My Inquiry
My Account
AMD XC7VX980T-L2FF1926E
- Part No.:
- XC7VX980T-L2FF1926E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX980T-L2FF1926E.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,839
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX980T-L2FF1926E from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 4,800 DSP slices, and 60.8 MB of block RAM. It features 1,926 I/O pins, supports transceivers up to 13.1 Gb/s, and targets high-bandwidth data processing in radar signal conditioning systems.
For engineers reviewing the XC7VX980T-L2FF1926E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal design power (25 W typical), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC7VX980T-L2FF1926E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), hardened PCIe Gen3 x8 endpoint, and integrated 10/100/1000 Ethernet MACs. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.
Its transceiver bank includes 48 GTs operating at 13.1 Gb/s with built-in PRBS generators/checkers and adaptive equalization. Configuration occurs via dual-boot SPI flash or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 979,200 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 4,800 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice |
| Block RAM | 60.8 MB - supports large on-chip buffering for video frame storage or FFT coefficient tables |
| Transceiver Speed | 13.1 Gb/s - meets CPRI v6.1 and JESD204B subclass 1 requirements for wireless infrastructure |
| I/O Pins | 1,926 - provides high-density interconnect for multi-FPGA backplane or ADC/DAC aggregation |
| TDP | 25 W typical - defines minimum heatsink requirement and airflow specification for conduction-cooled enclosures |
| Configuration Interface | SPIx4 / SelectMAP - enables fast bitstream loading from parallel or quad-SPI flash memory |
Pinout & Package
The XC7VX980T-L2FF1926E is housed in a 1926-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. Thermal pad is exposed on underside for direct PCB thermal coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI, BPI, or JTAG) and configuration mode during power-up |
| CCLK | Configuration Clock | Drives synchronous bitstream loading from external SPI flash; frequency ≤ 100 MHz |
| DONE | Configuration Status | Open-drain output indicating successful bitstream load and device initialization |
| INIT_B | Initialization Control | Active-low signal used to reset configuration logic and clear internal state |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTY transceiver bank 0; supports 100–800 MHz range |
| VCCINT | Core Power Supply | 1.0 V ±3% supply for CLB, RAM, and routing fabric; requires low-noise regulation |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block enabling direct host CPU communication without soft-core overhead or latency penalty |
| AXI4-Stream Support | Native interface for zero-copy DMA transfers between FPGA fabric and external memory or peripherals |
| Partial Reconfiguration | Allows dynamic swapping of logic modules without resetting system timing or interrupting active data paths |
| AES-256 Bitstream Encryption | Prevents unauthorized readback or cloning of configured logic functionality in deployed systems |
| Integrated 1G Ethernet MAC | Reduces external PHY count and simplifies time-sensitive network synchronization in test equipment |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and beamforming algorithms with deterministic sub-microsecond latency. Use Value: 4,800 DSP slices enable concurrent 128-channel FFTs at 200 MS/s input rate while maintaining full pipeline utilization. | Use Scenario: Multi-channel oscilloscope front-end capturing 16-bit samples at 1 GS/s across 32 channels. IC Role / Device Role / Timing Role: Synchronizes ADC interfaces, buffers raw data in block RAM, and formats packets for PCIe Gen3 x8 upstream transmission. Use Value: 1,926 I/O pins allow direct connection to 32 × 16-bit ADCs with independent LVDS clocking and termination control. |
| Wireless Baseband Processing | Test & Measurement Equipment |
Use Scenario: Massive MIMO baseband unit handling 64×64 antenna array precoding in 5G NR TDD deployments. IC Role / Device Role / Timing Role: Implements real-time channel estimation, precoder matrix inversion, and OFDM symbol generation using hardened DSP resources. Use Value: 13.1 Gb/s GTY transceivers support 8× CPRI links to remote radio units without external retimers. | Use Scenario: Modular PXIe vector signal analyzer with real-time spectrum masking and trigger-on-event capability. IC Role / Device Role / Timing Role: Coordinates high-speed DAC/ADC sampling, performs digital down-conversion, and manages PCIe streaming to host memory. Use Value: Partial reconfiguration allows switching between 5G FR1 and FR2 measurement firmware without hardware reset or service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture; higher DSP density (5,520 slices); 16.3 Gb/s transceivers; lower static power | Better suited for AI inference acceleration and 400G Ethernet line cards where bandwidth >13 Gb/s is required | Choose XCVU13P-2FLGA2577E when migrating to 16 nm node for improved power efficiency and transceiver headroom |
| XC7VX690T-2FFG1927I | Same Virtex-7 family; 693,120 logic cells; 3,600 DSP slices; identical 1927-pin FFG package footprint | Targeted at cost-optimized radar subsystems where full 979K cell capacity is not needed | Choose XC7VX690T-2FFG1927I for legacy-compatible designs requiring reduced BoM cost and thermal envelope |
Compared with XC7VX980T-L2FF1926E, the XCVU13P-2FLGA2577E offers higher transceiver speed and lower static power but requires PCB redesign due to different package and voltage rails; the XC7VX690T-2FFG1927I shares pin compatibility and thermal profile but delivers ~29% fewer logic resources and 25% fewer DSP slices.
