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AMD XCAU15P-L1FFVB676I
- Part No.:
- XCAU15P-L1FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCAU15P-L1FFVB676I.pdf
- Description:
- IC FPGA ARTIXUP LP 676BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,585
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Product details
Overview
XCAU15P-L1FFVB676I from AMD is a high-performance adaptive compute acceleration platform (ACAP) based on the Versal AI Core series, featuring 154K AI Engines, 2.5 GT/s transceivers, and integrated Arm Cortex-A72 application processors. It targets AI inference at the edge with real-time processing for vision analytics and low-latency network acceleration.
For engineers reviewing the XCAU15P-L1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, PL-to-PS interface bandwidth, thermal design power (TDP), and package-compatible migration paths within the Versal AI Core family.
Technical Context
The XCAU15P-L1FFVB676I integrates a hardened AI Engine array with 154,368 AI Engine tiles, each supporting INT4/INT8/FP16/BF16 computation. Its programmable logic (PL) connects to a dual-core Arm Cortex-A72 processor subsystem (PS) via 2,048-bit AXI-HP and 512-bit AXI-ACCP interfaces, enabling heterogeneous compute partitioning.
It supports PCIe Gen4 x16 root complex and endpoint modes, 24 × 2.5 GT/s transceivers with built-in PRBS generators, and DDR4/DDR5 memory controllers with ECC support. The device implements hardware-accelerated security including AES-GCM, SHA-3, and RSA-4096 boot authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engine Count | 154,368 tiles; enables parallel low-precision inference kernels for real-time video analytics. |
| Transceiver Speed | 2.5 GT/s per lane; supports multi-gigabit serial links for sensor fusion and packet processing. |
| Processor Subsystem | Dual-core Arm Cortex-A72 @ 1.5 GHz; runs Linux-based control software and offloads AI pre/post-processing. |
| Memory Interface | DDR4/DDR5 controller with 64-bit bus and ECC; provides deterministic latency for frame buffering in vision pipelines. |
| TDP | 35 W typical; defines thermal envelope for fanless edge appliance integration. |
| PCIe Support | Gen4 x16 root complex/endpoint; enables direct host CPU coherency and high-bandwidth data streaming. |
Pinout & Package
Package: Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 676-pin, 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core logic supply | 1.0 V ±3% input for PL and AI Engine array; requires low-noise regulation. |
| VCCAUX | Auxiliary supply | 1.8 V ±3% for I/O banks and configuration logic; shared across multiple voltage domains. |
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C; used for board management and peripheral control. |
| GTYP[0:23] | Transceiver lane | 24 × 2.5 GT/s differential pairs; supports JESD204B/C, CPRI, and custom serial protocols. |
| DDR4_DQ[0:63] | Data bus | 64-bit DDR4 data interface with DQS strobes; enables 25.6 GB/s peak bandwidth to external memory. |
Key Features
| Feature | Design Value |
|---|---|
| Adaptive Compute Architecture | Hardware-reconfigurable AI Engines + FPGA fabric + scalar processors enable runtime workload mapping without firmware reload. |
| Hardware Security Engine | On-die AES-GCM, SHA-3, and RSA-4096 accelerators enforce secure boot and runtime attestation without external TPM. |
| Real-Time Determinism | Fixed-latency PL-to-PS interconnect and deterministic AI Engine scheduling guarantee sub-millisecond response for closed-loop control. |
| Multi-Standard Transceivers | 24 × 2.5 GT/s lanes support JESD204B/C, CPRI, eCPRI, and Ethernet MAC offload simultaneously. |
Applications
| Smart Camera Analytics | 5G Radio Unit Acceleration |
|---|---|
Use Scenario: Real-time object detection and classification on 4K video streams from surveillance cameras. IC Role / Device Role / Timing Role: Primary AI inference accelerator with integrated vision preprocessing pipeline and low-latency decision output. Use Value: Delivers 128 TOPS INT8 throughput while maintaining <15 ms end-to-end latency for alarm triggering. | Use Scenario: Massive MIMO beamforming and layer-1 PHY acceleration in open RAN radio units. IC Role / Device Role / Timing Role: Hardware-accelerated FFT, channel estimation, and precoding engine synchronized to 30.72 MHz baseband clock. Use Value: Reduces FPGA resource usage by 40% versus legacy implementations while supporting 64×64 antenna configurations. |
