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AMD XCAU10P-2FFVB676I
- Part No.:
- XCAU10P-2FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCAU10P-2FFVB676I.pdf
- Description:
- IC FPGA ARTIXUP 676BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,883
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Product details
Overview
XCAU10P-2FFVB676I from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 1152 AI Engines, 1.4M logic cells, and integrated DDR4/DDR5 memory controllers. It targets AI inference at the edge with real-time processing for vision analytics and low-latency sensor fusion.
For engineers reviewing the XCAU10P-2FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, PL logic capacity, memory interface bandwidth, thermal design power (TDP), and package I/O voltage compatibility.
Technical Context
The XCAU10P-2FFVB676I implements a heterogeneous architecture integrating Scalar Engines (ARM Cortex-A72), Adaptable Engines (FPGA fabric), and Intelligent Engines (AI Engines). It supports PCIe Gen4 x16, 400G Ethernet via 8×50G PAM4 transceivers, and dual 32-bit DDR4/DDR5 interfaces up to 3200 MT/s.
Configuration occurs via quad-SPI flash or JTAG, with secure boot enforced by hardware root-of-trust. The device operates across -40°C to +100°C junction temperature and requires multi-rail power delivery including 0.8V core, 0.9V AI Engine, and 1.2V I/O supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engines | 1152 units delivering 23 TOPS INT8 peak AI performance for real-time neural network inference |
| Logic Cells | 1.4 million LUTs enabling complex programmable logic implementation in the adaptable engine |
| Memory Interface | Dual-channel DDR4/DDR5 supporting up to 3200 MT/s; enables high-bandwidth data streaming for AI workloads |
| Transceivers | 8×50G PAM4 SerDes supporting 400G Ethernet or 8×PCIe Gen4 lanes |
| TDP | 45 W typical; defines thermal solution sizing and cooling requirements for sustained operation |
| Operating Temp | -40°C to +100°C junction; qualifies for industrial and automotive under-hood applications |
Pinout & Package
Package: 676-pin FCBGA (Fine-Pitch Chip Scale Ball Grid Array), 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.8 V to programmable logic and AI Engines; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 0.9 V to configuration logic, PCIe PHY, and clock management circuitry |
| VCCO_DDR | DDR I/O power | Delivers 1.2 V to DDR4/DDR5 interface pins; must meet tight voltage tolerance for signal integrity |
| MGTAVCC | Transceiver analog supply | Supplies 0.9 V to high-speed SerDes analog blocks; critical for jitter performance |
| PROGRAM_B | Configuration enable | Active-low input initiating bitstream load from external flash or JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Combines scalar, adaptable, and intelligent engines on single die to accelerate diverse workloads without off-chip data movement |
| Hardware root-of-trust | Enables secure boot, authenticated configuration, and encrypted bitstream loading to prevent IP theft and tampering |
| 400G Ethernet support | Integrated 8×50G PAM4 transceivers eliminate need for external retimers or MAC/PHY chips in high-speed networking designs |
| Real-time AI inference | 1152 AI Engines deliver deterministic latency <100 µs for vision pipeline stages like object detection and classification |
Applications
| Autonomous Mobile Robots | Smart Surveillance Systems |
|---|---|
Use Scenario: Real-time SLAM, obstacle avoidance, and path planning using multi-sensor fusion (LiDAR, IMU, camera). IC Role / Device Role / Timing Role: Central adaptive compute unit executing AI models, sensor preprocessing, and control loop timing with sub-millisecond determinism. Use Value: 1152 AI Engines process CNN-based perception models while FPGA fabric handles time-critical motor control, reducing system latency by >40% vs. CPU+GPU solutions. | Use Scenario: Multi-camera video analytics with simultaneous person detection, facial recognition, and behavior analysis. IC Role / Device Role / Timing Role: On-device AI accelerator managing parallel video streams, DDR5 buffering, and PCIe Gen4 upload to host server. Use Value: Dual DDR5 channels sustain 51.2 GB/s memory bandwidth required for 16×1080p@30fps decode + inference without frame drops. |
| Industrial Predictive Maintenance | 5G Baseband Processing |
Use Scenario: Vibration and acoustic signature analysis of rotating machinery using edge-deployed ML models. IC Role / Device Role / Timing Role: Adaptive engine running FFT and feature extraction; AI engine performing anomaly classification with <5 ms end-to-end latency. Use Value: 45 W TDP enables fanless enclosure integration in factory-floor cabinets where thermal constraints prohibit active cooling. | Use Scenario: Layer 1 PHY acceleration and flexible numerology handling for O-RAN compliant small cell units. IC Role / Device Role / Timing Role: Programmable fabric implements configurable FFT/iFFT and channel estimation; AI engines optimize beamforming weights in real time. Use Value: 8×50G PAM4 transceivers directly interface with fronthaul optics, eliminating external gearbox ICs and reducing BOM cost by ~$12/unit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU15P-2FFVB676I | Higher AI Engine count (1600), larger logic capacity (2.1M LUTs), same package and pinout | Better suited for large transformer-based models requiring >30 TOPS INT8 | Select when additional AI throughput and logic headroom justify higher TDP (65 W) |
| XCU10P-2FFVB676I | No AI Engines; 1.1M LUTs, identical FPGA fabric and I/O, lower TDP (35 W) | Targeted at non-AI programmable logic applications such as protocol bridging or packet processing | Choose when AI acceleration is unnecessary and power budget is constrained |
Compared with XCAU15P-2FFVB676I and XCU10P-2FFVB676I, the XCAU10P-2FFVB676I delivers optimal balance of AI performance, logic density, and thermal envelope for mid-tier edge inference-enabling deployment where 23 TOPS suffices and 45 W cooling is feasible.
