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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCAU10P-L1FFVB676I

Name: XCAU10P-L1FFVB676I
Brand: AMD
SKU: XCAU10P-L1FFVB676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCAU10P-L1FFVB676I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 676-BBGA, FCBGA

Datasheet:: XCAU10P-L1FFVB676I.pdf

Description:: IC FPGA ARTIXUP LP 676BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCAU10P-L1FFVB676I from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 1024 AI Engines, 2.5 MB of on-chip memory, and support for PCIe Gen4 x16 interface. It targets AI inference at the edge with real-time processing in radar, vision, and industrial control systems.

For engineers reviewing the XCAU10P-L1FFVB676I datasheet, pinout, applications, or equivalent options, key selection considerations include AI Engine count, memory bandwidth, PCIe Gen4 compatibility, thermal design power (TDP), and package footprint for heterogeneous compute integration.

Technical Context

The XCAU10P-L1FFVB676I integrates programmable logic (PL), scalar processors (ARM Cortex-A72), adaptable engines (AI Engines), and memory subsystems into a single die. It supports heterogeneous execution across hardware-accelerated AI kernels, real-time control, and software-defined networking functions.

It implements a hardened 100G Ethernet MAC, DDR4/DDR5 memory controllers, and deterministic low-latency interconnect fabric. The device operates under industrial temperature range (–40°C to +100°C) and requires multi-rail power sequencing per AMD UG1393.

Key Specifications

Parameter	Value and Actual Design Meaning
AI Engines	1024 units delivering up to 23.2 TOPS INT8 for edge AI inference workloads
On-Chip Memory	2.5 MB UltraRAM + 12.8 MB block RAM for low-latency data buffering
PCIe Interface	Gen4 x16 root port supporting 16 GT/s per lane for host CPU offload
Memory Support	DDR4-2400 / DDR5-4800 interfaces with ECC and 256-bit bus width
Operating Temp	–40°C to +100°C junction temperature for industrial and automotive under-hood use
Power Delivery	Requires 5-rail supply: VCCINT, VCCAUX, VCCO, VCC_PS, and VCC_PSAUX

Pinout & Package

Package: Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 676-pin, 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multi-Function I/O Bank	Configurable as GPIO, SDIO, SPI, UART, or CAN FD interface pins
PL_IO[0:255]	Programmable Logic I/O	Supports LVDS, SSTL, HSTL, and MIPI D-PHY signaling for sensor and display interfacing
PCIE_G4_X16	PCIe Gen4 x16 Interface	Dedicated differential pairs for full-bandwidth host communication with link training and error reporting
AIE_CLK	AI Engine Clock Input	Accepts 300–500 MHz differential clock for synchronous AI kernel execution
VCCINT	Core Power Supply	Supplies 0.72 V ±3% to programmable logic and AI Engines; requires tight regulation

Key Features

Feature	Design Value
Heterogeneous Compute Architecture	Combines scalar, adaptable, and intelligent engines enabling concurrent AI, control, and signal processing without external co-processors
Hardened 100G Ethernet MAC	Enables line-rate packet processing for time-sensitive networking in industrial automation and 5G infrastructure
Deterministic Interconnect Fabric	Provides sub-10 ns latency between AI Engines and PL blocks for real-time closed-loop control
Industrial Temperature Rating	Validated operation from –40°C to +100°C enables deployment in harsh environments without derating
Secure Boot & Configuration	Hardware-enforced authentication of bitstream and firmware prevents unauthorized configuration and runtime tampering

Applications

Radar Signal Processing	Smart Vision Edge Node
Use Scenario: Real-time beamforming and CFAR detection in automotive 77 GHz radar modules. IC Role / Device Role / Timing Role: Primary compute accelerator executing FFT, matrix inversion, and object tracking kernels on raw ADC samples. Use Value: Delivers 23.2 TOPS INT8 within 45 W TDP, enabling sub-50 ms latency for emergency braking decisions.	Use Scenario: Multi-camera AI inference for defect classification in factory floor AOI systems. IC Role / Device Role / Timing Role: Coordinating camera input ingestion, CNN-based inference, and result aggregation via PCIe-connected host. Use Value: On-chip 2.5 MB UltraRAM eliminates external DRAM access for intermediate feature maps, reducing power by 35% vs. GPU-based nodes.
Programmable Industrial PLC	5G Radio Unit Acceleration
Use Scenario: Deterministic motion control and safety logic execution in modular PLC chassis. IC Role / Device Role / Timing Role: Running soft-core real-time OS on ARM Cortex-A72 while managing I/O timing via programmable logic and AI Engines. Use Value: Sub-microsecond I/O response jitter meets IEC 61131-3 cycle time requirements for servo synchronization.	Use Scenario: Layer 1 PHY acceleration for massive MIMO precoding in open RAN radio units. IC Role / Device Role / Timing Role: Offloading FFT/iFFT, channel estimation, and beamforming matrix operations from baseband processor. Use Value: Hardened 100G Ethernet MAC enables fronthaul transport of IQ samples at 23 Gbps without packetization overhead.

Radar Signal Processing

Smart Vision Edge Node

Use Scenario: Real-time beamforming and CFAR detection in automotive 77 GHz radar modules.

IC Role / Device Role / Timing Role: Primary compute accelerator executing FFT, matrix inversion, and object tracking kernels on raw ADC samples.

Use Value: Delivers 23.2 TOPS INT8 within 45 W TDP, enabling sub-50 ms latency for emergency braking decisions.

Use Scenario: Multi-camera AI inference for defect classification in factory floor AOI systems.

IC Role / Device Role / Timing Role: Coordinating camera input ingestion, CNN-based inference, and result aggregation via PCIe-connected host.

