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AMD XCAU15P-1SBVB484E

Part No.:
XCAU15P-1SBVB484E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-WFBGA, FCBGA
Datasheet:
AetrixXCAU15P-1SBVB484E.pdf
Description:
IC FPGA ARTIXUP 484BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,248

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Product details

Overview

XCAU15P-1SBVB484E from AMD is a high-performance adaptive compute accelerator platform (ACAP) based on the Versal AI Core series, featuring 152 AI Engines, 2.5 MB of on-chip SRAM, and support for PCIe Gen4 x16 host interface - deployed in data center acceleration, AI inference, and real-time signal processing applications.

For engineers reviewing the XCAU15P-1SBVB484E datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, memory bandwidth, PCIe Gen4 compatibility, thermal design power (TDP), and package ball map alignment with carrier board layout requirements.

Technical Context

The XCAU15P-1SBVB484E integrates a dual-core Arm Cortex-A72 application processor, a real-time Arm Cortex-R5F subsystem, programmable logic fabric, and AI Engines optimized for INT8/INT16/BF16 operations. It supports DDR4/DDR5 memory interfaces and hardened 100G Ethernet MACs.

Configuration is performed via JTAG and Quad-SPI flash; boot flow includes secure RSA-3072 authentication and AES-256 decryption. The device implements AXI4-Stream and AXI4-Lite interconnects across processing domains.

Key Specifications

ParameterValue and Actual Design Meaning
AI Engines152 units delivering up to 12.7 TOPS at INT8 for edge AI workloads
On-chip SRAM2.5 MB distributed across AI Engines and PL for low-latency data buffering
PCIe InterfaceGen4 x16 root complex or endpoint mode, enabling 32 GB/s bidirectional bandwidth
TDP45 W typical, requiring active cooling and VRM compliance per AMD PDN-0012
Memory SupportDDR4-2400 or DDR5-4800 with ECC, up to 512 GB addressable capacity
Package484-ball FCBGA (19×19 mm, 0.8 mm pitch), RoHS-compliant

Pinout & Package

Package: 484-ball Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 19 mm × 19 mm body, 0.8 mm ball pitch, standard JEDEC MO-271AB footprint.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore logic supply1.0 V ±3% regulated input powering PL, AI Engines, and processors
VCCO_0I/O bank voltageConfigurable 1.2/1.35/1.8/2.5/3.3 V for interfacing with external memory or peripherals
CLK_INDedicated clock inputDifferential pair accepting 10–700 MHz reference clocks for system timing and PLL locking
PCIE_RX/TXPCIe Gen4 transceiver lanes16 differential pairs supporting x16 link width with integrated equalization and SSC support
MGTAVCCTransceiver analog supply1.2 V ±2% low-noise supply for high-speed serial I/O operation

Key Features

FeatureDesign Value
Adaptive Compute ArchitectureHardware-programmable logic + scalar processors + AI Engines unified under single coherent memory map
Secure BootRSA-3072 signature verification and AES-256-GCM decryption of bitstream and firmware images
Real-time SubsystemDual-lockstep Arm Cortex-R5F cores with Tightly Coupled Memory (TCM) for deterministic latency-critical control
Hardened 100G EthernetIntegrated 100G MAC with IEEE 802.3cd compliance, no external PHY required for backplane or optical interfaces
AXI Interconnect FabricNon-blocking, low-latency AXI4-Stream and AXI4-Lite crossbar connecting all processing elements

Applications

Data Center AI Inference Acceleration5G Wireless Baseband Processing

Use Scenario: Real-time LLM token generation and vision transformer inference on server blades with PCIe attachment.

IC Role / Device Role / Timing Role: Primary compute accelerator offloading CPU/GPU, managing dataflow between DDR5, PCIe host, and on-chip SRAM.

Use Value: 12.7 TOPS INT8 throughput enables sub-10ms latency for 7B-parameter model inference at batch=1.

Use Scenario: Massive MIMO precoding and channel estimation in Open RAN DU units operating at 3.5 GHz band.

IC Role / Device Role / Timing Role: Real-time signal processor executing FPGA-accelerated numerically intensive baseband algorithms.

Use Value: Hardened 100G Ethernet and deterministic R5F subsystem meet 100 µs fronthaul timing constraints.

Radar Signal ProcessingIndustrial Vision Inspection System

Use Scenario: FMCW radar point cloud generation and CFAR detection in automotive ADAS ECUs.

IC Role / Device Role / Timing Role: Heterogeneous accelerator running FFT, beamforming, and clustering kernels across AI Engines and PL fabric.

Use Value: On-chip 2.5 MB SRAM eliminates off-chip DRAM access latency for frame-level radar processing pipelines.

Use Scenario: High-throughput PCB defect classification using CNN models on factory-floor inspection cameras.

IC Role / Device Role / Timing Role: Edge AI co-processor interfacing with MIPI CSI-2 camera inputs and GigE vision outputs.

Use Value: PCIe Gen4 x16 host interface enables 2.4 Gbps image streaming to host controller without bottleneck.

