AMD XC7Z045-2FBG676E

Overview

XC7Z045-2FBG676E from AMD is a dual-core ARM Cortex-A9 MPCore system-on-chip (SoC) with integrated 45K logic-cell Artix-7 FPGA fabric, 2GB DDR3 memory interface, and 28nm process technology. It supports industrial temperature range (–40°C to +100°C), operates at 1.0V core voltage, and delivers up to 2.6 DMIPS/MHz per CPU core. It is used in real-time industrial control systems requiring deterministic processing and hardware-accelerated I/O.

For engineers reviewing the XC7Z045-2FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include PS/PL interface bandwidth, programmable logic resource count, thermal performance in sealed enclosures, and support for dual-boot QSPI flash configurations.

Technical Context

The XC7Z045-2FBG676E integrates a hardened ARM Cortex-A9 MPCore processor subsystem with NEON and VFPv3 extensions, coupled to a fully independent Artix-7 FPGA fabric via AXI-based high-bandwidth interconnects. It includes dedicated PS peripherals: two GEM Gigabit Ethernet controllers, two USB 2.0 OTG ports, and dual SD/SDIO/MMC interfaces.

FPGA fabric features 44,400 logic cells, 220 DSP slices, and 4.9 Mb of block RAM, all accessible through AXI GP/HP/ACP slave/master ports. The device supports partial reconfiguration and JTAG-based debug across both PS and PL domains.

Key Specifications

Pinout & Package

XC7Z045-2FBG676E uses a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and thermal-enhanced construction for industrial thermal management. Pin functions are partitioned into PS (Processing System) banks (MIO, DDR, GigE, USB) and PL (Programmable Logic) banks (HR, HP I/O).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous SoC applications.

Compared with XC7Z045-2FBG676E, the XC7Z030-2FBG484I trades PL capacity for lower cost and footprint, while the XC7Z045-2FFG900E retains full resources but increases PCB area and I/O flexibility-neither is pin-compatible, requiring layout revision.

Availability

XC7Z045-2FBG676E is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and test & measurement equipment requiring stable component supply across long product lifecycles.

Supply support for XC7Z045-2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and edge applications.

The Zynq-7000 family, including XC7Z045-2FBG676E, was engineered to unify software programmability with hardware adaptability for real-time embedded systems demanding both deterministic processing and customizable acceleration.

FAQ

What is the maximum DDR3 data rate supported by XC7Z045-2FBG676E?

The XC7Z045-2FBG676E supports DDR3L memory at data rates up to 1066 Mbps (533 MHz clock). This is achieved using its dedicated DDR3 memory controller with 16-bit or 32-bit bus widths, on-die termination, and programmable read/write leveling. The controller complies with JEDEC DDR3L-1066 specifications and requires proper PCB layout with matched trace lengths and controlled impedance. XC7Z045-2FBG676E's memory interface is validated for use with industrial-grade DDR3L components operating across the full temperature range.

Does XC7Z045-2FBG676E support JTAG debugging for both PS and PL domains?

Yes, XC7Z045-2FBG676E supports unified JTAG debugging across both Processing System (PS) and Programmable Logic (PL) domains via a single TAP controller. Debug tools such as Xilinx Vivado and SDK can access ARM CoreSight debug infrastructure for CPU-level breakpoints and trace, while simultaneously performing PL-level configuration, boundary-scan testing, and ILA (Integrated Logic Analyzer) probe insertion. XC7Z045-2FBG676E's JTAG chain includes dedicated IDCODE and BYPASS registers for each domain, enabling selective access without domain interference.

Can XC7Z045-2FBG676E boot directly from QSPI flash without external configuration devices?

Yes, XC7Z045-2FBG676E supports primary boot from single or dual QSPI flash devices without external PROM or configuration ICs. Its boot ROM implements Quad-SPI mode with 4-line data transfer, supporting up to 128 MB address space and configurable boot modes (single, dual parallel, or dual stacked). The XC7Z045-2FBG676E also supports secure boot with AES-256 decryption and SHA-256 authentication when enabled via eFUSE programming, ensuring trusted firmware loading.

What I/O standards are supported on XC7Z045-2FBG676E's HR I/O banks?

XC7Z045-2FBG676E's HR (High-Range) I/O banks support LVCMOS 1.2V/1.5V/1.8V/2.5V/3.3V, LVTTL, PCI, and SSTL15/SSTL18 I/O standards with programmable drive strength, slew rate, and on-die termination. These banks operate up to 500 Mbps in single-ended mode and 1.25 Gbps in differential mode (LVDS, BLVDS, RSDS). XC7Z045-2FBG676E's HR banks are electrically isolated from HP banks and require separate VCCO supply per bank for mixed-voltage interface design.

Is partial reconfiguration supported on XC7Z045-2FBG676E, and what tools enable it?

Yes, XC7Z045-2FBG676E supports runtime partial reconfiguration (PR) of the Artix-7 FPGA fabric without resetting the ARM processor subsystem. PR is enabled using Xilinx Vivado Design Suite with PR-specific constraints, checkpoint-based flow, and ICAP (Internal Configuration Access Port) control. XC7Z045-2FBG676E's configuration logic allows dynamic loading of encrypted or unencrypted partial bitstreams into designated PL regions while PS continues executing Linux or bare-metal code-verified in industrial motion control and adaptive radio applications.