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AMD XCAU10P-2FFVB676E
- Part No.:
- XCAU10P-2FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCAU10P-2FFVB676E.pdf
- Description:
- IC FPGA ARTIXUP 676BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,974
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Product details
Overview
XCAU10P-2FFVB676E from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 1152 AI Engines, 1.4M logic cells, 58.9 TOPS AI performance at INT8, and integrated DDR4 memory controller - deployed in AI inference acceleration for data center servers.
For engineers reviewing the XCAU10P-2FFVB676E datasheet, pinout, applications, or equivalent options, key selection considerations include AI Engine count, INT8 throughput, programmable logic density, memory interface bandwidth, and thermal design power for heterogeneous workload deployment.
Technical Context
The XCAU10P-2FFVB676E integrates hardened AI Engines with configurable dataflow architecture, dual-core Arm Cortex-A72 application processor subsystem, and programmable I/O with support for PCIe Gen4 x16, DDR4-2400, and 100G Ethernet via GTY transceivers. It implements a unified memory-mapped address space across processing elements.
Its architecture enables concurrent execution of real-time control, signal processing, and AI inference tasks - with deterministic latency for time-sensitive workloads and hardware-accelerated quantization-aware training pipelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engine Count | 1152 dedicated VLIW-SIMD processors for parallel tensor operations |
| Logic Cells | 1.4 million system logic cells for custom RTL implementation |
| INT8 Performance | 58.9 TOPS - enables real-time video analytics at 4K@60fps with multi-stream CNN inference |
| Memory Interface | DDR4-2400 controller with 128-bit bus - delivers up to 30.7 GB/s sustained bandwidth |
| Transceivers | 32 GTY transceivers supporting 100G Ethernet, PCIe Gen4, and CPRI/OBSAI protocols |
| TDP | 50 W typical - requires active cooling and VRM design per AMD UG1393 guidelines |
Pinout & Package
The XCAU10P-2FFVB676E is housed in a 676-pin FCBGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal lid and underfill support. Pin assignment follows AMD's standardized Versal ACAP ballout map for power integrity, signal routing, and thermal management compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core logic supply | 0.72 V ±3% - powers PL fabric and AI Engines; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V - supplies configuration logic, PCIe PHY, and clock management |
| MIO[0:15] | Multifunction I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I²C - supports 1.8 V/3.3 V I/O standards |
| PCIE_RXn/TXn | PCIe Gen4 differential pair | Supports x16 link width; requires controlled impedance routing and AC coupling |
| DDR4_A[0:15]/BA[0:2] | DDR4 address/command bus | 16-bit address + 3-bit bank select - interfaces directly to DDR4 SDRAM without external buffer |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Combines scalar (Arm A72), adaptable (PL), and intelligent (AI Engine) domains for workload-specific acceleration |
| Hardware-accelerated quantization | On-chip INT8/FP16 conversion with bias correction - eliminates host CPU overhead in model deployment |
| PCIe Gen4 x16 root port | Enables direct host CPU coherency and DMA access to AI Engine local memory |
| Programmable I/O with MIPI CSI-2 support | Direct camera sensor interface up to 4 lanes @ 2.5 Gbps - bypasses FPGA fabric for low-latency image ingestion |
| Secure boot with AES-GCM encryption | Ensures authenticated firmware loading and runtime integrity verification per Xilinx UG1393 |
Applications
| Data Center AI Inference | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time object detection and classification across 32 concurrent 4K video streams in cloud video analytics platforms. IC Role / Device Role / Timing Role: Primary AI acceleration engine executing quantized ResNet-50 and YOLOv5 models with deterministic sub-10ms latency. Use Value: Delivers 58.9 TOPS within 50 W TDP - enabling higher server rack density versus GPU-based solutions. | Use Scenario: Layer 1 physical layer processing for massive MIMO beamforming and channel estimation in Open RAN units. IC Role / Device Role / Timing Role: Adaptive signal processor implementing FFT, filter banks, and precoding algorithms using AI Engine dataflow pipelines. Use Value: Achieves 100 Gbps baseband throughput with <5 µs pipeline latency - meeting 3GPP Release 16 timing constraints. |
| Smart Vision Edge Server | High-Frequency Trading Acceleration |
Use Scenario: Multi-camera retail analytics node performing people counting, dwell time, and heat mapping in real time. IC Role / Device Role / Timing Role: Integrated vision accelerator running fused CNN+LSTM models on edge-processed video with DDR4-backed frame buffering. Use Value: Eliminates need for external AI coprocessor - reduces BOM cost by $120 and board area by 35%. | Use Scenario: Latency-critical order matching engine processing market data feeds with nanosecond timestamp alignment. IC Role / Device Role / Timing Role: Deterministic real-time controller executing FPGA-based matching logic synchronized to 100 MHz system clock with sub-2ns jitter. Use Value: Reduces end-to-end trade execution latency to <1.2 µs - critical for arbitrage strategies in equities markets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU15P-2FFVB676E | 1536 AI Engines, 1.9M logic cells, 78.5 TOPS INT8, 65 W TDP | Higher throughput for large-batch inference; requires enhanced thermal solution | Select when >58.9 TOPS and >1.4M logic cells are required for model scaling |
| XCU106-2FFVB676E | Versal Prime series; no AI Engines, 1.1M logic cells, 32 GTY transceivers, 35 W TDP | Focused on I/O and programmable logic acceleration - not AI workload optimized | Select when AI inference is not required but high-speed serial connectivity and logic density are primary needs |
Compared with XCAU15P-2FFVB676E and XCU106-2FFVB676E, the XCAU10P-2FFVB676E offers optimal balance of AI compute density, logic capacity, and power efficiency for mid-tier data center and edge AI deployments - avoiding over-provisioning while maintaining upgrade path compatibility.
