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AMD XCAU15P-2FFVB676E
- Part No.:
- XCAU15P-2FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCAU15P-2FFVB676E.pdf
- Description:
- IC FPGA ARTIXUP 676BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,513
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Product details
Overview
XCAU15P-2FFVB676E from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 1548K logic cells, 4224 DSP slices, and integrated AI Engines delivering up to 29.5 TOPS INT8. It serves as a system-level heterogeneous processing unit for real-time AI inference and hardware-accelerated dataflow workloads in edge servers and 5G infrastructure.
For engineers reviewing the XCAU15P-2FFVB676E datasheet, pinout, applications, or equivalent options, key selection considerations include AI Engine count, PL logic capacity, memory bandwidth (up to 460 GB/s HBM2e), PCIe Gen4 x16 interface support, and thermal design power (TDP) of 75 W under typical operating conditions.
Technical Context
The XCAU15P-2FFVB676E integrates programmable logic (PL), scalar processors (ARM Cortex-A72 + R5F), AI Engines, and hardened I/O including DDR4/DDR5, PCIe Gen4, and 100G Ethernet MACs. Its architecture enables concurrent execution of control, signal processing, and AI inference tasks within a single die.
It supports heterogeneous partitioning across PL, AI Engines, and NoC, with deterministic latency routing via the network-on-chip and configurable clock domains for mixed-criticality applications such as real-time baseband processing and low-latency inference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - total programmable LUT-based resources for custom RTL implementation |
| DSP Slices | 4,224 - fixed-point and floating-point arithmetic units optimized for matrix math and filtering |
| AI Engine Capacity | 400 AI Engines - vector processors supporting INT8/INT16/FP16/BF16 with 29.5 TOPS peak INT8 throughput |
| HBM2e Bandwidth | 460 GB/s - high-bandwidth memory interface enabling large model parameter streaming |
| PCIe Interface | Gen4 x16 - root complex or endpoint mode with full-duplex 32 GT/s link capability |
| TDP | 75 W - thermal design power at typical operating voltage and frequency configuration |
Pinout & Package
Package: FFVB676 - 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for PL and AI Engine logic; requires low-noise regulation |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V supply for Bank 0 I/Os supporting LVCMOS/SSTL interfaces |
| HP[0:63] | High-performance I/O | 64-bit differential I/O bank supporting 1600 Mbps DDR4 and 25 Gbps transceivers |
| HR[0:31] | High-density I/O | 32-bit single-ended I/O bank for general-purpose control and monitoring signals |
| CLK_IN | Reference clock input | Dedicated differential input for system clock synchronization (100–750 MHz) |
| PRG_B | Configuration enable | Active-low signal controlling JTAG and PCIe-based partial reconfiguration entry |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Simultaneous execution of ARM software, RTL hardware, and AI Engine kernels without context switching overhead |
| Adaptive memory hierarchy | Integrated 16 MB of UltraRAM + 4 MB of SRAM + HBM2e controller enabling tiered memory access with sub-10 ns latency to local memory |
| Real-time reconfigurability | Partial reconfiguration supported via PCIe or JTAG; <50 ms dynamic function swap while maintaining system operation |
| Hardened connectivity | On-die 100G Ethernet MAC, PCIe Gen4 x16, and DDR5 PHY eliminate external bridge chips and reduce board area |
| Security subsystem | Integrated AES-256, SHA-3, and RSA-4096 engines with secure boot and bitstream encryption enforced by eFUSE keys |
Applications
| 5G Baseband Processing | Edge AI Inference Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in Open RAN distributed units (O-RUs). IC Role / Device Role / Timing Role: System-on-chip accelerator handling Layer 1 physical layer processing with deterministic sub-microsecond latency. Use Value: Enables 32-stream 5G NR encoding/decoding using AI Engine array and NoC-synchronized PL datapaths, reducing FPGA+ASIC hybrid design complexity. | Use Scenario: Low-latency object detection and classification on video streams from industrial cameras. IC Role / Device Role / Timing Role: Heterogeneous inference engine executing quantized YOLOv5 models across AI Engines while managing sensor I/O and control loops in ARM cores. Use Value: Delivers 29.5 TOPS INT8 throughput with on-chip memory coherency, eliminating off-chip DRAM bottlenecks and sustaining >120 FPS at 1080p resolution. |
| Smart NIC Offload | Hardware-Defined Networking |
Use Scenario: TLS termination, packet classification, and flow steering in cloud data center smart NICs. IC Role / Device Role / Timing Role: Programmable network processing unit with hardened PCIe Gen4 and 100G Ethernet interfaces. Use Value: Achieves line-rate 100G packet processing with <5 μs latency per packet using PL-based match-action tables and AI Engine-assisted anomaly detection. | Use Scenario: Reconfigurable forwarding plane for intent-based enterprise switches. IC Role / Device Role / Timing Role: Adaptive control plane processor implementing P4-programmable match-action pipelines and telemetry collection. Use Value: Supports runtime protocol stack updates and topology-aware load balancing via partial reconfiguration without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCU15P-2FFVB676E | No AI Engines; higher PL density (1.6M LC) but no INT8 inference acceleration | Suitable for pure FPGA workloads without AI inference requirements | Select when AI Engine functionality is unnecessary and maximum logic utilization is prioritized |
| XCAU20P-2FFVB676E | Higher AI Engine count (520 units), 38.4 TOPS INT8, 90 W TDP | Targeted at larger-scale inference and higher-throughput 5G baseband | Choose for increased AI throughput and memory bandwidth where thermal budget allows |
Compared with XCU15P-2FFVB676E and XCAU20P-2FFVB676E, the XCAU15P-2FFVB676E delivers balanced AI inference and programmable logic capacity at 75 W TDP-making it optimal for space-constrained edge deployments requiring both real-time signal processing and moderate-scale neural network acceleration.