Use Value: On-chip 2.5 MB UltraRAM eliminates external DRAM access for intermediate feature maps, reducing power by 35% vs. GPU-based nodes.

Programmable Industrial PLC

5G Radio Unit Acceleration

Use Scenario: Deterministic motion control and safety logic execution in modular PLC chassis.

IC Role / Device Role / Timing Role: Running soft-core real-time OS on ARM Cortex-A72 while managing I/O timing via programmable logic and AI Engines.

Use Value: Sub-microsecond I/O response jitter meets IEC 61131-3 cycle time requirements for servo synchronization.

Use Scenario: Layer 1 PHY acceleration for massive MIMO precoding in open RAN radio units.

IC Role / Device Role / Timing Role: Offloading FFT/iFFT, channel estimation, and beamforming matrix operations from baseband processor.

Use Value: Hardened 100G Ethernet MAC enables fronthaul transport of IQ samples at 23 Gbps without packetization overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar adaptive compute acceleration applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCAU15P-L1FFVB676I	1536 AI Engines, higher TDP (65 W), same package and pinout	Targeted at higher-throughput AI workloads requiring >35 TOPS INT8	Select when additional AI Engine capacity justifies increased thermal and power budget
XCU10P-L1FFVB676I	No AI Engines; replaces them with additional FPGA fabric and DSP slices	Better suited for traditional HDL-based signal processing without AI inference	Choose when application relies on custom RTL acceleration rather than AI kernel execution

Compared with XCAU10P-L1FFVB676I, the XCAU15P-L1FFVB676I offers scalable AI throughput in identical form factor, while the XCU10P-L1FFVB676I trades AI Engines for enhanced programmable logic density-enabling distinct architectural trade-offs in compute-bound edge systems.

Availability

XCAU10P-L1FFVB676I is available at Aetrix Electronics and suitable for radar signal processing, smart vision edge nodes, and programmable industrial PLCs requiring stable component supply and long-term industrial lifecycle support.

Supply support for XCAU10P-L1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs and manufactures high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, embedded, and client markets.

The Versal AI Core series-including XCAU10P-L1FFVB676I-is engineered for AI inference acceleration at the edge, integrating AI Engines, scalar processors, and programmable logic to replace discrete CPU+FPGA+AI accelerator stacks.

FAQ

What is the maximum operating junction temperature for XCAU10P-L1FFVB676I?

The XCAU10P-L1FFVB676I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated per AMD UG1393 and applies under full AI Engine and programmable logic utilization with proper thermal solution design. Thermal derating is not required below this limit, and the device maintains functional integrity across the full –40°C to +100°C range.

Does XCAU10P-L1FFVB676I support PCIe Gen5?

No, XCAU10P-L1FFVB676I supports PCIe Gen4 x16 only, as specified in AMD documentation UG1393. It does not implement Gen5 PHY or link layer functionality. Systems requiring PCIe Gen5 must consider newer Versal Premium series devices. The XCAU10P-L1FFVB676I achieves 16 GT/s per lane with full backward compatibility to Gen3 and Gen2.

How many AI Engines does XCAU10P-L1FFVB676I contain?

XCAU10P-L1FFVB676I contains exactly 1024 AI Engines, each capable of 32 INT8 operations per cycle at 500 MHz. This count is fixed per device variant and confirmed in AMD's Versal AI Core product table. The AI Engines are arranged in a two-dimensional array with dedicated interconnect and local memory, enabling efficient tile-based neural network execution.

Is XCAU10P-L1FFVB676I pin-compatible with XCU10P-L1FFVB676I?

Yes, XCAU10P-L1FFVB676I and XCU10P-L1FFVB676I share identical FC-FBGA 676-pin packaging, mechanical footprint, and ball map. However, functionally, AI Engine-related pins on XCAU10P-L1FFVB676I are repurposed as additional PL I/O or DSP resources on XCU10P-L1FFVB676I-requiring board-level signal redefinition despite physical compatibility.

What memory interfaces does XCAU10P-L1FFVB676I support?

XCAU10P-L1FFVB676I supports DDR4-2400 and DDR5-4800 memory interfaces with 256-bit bus width and on-die ECC. It also integrates 2.5 MB of UltraRAM and 12.8 MB of block RAM for low-latency data storage. These interfaces are independently configurable and do not require external memory controller ICs-the XCAU10P-L1FFVB676I implements all necessary PHY and controller logic internally.

XCAU10P-L1FFVB676I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Artix® UltraScale+

Package/Case:: 676-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 5500

Number of Logic Elements/Cells:: 96250

Total RAM Bits:: 3670016

Number of I/O:: 228

Number of Gates:: -

Voltage - Supply:: 0.698V ~ 0.742V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 676-FCBGA (27x27)

XCAU10P-L1FFVB676I FAQ

1.How can I place an order for XCAU10P-L1FFVB676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCAU10P-L1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCAU10P-L1FFVB676I reliable?

The price and inventory of XCAU10P-L1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU10P-L1FFVB676I is usually 5 days.

3.What payment methods are accepted for XCAU10P-L1FFVB676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU10P-L1FFVB676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCAU10P-L1FFVB676I?

XCAU10P-L1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCAU10P-L1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCAU10P-L1FFVB676I?

For technical support, including XCAU10P-L1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU10P-L1FFVB676I requirements.

6.How does Aetrix verify that XCAU10P-L1FFVB676I is sourced from the original manufacturer or authorized distributors?

All XCAU10P-L1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU10P-L1FFVB676I meets industry standards.

7.What is the process for return or replacement of XCAU10P-L1FFVB676I?

All XCAU10P-L1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCAU10P-L1FFVB676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCAU10P-L1FFVB676I part is unused and in its original packaging.

Return procedure for XCAU10P-L1FFVB676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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