Availability
XCAU10P-2FFVB676I is available at Aetrix Electronics and suitable for autonomous robotics, smart city infrastructure, and industrial edge AI applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCAU10P-2FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, embedded, and client markets.
The Versal AI Core series-including XCAU10P-2FFVB676I-is engineered specifically for AI inference at the edge, combining AI Engines, adaptable logic, and scalar processors to replace discrete CPU+FPGA+ASIC architectures.
FAQ
What is the maximum supported DDR5 speed for XCAU10P-2FFVB676I?
The XCAU10P-2FFVB676I supports DDR5 up to 3200 MT/s across dual 32-bit channels. This speed is validated per JEDEC DDR5-3200 specification and enables 51.2 GB/s aggregate memory bandwidth. System-level timing closure requires adherence to AMD's published PCB layout guidelines for DDR5 routing, termination, and power delivery. The XCAU10P-2FFVB676I does not support DDR5 speeds beyond 3200 MT/s.
Does XCAU10P-2FFVB676I support PCIe Gen5?
No, the XCAU10P-2FFVB676I supports PCIe Gen4 x16 only, not PCIe Gen5. Its integrated hard IP complies with the PCI Express Base Specification Revision 4.0. While the transceivers are capable of 50G PAM4 operation, PCIe functionality is limited to Gen4 signaling rates (16 GT/s). For PCIe Gen5 designs, engineers must consider newer Versal series devices explicitly rated for Gen5 compliance.
What thermal solution is recommended for XCAU10P-2FFVB676I at full load?
A heatsink with minimum 1.2°C/W thermal resistance and forced airflow ≥2 CFM is recommended for XCAU10P-2FFVB676I operating at its 45 W typical TDP. AMD specifies a maximum case temperature of 95°C under continuous load. The XCAU10P-2FFVB676I includes on-die thermal sensors and dynamic thermal management logic that throttles AI Engine clocks if junction exceeds 100°C. Thermal interface material must be applied uniformly beneath the integrated lid.
Can XCAU10P-2FFVB676I be configured via JTAG only, without external flash?
Yes, the XCAU10P-2FFVB676I supports full configuration via JTAG boundary-scan without external flash. This mode is used for debugging, prototyping, and secure programming in trusted environments. However, JTAG-only configuration does not persist after power cycle unless combined with a secure bitstream encryption scheme and external key storage. For production, quad-SPI flash remains the standard boot method for XCAU10P-2FFVB676I.
Is XCAU10P-2FFVB676I pin-compatible with XCU10P-2FFVB676I?
Yes, the XCAU10P-2FFVB676I is pin-compatible with the XCU10P-2FFVB676I-both use identical 676-pin FCBGA packaging, ball map, and I/O voltage assignments. This allows board reuse when upgrading from FPGA-only to AI-accelerated functionality. However, power delivery must be revised to accommodate the XCAU10P-2FFVB676I's higher core and AI Engine rail currents.
XCAU10P-2FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5500
- Number of Logic Elements/Cells:
- 96250
- Total RAM Bits:
- 3670016
- Number of I/O:
- 228
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCAU10P-2FFVB676I FAQ
1.How can I place an order for XCAU10P-2FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU10P-2FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU10P-2FFVB676I reliable?
The price and inventory of XCAU10P-2FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU10P-2FFVB676I is usually 5 days.
3.What payment methods are accepted for XCAU10P-2FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU10P-2FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU10P-2FFVB676I?
XCAU10P-2FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU10P-2FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU10P-2FFVB676I?
For technical support, including XCAU10P-2FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU10P-2FFVB676I requirements.
6.How does Aetrix verify that XCAU10P-2FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCAU10P-2FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU10P-2FFVB676I meets industry standards.
7.What is the process for return or replacement of XCAU10P-2FFVB676I?
All XCAU10P-2FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCAU10P-2FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU10P-2FFVB676I part is unused and in its original packaging.
Return procedure for XCAU10P-2FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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