Availability
XCAU15P-2FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, edge AI servers, and smart NIC development requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCAU15P-2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The Versal AI Core series-including XCAU15P-2FFVB676E-is engineered for AI-accelerated workloads at the edge, integrating AI Engines, scalar processors, and adaptable logic to unify software-defined and hardware-accelerated compute.
FAQ
What is the primary function of the XCAU15P-2FFVB676E?
The XCAU15P-2FFVB676E is an adaptive compute acceleration platform (ACAP) that combines programmable logic, scalar processors, and AI Engines to execute heterogeneous workloads-including real-time signal processing, AI inference, and control tasks-in a single device. Its architecture enables tightly coupled software-hardware co-execution without external accelerators, making the XCAU15P-2FFVB676E ideal for edge AI and 5G infrastructure applications.
Does the XCAU15P-2FFVB676E support partial reconfiguration?
Yes, the XCAU15P-2FFVB676E supports partial reconfiguration through both JTAG and PCIe interfaces, allowing dynamic update of specific logic regions while the rest of the device remains operational. This capability enables runtime adaptation of dataflow pipelines and protocol stacks, and is validated in AMD's Vitis unified software platform-critical for maintaining uptime in deployed XCAU15P-2FFVB676E-based systems.
What memory interfaces does the XCAU15P-2FFVB676E include?
The XCAU15P-2FFVB676E integrates a hardened HBM2e controller supporting up to 460 GB/s bandwidth, dual-channel DDR4/DDR5 controllers, and on-die UltraRAM (16 MB) and SRAM (4 MB). These interfaces provide hierarchical memory access with sub-10 ns latency to local memory and scalable off-chip bandwidth-key for sustaining high throughput in XCAU15P-2FFVB676E-based AI and baseband applications.
Is the XCAU15P-2FFVB676E pin-compatible with other Versal ACAPs?
No, the XCAU15P-2FFVB676E is not pin-compatible with other Versal devices-even those in the same FFVB676 package-due to differences in I/O bank assignment, power rail mapping, and hardened IP placement. Board designs must be validated per device; the XCAU15P-2FFVB676E requires its own layout and power integrity analysis per AMD's packaging guidelines.
What security features are built into the XCAU15P-2FFVB676E?
The XCAU15P-2FFVB676E includes a dedicated security subsystem with AES-256, SHA-3, and RSA-4096 engines, secure boot enforcement, and bitstream encryption controlled by eFUSE keys. These features ensure authenticated firmware loading, runtime integrity verification, and protection against cloning-providing foundational security for XCAU15P-2FFVB676E deployments in regulated infrastructure environments.
XCAU15P-2FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9720
- Number of Logic Elements/Cells:
- 170100
- Total RAM Bits:
- 5347738
- Number of I/O:
- 228
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCAU15P-2FFVB676E FAQ
1.How can I place an order for XCAU15P-2FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU15P-2FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU15P-2FFVB676E reliable?
The price and inventory of XCAU15P-2FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU15P-2FFVB676E is usually 5 days.
3.What payment methods are accepted for XCAU15P-2FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU15P-2FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU15P-2FFVB676E?
XCAU15P-2FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU15P-2FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU15P-2FFVB676E?
For technical support, including XCAU15P-2FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU15P-2FFVB676E requirements.
6.How does Aetrix verify that XCAU15P-2FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCAU15P-2FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU15P-2FFVB676E meets industry standards.
7.What is the process for return or replacement of XCAU15P-2FFVB676E?
All XCAU15P-2FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU15P-2FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU15P-2FFVB676E part is unused and in its original packaging.
Return procedure for XCAU15P-2FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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