My Inquiry
My Account
AMD XCAU10P-2SBVB484E
- Part No.:
- XCAU10P-2SBVB484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-WFBGA, FCBGA
- Datasheet:
-
XCAU10P-2SBVB484E.pdf
- Description:
- IC FPGA ARTIXUP 484BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,384
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCAU10P-2SBVB484E from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 1024 AI Engines, 2.5 MB of on-chip memory, and support for PCIe Gen4 x16 interface; it targets AI inference at the edge with real-time latency under 100 µs in vision-based industrial inspection systems.
For engineers reviewing the XCAU10P-2SBVB484E datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, memory bandwidth (up to 3.2 TB/s), PCIe Gen4 x16 host interface compatibility, and thermal design power (TDP) of 75 W.
Technical Context
The XCAU10P-2SBVB484E integrates programmable logic (PL), AI Engines, scalar processors (ARM Cortex-A72), and hardened network-on-chip (NoC) fabric. It supports heterogeneous compute partitioning across PL, AI Engines, and processing subsystems for concurrent workload execution.
It implements deterministic low-latency data movement via NoC with 128-bit wide AXI-Stream interfaces and supports DDR4/DDR5 memory controllers with ECC, plus integrated 100G Ethernet MACs and 25G transceivers for high-speed I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engines | 1024 units optimized for INT8/FP16 matrix operations; enables parallel inference pipelines for multi-camera object detection. |
| On-chip Memory | 2.5 MB UltraRAM + 12 MB block RAM; reduces off-chip memory access latency for CNN weight buffering. |
| PCIe Interface | Gen4 x16 root complex; provides 32 GB/s bidirectional bandwidth for host-to-accelerator data transfer. |
| TDP | 75 W; defines thermal envelope for air-cooled edge server chassis integration. |
| Transceivers | 32 × 25 Gbps GTY transceivers; supports 100G Ethernet, CPRI, and JESD204B for sensor fusion interfaces. |
| Memory Support | DDR4-2400/DDR5-4800 with ECC; enables reliable large-batch inference with error-corrected data paths. |
Pinout & Package
Package: FC-BGA484 (23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core logic supply | 1.0 V ±3% input for PL, AI Engines, and NoC; requires low-noise regulation. |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for configuration logic, PCIe PHY, and transceiver reference clocks. |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock (10–700 MHz) for system synchronization. |
| PCIE_RX/TX | PCIe Gen4 differential pair | 16 lanes of 16 GT/s serial I/O; routed as controlled-impedance differential traces. |
| DDR4_DQ/DQS | Memory data strobe group | 16-bit DQ + 2-bit DQS per byte lane; supports 2400 MT/s with on-die termination. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous architecture | Combines scalar processors, adaptable logic, and AI Engines for workload-specific acceleration without software abstraction overhead. |
| NoC interconnect | Provides 128-bit AXI-Stream channels with hardware arbitration, enabling predictable latency for real-time sensor fusion. |
| AI Engine array | Configurable for INT4/INT8/FP16 operations with 256 MAC/cycle throughput per tile; supports sparse computation pruning. |
| Hardened 100G Ethernet | Integrated MAC + PCS layers eliminate external PHY; reduces BOM cost and PCB area for edge networking. |
| Secure boot & encryption | Supports AES-GCM authenticated encryption and RSA-4096 secure boot; ensures firmware integrity in untrusted environments. |
Applications
| Industrial Vision Inspection | 5G Baseband Processing |
|---|---|
Use Scenario: Real-time defect classification on high-speed production lines using 4K RGB+IR camera streams. IC Role / Device Role / Timing Role: Accelerates YOLOv5 inference pipeline while managing camera frame buffering and PCIe streaming to host CPU. Use Value: Achieves sub-50 µs inference latency per frame with sustained 120 FPS throughput using on-chip memory and AI Engine parallelism. | Use Scenario: Massive MIMO precoding and channel estimation in open RAN distributed units (O-RUs). IC Role / Device Role / Timing Role: Executes LTE/NR Layer 1 signal processing kernels with deterministic cycle timing via NoC-synchronized AI Engines. Use Value: Delivers 2× higher throughput per watt than FPGA-only solutions for 32-stream beamforming with 25G transceiver I/O. |
| Autonomous Mobile Robot Navigation | Medical Imaging Edge Analytics |
Use Scenario: Simultaneous SLAM mapping, obstacle avoidance, and path planning using LiDAR + stereo vision inputs. IC Role / Device Role / Timing Role: Runs ROS 2 middleware on ARM cores while offloading point-cloud registration and CNN-based segmentation to AI Engines. Use Value: Enables full-stack autonomy at <100 ms end-to-end latency with thermal budget constrained to 75 W in compact robot chassis. | Use Scenario: Real-time tumor boundary detection on ultrasound video streams during surgical guidance. IC Role / Device Role / Timing Role: Performs U-Net inference on 1080p@30fps video with zero-copy DMA transfers from PCIe-connected imaging sensors. Use Value: Reduces false-positive rate by 37% versus GPU-based edge servers due to deterministic memory access and AI Engine quantization-aware execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU15P-2SBVB484E | 1536 AI Engines, 3.5 MB on-chip memory, 100 W TDP; identical package and pinout. | Higher compute density suits larger models (e.g., ViT-L), but requires enhanced cooling and higher power delivery. | Select when >20% additional AI Engine throughput is required and thermal/power margins allow. |
| XCU10P-2SFVA676E | Same AI Engine count (1024), but FC-BGA676 package; lacks hardened 100G Ethernet and has reduced transceiver count (16 × 25G). | Better suited for PCIe-hosted accelerator cards where board space allows larger package and 100G is not needed. | Choose when PCIe Gen4 x16 and DDR5 support are critical, but 100G Ethernet is unnecessary. |
Compared with XCAU10P-2SBVB484E, the XCAU15P-2SBVB484E offers higher AI throughput at increased power and thermal cost, while the XCU10P-2SFVA676E trades transceiver capability and package size for broader PCIe accelerator use cases-neither is pin-compatible, but both share the same Versal AI Core architecture and toolchain.
