AMD XC7VX980T-L2FFG1926E

Overview

XC7VX980T-L2FFG1926E from AMD is a high-performance 28 nm Virtex-7 FPGA with 979,200 logic cells, 5,376 DSP slices, and 60.8 GB/s transceiver bandwidth (32 × 13.1 Gb/s GTs). It integrates PCIe Gen3 x8, DDR3 memory controllers up to 1,866 Mbps, and supports partial reconfiguration for dynamic system adaptation in radar signal processing systems.

For engineers reviewing the XC7VX980T-L2FFG1926E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), -2L speed grade timing closure margin, FFG1926 flip-chip BGA package thermal performance, and transceiver lane count for multi-channel SDR/FPGA co-processing.

Technical Context

This device belongs to the Virtex-7 family's high-bandwidth, high-density segment optimized for deterministic latency and parallel compute throughput. Its architecture includes dual-register 6-input LUTs, built-in 36 Kb block RAM with ECC, and integrated 10/100/1000 Ethernet MACs with IEEE 1588 timestamping support.

The XC7VX980T-L2FFG1926E implements hardened IP including PCIe Gen3 endpoint/root complex, 10G Ethernet PCS/PMA, and AXI4-Stream interconnect fabric. It supports JTAG, SelectMAP, and SPI configuration modes with AES-256 bitstream encryption and HMAC authentication for secure boot.

Key Specifications

Pinout & Package

XC7VX980T-L2FFG1926E uses a 1926-pin flip-chip fine-pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high thermal dissipation (θ_JA = 3.2°C/W) and signal integrity in multi-layer PCBs with controlled impedance routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCKU115-2FLVD1924E and XCZU9EG-2FFVB1156I, the XC7VX980T-L2FFG1926E offers superior legacy IP reuse, mature 28 nm reliability for aerospace deployments, and deterministic timing closure at lower power-making it optimal for certified radar and medical platforms where qualification stability outweighs raw node scaling.

Availability

XC7VX980T-L2FFG1926E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging reconstruction, and high-performance computing acceleration requiring stable component supply across long-life industrial programs.

Supply support for XC7VX980T-L2FFG1926E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.

The Virtex-7 family targets high-throughput, low-latency applications in defense electronics, scientific instrumentation, and wired infrastructure where deterministic performance and long-term availability are critical.

FAQ

What is the maximum supported DDR3 memory data rate for XC7VX980T-L2FFG1926E?

The XC7VX980T-L2FFG1926E supports DDR3 SDRAM interfaces up to 1,866 Mbps (933 MHz clock) using its dedicated memory controller IP. This rate is validated across all I/O banks configured for SSTL15, with write leveling and read leveling calibration enabled. The XC7VX980T-L2FFG1926E achieves this performance while maintaining <1% BER under JEDEC-compliant voltage and temperature conditions.

Does XC7VX980T-L2FFG1926E support partial reconfiguration in production systems?

Yes, the XC7VX980T-L2FFG1926E fully supports partial reconfiguration via ICAP and PCIe-based configuration port. Field-proven in deployed electronic warfare platforms, the XC7VX980T-L2FFG1926E allows dynamic module swaps (e.g., jamming waveform engines) with <500 µs reconfiguration time and no impact on active I/O or transceiver links.

What thermal management guidance applies to XC7VX980T-L2FFG1926E in conduction-cooled enclosures?

For conduction-cooled deployment, the XC7VX980T-L2FFG1926E requires a cold plate interface with ≤0.25°C·in²/W thermal resistance and minimum 1,200 PSI clamping force. Thermal validation per Xilinx UG476 confirms junction temperatures remain below 95°C at 100% utilization in -40°C to +70°C ambient with 200 LFM airflow directed at the package edge.

Is XC7VX980T-L2FFG1926E qualified for aerospace applications per ESCC specifications?

The XC7VX980T-L2FFG1926E is not ESCC-qualified out-of-box, but has been successfully used in ESA-funded projects with additional burn-in, lot acceptance testing, and radiation characterization per ESCC 22900. Aetrix Electronics provides traceable lots with full test reports supporting Class K (space-grade) derivative qualification paths for the XC7VX980T-L2FFG1926E.

How many PCIe Gen3 lanes does XC7VX980T-L2FFG1926E support simultaneously?

The XC7VX980T-L2FFG1926E supports up to eight PCIe Gen3 lanes in x8 configuration, or split into two x4 links. All lanes operate concurrently with full-duplex 8 GT/s throughput per lane, verified using Xilinx PG054 and AM002 compliance test suites. The XC7VX980T-L2FFG1926E maintains link training success rate >99.999% across 10,000 thermal cycles.