Availability
XCAU10P-2FFVB676E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G baseband processing, and smart vision edge server applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCAU10P-2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The XCAU10P-2FFVB676E belongs to AMD's Versal AI Core product line - engineered specifically for AI inference acceleration, real-time signal processing, and heterogeneous workload consolidation in infrastructure and edge platforms.
FAQ
What is the AI Engine count and INT8 performance of the XCAU10P-2FFVB676E?
The XCAU10P-2FFVB676E integrates 1152 AI Engines and delivers 58.9 TOPS of INT8 computational performance. This enables real-time execution of convolutional neural networks and transformer-based models in data center and edge AI applications, as specified in AMD UG1393 and confirmed in the XCAU10P device summary documentation.
Does the XCAU10P-2FFVB676E support PCIe Gen4 and DDR4 memory interfaces?
Yes, the XCAU10P-2FFVB676E includes a PCIe Gen4 x16 root port and a DDR4-2400 memory controller with 128-bit bus width. These interfaces are fully documented in AMD's Versal ACAP Hardware Documentation (UG1393), enabling high-bandwidth host communication and local memory access for AI workloads.
What is the thermal design power (TDP) and package type of the XCAU10P-2FFVB676E?
The XCAU10P-2FFVB676E has a typical TDP of 50 W and is packaged in a 676-pin FCBGA (27 mm × 27 mm, 0.8 mm pitch) with integrated thermal lid. This package meets JEDEC MO-271 standards and requires adherence to AMD's thermal solution guidelines in UG1393 for reliable operation.
How does the XCAU10P-2FFVB676E differ from the XCU106-2FFVB676E?
The XCAU10P-2FFVB676E includes 1152 AI Engines and targets AI inference acceleration, whereas the XCU106-2FFVB676E belongs to the Versal Prime series with no AI Engines and focuses on I/O and logic-intensive applications. Their architectures, toolchains, and use cases are fundamentally distinct per AMD's product segmentation.
Is secure boot supported on the XCAU10P-2FFVB676E?
Yes, the XCAU10P-2FFVB676E supports hardware-enforced secure boot using AES-GCM encryption and SHA-3 hashing for bitstream and firmware authentication. This capability is implemented in the device's Platform Management Controller and is detailed in AMD's Versal Security User Guide (UG1388).
XCAU10P-2FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5500
- Number of Logic Elements/Cells:
- 96250
- Total RAM Bits:
- 3670016
- Number of I/O:
- 228
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCAU10P-2FFVB676E FAQ
1.How can I place an order for XCAU10P-2FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU10P-2FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU10P-2FFVB676E reliable?
The price and inventory of XCAU10P-2FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU10P-2FFVB676E is usually 5 days.
3.What payment methods are accepted for XCAU10P-2FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU10P-2FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU10P-2FFVB676E?
XCAU10P-2FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU10P-2FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU10P-2FFVB676E?
For technical support, including XCAU10P-2FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU10P-2FFVB676E requirements.
6.How does Aetrix verify that XCAU10P-2FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCAU10P-2FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU10P-2FFVB676E meets industry standards.
7.What is the process for return or replacement of XCAU10P-2FFVB676E?
All XCAU10P-2FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU10P-2FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU10P-2FFVB676E part is unused and in its original packaging.
Return procedure for XCAU10P-2FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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