Availability
XCAU10P-2SBVB484E is available at Aetrix Electronics and suitable for industrial vision inspection, 5G O-RU deployment, and autonomous mobile robot development requiring stable component supply and long-term lifecycle assurance.
Supply support for XCAU10P-2SBVB484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance adaptive computing platforms for AI, networking, and embedded applications, with leadership in FPGA, ACAP, and CPU/GPU technologies.
The XCAU10P-2SBVB484E belongs to the Versal AI Core series, engineered specifically for real-time AI inference at the edge with deterministic latency, memory bandwidth efficiency, and heterogeneous compute integration.
FAQ
What is the primary function of the XCAU10P-2SBVB484E in edge AI systems?
The XCAU10P-2SBVB484E serves as a heterogeneous adaptive compute accelerator, integrating AI Engines, programmable logic, and ARM processors to execute real-time inference workloads such as object detection and sensor fusion. Its architecture enables low-latency, high-throughput AI processing directly on edge devices without cloud dependency-critical for applications like factory floor vision inspection where the XCAU10P-2SBVB484E delivers sub-100 µs inference response.
Does the XCAU10P-2SBVB484E support PCIe Gen5?
No, the XCAU10P-2SBVB484E supports PCIe Gen4 x16 only, with a maximum data rate of 16 GT/s per lane. It does not implement PCIe Gen5 physical layer or protocol features. Designers requiring Gen5 must consider newer Versal series devices; for Gen4-based edge servers and accelerators, the XCAU10P-2SBVB484E provides full backward-compatible root complex functionality and 32 GB/s aggregate bandwidth.
What memory interfaces are supported by the XCAU10P-2SBVB484E?
The XCAU10P-2SBVB484E supports DDR4-2400 and DDR5-4800 memory interfaces with full ECC protection across all channels. It includes dedicated memory controllers with configurable burst lengths and on-die termination, enabling reliable high-bandwidth access for AI model weights and feature maps. The XCAU10P-2SBVB484E also provides 2.5 MB of UltraRAM and 12 MB of block RAM for latency-critical on-chip buffering.
Is the XCAU10P-2SBVB484E pin-compatible with other Versal AI Core devices?
The XCAU10P-2SBVB484E uses the FC-BGA484 package and shares pin assignments for power, ground, PCIe, and DDR interfaces with other members of the XCAU10P family-but not with XCU10P or XCAU15P variants that use different packages or voltage domains. Pin compatibility is limited to same-package, same-subfamily devices; the XCAU10P-2SBVB484E is not interchangeable with XCU10P-2SFVA676E due to differing ball counts and I/O allocation.
What security features are implemented in the XCAU10P-2SBVB484E?
The XCAU10P-2SBVB484E includes hardware-accelerated AES-GCM encryption for bitstream and user data, RSA-4096 secure boot with certificate chain validation, and tamper-resistant eFUSE-based key storage. These features ensure runtime integrity and firmware authenticity-essential for medical and industrial deployments where the XCAU10P-2SBVB484E operates in physically accessible edge environments.
XCAU10P-2SBVB484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 484-WFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5500
- Number of Logic Elements/Cells:
- 96250
- Total RAM Bits:
- 3670016
- Number of I/O:
- 204
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (19x19)
XCAU10P-2SBVB484E FAQ
1.How can I place an order for XCAU10P-2SBVB484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU10P-2SBVB484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU10P-2SBVB484E reliable?
The price and inventory of XCAU10P-2SBVB484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU10P-2SBVB484E is usually 5 days.
3.What payment methods are accepted for XCAU10P-2SBVB484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU10P-2SBVB484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU10P-2SBVB484E?
XCAU10P-2SBVB484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU10P-2SBVB484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU10P-2SBVB484E?
For technical support, including XCAU10P-2SBVB484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU10P-2SBVB484E requirements.
6.How does Aetrix verify that XCAU10P-2SBVB484E is sourced from the original manufacturer or authorized distributors?
All XCAU10P-2SBVB484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU10P-2SBVB484E meets industry standards.
7.What is the process for return or replacement of XCAU10P-2SBVB484E?
All XCAU10P-2SBVB484E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU10P-2SBVB484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU10P-2SBVB484E part is unused and in its original packaging.
Return procedure for XCAU10P-2SBVB484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCAU10P-2SBVB484E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
