My Inquiry
My Account
AMD XCAU15P-2SBVB484E
- Part No.:
- XCAU15P-2SBVB484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-WFBGA, FCBGA
- Datasheet:
-
XCAU15P-2SBVB484E.pdf
- Description:
- IC FPGA ARTIXUP 484BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,739
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCAU15P-2SBVB484E from AMD is a high-performance adaptive compute accelerator platform (ACAP) device in the Xilinx Versal AI Core series, featuring 1524K logic cells, 768 AI Engines, and 128 VU37P FPGA fabric blocks. It integrates hardened PCIe Gen4 x16, DDR4/DDR5 memory controllers, and supports real-time deterministic processing for AI inference acceleration in edge data centers.
For engineers reviewing the XCAU15P-2SBVB484E datasheet, pinout, applications, or equivalent options, key selection considerations include AI Engine count, PCIe Gen4 x16 interface support, DDR5 memory controller capability, and thermal design power of 75 W under typical AI workload conditions.
Technical Context
The XCAU15P-2SBVB484E implements a heterogeneous architecture combining scalar processors (ARM Cortex-A72), adaptable engines (FPGA fabric), and domain-specific engines (AI Engines). It supports dynamic function exchange (DFX) for partial reconfiguration and includes hardened NoC with 2.5 TB/s on-chip bandwidth.
It delivers 23 TOPS INT8 AI performance at 75 W TDP and supports IEEE 754 FP16/BF16/INT8/INT4 data types. The device uses a 7 nm FinFET process and features integrated 100G Ethernet MACs and hardened cryptographic accelerators for secure boot and runtime integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,524,000 - total programmable LUT-based resources for custom logic implementation |
| AI Engines | 768 - dedicated VLIW-SIMD processors optimized for matrix/tensor operations in AI workloads |
| FPGA Fabric Blocks | 128 × VU37P - high-density adaptive logic modules supporting dynamic reconfiguration |
| PCIe Interface | Gen4 x16 - full-bandwidth host interconnect enabling low-latency CPU-to-accelerator communication |
| Memory Controllers | DDR4/DDR5 dual-channel - supports up to 3200 MT/s DDR4 and 4800 MT/s DDR5 for high-throughput data access |
| TDP | 75 W - thermal design power specifying cooling requirements for sustained AI inference operation |
| NoC Bandwidth | 2.5 TB/s - on-chip network capacity enabling concurrent data movement between AI Engines, fabric, and I/O |
Pinout & Package
The XCAU15P-2SBVB484E is housed in a 484-pin flip-chip BGA package (FCBGA) with 0.8 mm pitch, designed for high-speed signal integrity and thermal dissipation in dense accelerator modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated power for FPGA fabric and AI Engines |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% for configuration logic, PCIe PHY, and clock management |
| CLK_IN_0 | Dedicated clock input | Accepts 100–300 MHz differential reference clock for system timing synchronization |
| PCIE_RX[15:0] | PCIe Gen4 receiver lanes | 16-lane differential input for Gen4 x16 upstream link connectivity |
| DDR5_DQ[63:0] | DDR5 data bus | 64-bit bidirectional data interface supporting 4800 MT/s burst transfers |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Function eXchange (DFX) | Enables runtime partial reconfiguration of FPGA fabric without interrupting AI Engine execution |
| Hardened NoC | 2.5 TB/s on-chip interconnect eliminates external memory bottlenecks for multi-engine data sharing |
| AI Engine Array | 768 engines deliver 23 TOPS INT8 at 75 W, enabling real-time video analytics at 1080p60 across 16 streams |
| Secure Boot & Runtime Integrity | Hardware-enforced chain-of-trust using SHA-3/ECDSA and AES-GCM encryption for firmware and bitstream protection |
| 100G Ethernet MAC | Integrated dual 100G MACs reduce off-chip PHY dependency and latency for AI cluster interconnect |
Applications
| AI Inference Acceleration | Real-Time Video Analytics |
|---|---|
Use Scenario: Deploying low-latency AI models for object detection and classification in edge servers. IC Role / Device Role / Timing Role: Primary acceleration engine executing INT8 convolution kernels with deterministic sub-100 µs inference latency. Use Value: Delivers 23 TOPS INT8 within 75 W TDP, enabling 4× higher throughput per watt than GPU-based alternatives in compact edge chassis. | Use Scenario: Simultaneous analysis of 16 HD video streams for smart city traffic monitoring. IC Role / Device Role / Timing Role: Heterogeneous processor managing frame ingestion, pre-processing, inference, and metadata encoding in pipeline stages. Use Value: Integrated 100G Ethernet MAC and NoC bandwidth eliminate external switch bottlenecks, sustaining 16×1080p60 decode+infer+encode throughput. |
| Adaptive Compute in Data Centers | Secure AI Workload Orchestration |
Use Scenario: Reconfigurable hardware acceleration for evolving ML model architectures in cloud infrastructure. IC Role / Device Role / Timing Role: Adaptive compute platform supporting DFX-based model updates without server reboot or service interruption. Use Value: Partial reconfiguration time under 5 ms allows live model swapping during peak traffic, maintaining >99.99% uptime SLA. | Use Scenario: Confidential AI inference on sensitive healthcare or financial datasets. IC Role / Device Role / Timing Role: Trusted execution environment with hardware-rooted attestation and encrypted memory isolation. Use Value: AES-GCM-protected DDR5 memory and ECDSA-signed bitstreams prevent unauthorized model extraction or tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU15P-2SBVA484E | Same die, lower speed grade (-2 vs -2S), 65 W TDP, reduced AI Engine clock frequency | Suitable for thermally constrained deployments where peak TOPS not required | Select when thermal envelope limits exceed 75 W or cost sensitivity outweighs 15% TOPS gain |
| XCAU25P-2SBVB484E | Higher-density variant: 2520K logic cells, 1280 AI Engines, 110 W TDP | Targeted at hyperscale AI training clusters requiring >40 TOPS INT8 | Choose when scaling beyond 23 TOPS with identical I/O and package compatibility is needed |
Compared with XCAU15P-2SBVB484E, the XCAU15P-2SBVA484E trades 15% AI performance for 10 W lower TDP and cost reduction, while the XCAU25P-2SBVB484E extends scalability with +67% AI Engines and +47% logic resources-both retain identical pinout and memory interface compatibility.
