2FFG1930C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-2FFG1930C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-2FFG1930C part is unused and in its original packaging.
Return procedure for XC7VX980T-2FFG1930C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX980T-2FFG1930C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