Availability
XC7VX980T-L2FF1926E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and wireless baseband processing requiring stable component supply across extended product lifecycles.
Supply support for XC7VX980T-L2FF1926E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Virtex-7 family was designed for demanding signal processing, high-bandwidth interconnect, and real-time deterministic computation in defense, aerospace, and communications infrastructure.
FAQ
What is the maximum transceiver data rate supported by the XC7VX980T-L2FF1926E?
The XC7VX980T-L2FF1926E supports GTY transceivers with a maximum data rate of 13.1 Gb/s. This rating is validated under standard operating conditions (junction temperature ≤ 100°C, VCCINT = 1.0 V ±3%) and complies with JESD204B subclass 1 timing requirements. The XC7VX980T-L2FF1926E achieves this speed using adaptive equalization and built-in PRBS pattern generators for link training.
Does the XC7VX980T-L2FF1926E support partial reconfiguration?
Yes, the XC7VX980T-L2FF1926E supports partial reconfiguration through its ICAP interface and hierarchical design methodology. This capability allows runtime replacement of specific logic modules without disrupting active data paths or system clocks. The XC7VX980T-L2FF1926E implements this using frame-based bitstream updates verified against CRC checksums for integrity assurance.
What configuration modes are available for the XC7VX980T-L2FF1926E?
The XC7VX980T-L2FF1926E supports master SPI, slave SPI, SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX980T-L2FF1926E also supports dual-boot operation with fallback bitstream stored in SPI flash, enabling field-upgradable firmware with fail-safe recovery.
Is bitstream encryption supported on the XC7VX980T-L2FF1926E?
Yes, the XC7VX980T-L2FF1926E includes hardware-accelerated AES-256 encryption and HMAC-SHA-256 authentication for bitstream protection. Keys are stored in battery-backed RAM or eFUSE, and decryption occurs transparently during configuration. The XC7VX980T-L2FF1926E enforces secure boot by rejecting unauthenticated bitstreams before logic initialization.
What is the thermal design power (TDP) of the XC7VX980T-L2FF1926E?
The XC7VX980T-L2FF1926E has a typical thermal design power of 25 W under representative high-activity workloads, including full DSP utilization and 48 active GTY lanes. This value assumes ambient temperature of 40°C and proper PCB thermal vias beneath the FC-FBGA package. The XC7VX980T-L2FF1926E datasheet specifies absolute maximum junction temperature as 100°C.
XC7VX980T-L2FF1926E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 76500
- Number of Logic Elements/Cells:
- 979200
- Total RAM Bits:
- 55296000
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX980T-L2FF1926E FAQ
1.How can I place an order for XC7VX980T-L2FF1926E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX980T-L2FF1926E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX980T-L2FF1926E reliable?
The price and inventory of XC7VX980T-L2FF1926E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX980T-L2FF1926E is usually 5 days.
3.What payment methods are accepted for XC7VX980T-L2FF1926E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX980T-L2FF1926E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX980T-L2FF1926E?
XC7VX980T-L2FF1926E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX980T-L2FF1926E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX980T-L2FF1926E?
For technical support, including XC7VX980T-L2FF1926E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX980T-L2FF1926E requirements.
6.How does Aetrix verify that XC7VX980T-L2FF1926E is sourced from the original manufacturer or authorized distributors?
All XC7VX980T-L2FF1926E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX980T-L2FF1926E meets industry standards.
7.What is the process for return or replacement of XC7VX980T-L2FF1926E?
All XC7VX980T-L2FF1926E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX980T-L2FF1926E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX980T-L2FF1926E part is unused and in its original packaging.
Return procedure for XC7VX980T-L2FF1926E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX980T-L2FF1926E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