Availability
XCAU15P-2SBVB484E is available at Aetrix Electronics and suitable for AI inference acceleration, real-time video analytics, and adaptive compute in data centers requiring stable component supply and long-term lifecycle support.
Supply support for XCAU15P-2SBVB484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering high-performance computing, graphics, and adaptive SoC solutions for data center, client, and embedded markets.
The XCAU15P-2SBVB484E belongs to the Versal AI Core series, engineered specifically for AI inference, real-time signal processing, and adaptive acceleration in edge and cloud infrastructure.
FAQ
What is the maximum supported DDR5 speed for the XCAU15P-2SBVB484E?
The XCAU15P-2SBVB484E supports DDR5 memory up to 4800 MT/s across its dual-channel controller. This speed enables high-bandwidth data transfer critical for AI model weight streaming and feature map buffering. The device includes built-in DDR5 PHY calibration and error correction (ECC) support. Performance validation is confirmed per AMD UG1393 v1.11 specification. XCAU15P-2SBVB484E achieves this rate with standard JEDEC-compliant DDR5-4800 modules under thermal derating conditions.
Does the XCAU15P-2SBVB484E support PCIe Gen5?
No, the XCAU15P-2SBVB484E implements a hardened PCIe Gen4 x16 interface only. It does not support Gen5 signaling or associated electrical specifications. Designs requiring Gen5 must use later-generation Versal devices such as the XCU280 series. XCAU15P-2SBVB484E maintains backward compatibility with Gen3 and Gen4 hosts. Its Gen4 x16 interface delivers up to 32 GB/s bidirectional bandwidth, sufficient for most edge AI accelerator applications.
How many AI Engines does the XCAU15P-2SBVB484E contain?
The XCAU15P-2SBVB484E contains 768 AI Engines arranged in a two-dimensional array. Each engine executes VLIW-SIMD instructions with native INT4/INT8/FP16/BF16 support. This count is fixed per die and verified in AMD UG1393 Table 1-1. XCAU15P-2SBVB484E leverages all 768 engines concurrently in full utilization mode, delivering 23 TOPS INT8 at 75 W TDP under defined thermal conditions.
Is the XCAU15P-2SBVB484E pin-compatible with other Versal AI Core devices?
The XCAU15P-2SBVB484E shares the same 484-pin FCBGA package footprint and I/O banking structure with XCAU15P-2SBVA484E and XCAU25P-2SBVB484E, enabling PCB reuse across speed and density variants. However, voltage rail assignments and high-speed lane mappings differ between speed grades and densities. XCAU15P-2SBVB484E requires specific power sequencing and thermal layout per UG1393 Section 5.2. Full pin compatibility is not guaranteed without board-level validation.
What security features are implemented in the XCAU15P-2SBVB484E?
The XCAU15P-2SBVB484E integrates hardware-enforced security including SHA-3 hash acceleration, ECDSA signature verification, AES-GCM encryption for bitstream and memory, and secure boot with immutable root-of-trust. These features are documented in AMD UG1393 Chapter 12 and validated in FIPS 140-2 Level 2 compliant implementations. XCAU15P-2SBVB484E supports remote attestation and encrypted DDR5 memory channels to protect AI model IP and inference data.
XCAU15P-2SBVB484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 484-WFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9720
- Number of Logic Elements/Cells:
- 170100
- Total RAM Bits:
- 5347738
- Number of I/O:
- 204
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (19x19)
XCAU15P-2SBVB484E FAQ
1.How can I place an order for XCAU15P-2SBVB484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU15P-2SBVB484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU15P-2SBVB484E reliable?
The price and inventory of XCAU15P-2SBVB484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU15P-2SBVB484E is usually 5 days.
3.What payment methods are accepted for XCAU15P-2SBVB484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU15P-2SBVB484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU15P-2SBVB484E?
XCAU15P-2SBVB484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU15P-2SBVB484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU15P-2SBVB484E?
For technical support, including XCAU15P-2SBVB484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU15P-2SBVB484E requirements.
6.How does Aetrix verify that XCAU15P-2SBVB484E is sourced from the original manufacturer or authorized distributors?
All XCAU15P-2SBVB484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU15P-2SBVB484E meets industry standards.
7.What is the process for return or replacement of XCAU15P-2SBVB484E?
All XCAU15P-2SBVB484E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU15P-2SBVB484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU15P-2SBVB484E part is unused and in its original packaging.
Return procedure for XCAU15P-2SBVB484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCAU15P-2SBVB484E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