Equivalent & Alternatives

The following parts are listed as comparable options for similar adaptive compute acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCAU15P-1SBVA484ESame die, lower speed grade (-1 vs -1S), 40 W TDP, reduced AI Engine frequency (800 MHz vs 1 GHz)Suitable for thermally constrained embedded deployments where peak TOPS not requiredSelect when system cooling budget limits sustained 45 W operation
XCAU25P-1SBVB484EHigher-density variant: 256 AI Engines, 4.2 MB SRAM, 65 W TDP, same package footprintTargeted at cloud-scale inference servers needing >20 TOPS and larger on-chip memory buffersChoose only if application requires >152 AI Engines and can accommodate higher power delivery and thermal design

Compared with XCAU15P-1SBVB484E, the XCAU15P-1SBVA484E trades peak AI performance for lower thermal envelope, while the XCAU25P-1SBVB484E scales compute density and memory at increased power and board-level cooling complexity - both share identical pinout and software stack compatibility.

Availability

XCAU15P-1SBVB484E is available at Aetrix Electronics and suitable for data center acceleration, 5G infrastructure, and automotive radar systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCAU15P-1SBVB484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD designs and manufactures high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.

The Versal AI Core series - including XCAU15P-1SBVB484E - targets AI-accelerated workloads demanding heterogeneous compute, real-time responsiveness, and hardware adaptability in infrastructure and edge platforms.

FAQ

What is the maximum operating frequency of the AI Engines in XCAU15P-1SBVB484E?

The AI Engines in XCAU15P-1SBVB484E operate at up to 1 GHz under standard thermal and voltage conditions, delivering peak INT8 performance of 12.7 TOPS. This frequency is validated per AMD's ACAP Speed Files and supported by the -1S speed grade designation in the XCAU15P-1SBVB484E part number. XCAU15P-1SBVB484E requires precise 1.0 V core regulation and adequate heatsinking to sustain this frequency.

Does XCAU15P-1SBVB484E support PCIe Gen5?

No, XCAU15P-1SBVB484E supports PCIe Gen4 x16 only, with a maximum bidirectional bandwidth of 32 GB/s. It does not implement PCIe Gen5 physical layer circuitry or protocol stack extensions. Systems requiring Gen5 must use newer Versal Premium series devices. XCAU15P-1SBVB484E maintains full backward compatibility with Gen3 and Gen4 hosts and endpoints.

What boot sources are supported by XCAU15P-1SBVB484E?

XCAU15P-1SBVB484E supports boot from Quad-SPI flash, OSPI flash, and PCIe enumeration. Configuration can also be loaded via JTAG for development and debug. All boot paths enforce secure boot using RSA-3072 signatures and AES-256-GCM decryption. XCAU15P-1SBVB484E does not support SD card or eMMC boot modes.

Is XCAU15P-1SBVB484E pin-compatible with other Versal AI Core devices?

XCAU15P-1SBVB484E shares the same 484-ball FCBGA package and ball map with XCAU15P-1SBVA484E, enabling mechanical and layout compatibility. However, it is not pin-compatible with higher-density variants like XCAU25P-1SBVB484E due to differing power delivery and thermal ball assignments. XCAU15P-1SBVB484E pinout is fixed and documented in AMD UG1393.

What is the SRAM configuration in XCAU15P-1SBVB484E?

XCAU15P-1SBVB484E contains 2.5 MB of total on-chip SRAM, distributed as 2 MB across AI Engine arrays and 512 KB in the real-time subsystem's TCM. This SRAM is not cache-coherent with DDR memory and is allocated statically during compile time via Vitis AI compiler directives. XCAU15P-1SBVB484E does not include L3 cache or shared system cache.

XCAU15P-1SBVB484E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix® UltraScale+
Package/Case:
484-WFBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
204
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FCBGA (19x19)

XCAU15P-1SBVB484E FAQ

1.How can I place an order for XCAU15P-1SBVB484E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCAU15P-1SBVB484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCAU15P-1SBVB484E reliable?

The price and inventory of XCAU15P-1SBVB484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU15P-1SBVB484E is usually 5 days.

3.What payment methods are accepted for XCAU15P-1SBVB484E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU15P-1SBVB484E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCAU15P-1SBVB484E?

XCAU15P-1SBVB484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCAU15P-1SBVB484E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCAU15P-1SBVB484E?

For technical support, including XCAU15P-1SBVB484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU15P-1SBVB484E requirements.

6.How does Aetrix verify that XCAU15P-1SBVB484E is sourced from the original manufacturer or authorized distributors?

All XCAU15P-1SBVB484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU15P-1SBVB484E meets industry standards.

7.What is the process for return or replacement of XCAU15P-1SBVB484E?

All XCAU15P-1SBVB484E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU15P-1SBVB484E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCAU15P-1SBVB484E part is unused and in its original packaging.

Return procedure for XCAU15P-1SBVB484E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCAU15P-1SBVB484E Tags

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  • XCAU15P-1SBVB484E Images
  • AMD
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  • Buy XCAU15P-1SBVB484E
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