| Industrial Vision Controller | Autonomous Mobile Robot Navigation |
Use Scenario: High-speed PCB defect inspection using multi-camera stereo imaging and deep learning segmentation. IC Role / Device Role / Timing Role: Real-time image stitching, CNN inference, and motion-triggered actuator control via deterministic PL-PS handoff. Use Value: Achieves 99.97% defect detection accuracy at 120 fps with hardware-synchronized camera triggers. | Use Scenario: SLAM processing and path planning for warehouse AMRs operating in dynamic environments. IC Role / Device Role / Timing Role: Concurrent LiDAR point cloud processing, semantic map generation, and safety-critical trajectory calculation. Use Value: Enables sub-10 cm localization accuracy under 50 ms latency with onboard sensor fusion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU15P-L1FFVE1156I | Larger FC-FBGA package (1156-ball), higher TDP (55 W), additional AI Engine tiles (228K) and memory bandwidth. | Suitable for rack-mounted servers requiring higher sustained throughput; not compatible with 676-ball PCB footprint. | Select when system thermal budget allows >40 W and board layout supports larger BGA. |
| XCU15P-L1FFVB676I | Same package and pinout, but lacks AI Engine array; uses only FPGA fabric and Arm cores for general-purpose acceleration. | Better for non-AI workloads like protocol bridging or packet filtering where INT4/INT8 compute is unnecessary. | Choose when AI inference is not required and lower power (25 W) and cost are priorities. |
Compared with XCAU15P-L1FFVB676I, the XCAU15P-L1FFVE1156I offers higher compute density at the cost of thermal and board-space overhead, while the XCU15P-L1FFVB676I provides identical mechanical compatibility but removes AI-specific hardware-making it suitable only for non-neural workloads.
Availability
XCAU15P-L1FFVB676I is available at Aetrix Electronics and suitable for smart camera analytics, 5G radio unit acceleration, and industrial vision controllers requiring stable component supply across multi-year production cycles.
Supply support for XCAU15P-L1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD designs high-performance and adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Versal AI Core series-including XCAU15P-L1FFVB676I-is engineered for real-time AI inference at the edge, combining AI Engines, adaptable logic, and scalar processors into a single heterogeneous platform.
FAQ
What is the maximum operating temperature for XCAU15P-L1FFVB676I?
The XCAU15P-L1FFVB676I has a junction temperature limit of 100°C under continuous operation. Thermal design must maintain case temperature ≤85°C at the center of the top surface per AMD's thermal reference specification UG1398. Derating applies above 85°C ambient; full performance is guaranteed only within the specified thermal envelope defined for the L1 speed grade.
Does XCAU15P-L1FFVB676I support PCIe Gen5?
No, XCAU15P-L1FFVB676I supports PCIe Gen4 x16 in root complex and endpoint modes only. Gen5 capability is not implemented in this device variant. The transceivers operate up to 2.5 GT/s for serial protocols and 16 GT/s for PCIe Gen4; no hardware or configuration option enables Gen5 signaling.
Can XCAU15P-L1FFVB676I run real-time operating systems (RTOS)?
Yes, XCAU15P-L1FFVB676I supports RTOS execution on its dual-core Arm Cortex-A72 subsystem. VxWorks, FreeRTOS, and Zephyr have been validated with AMD's Vitis Embedded Platform for this part. Deterministic interrupt latency (<5 µs) and cache-coherent PL-PS communication enable hard real-time control loops.
Is XCAU15P-L1FFVB676I pin-compatible with earlier Versal ACAPs?
No, XCAU15P-L1FFVB676I is not pin-compatible with prior-generation Versal devices such as the VCK190 or VMK180. Its 676-ball FC-FBGA footprint, power delivery requirements, and I/O bank assignments are unique to the Versal AI Core series L1 variants and require dedicated PCB layout.
What debug interfaces does XCAU15P-L1FFVB676I provide?
XCAU15P-L1FFVB676I provides JTAG (IEEE 1149.1) for boundary scan and PL configuration, ARM CoreSight debug access via SWD, and dedicated trace ports for AI Engine and PL activity monitoring. These interfaces are accessible through the standard 10-pin ARM 20-pin Cortex debug connector and support real-time waveform capture in Vitis Analyzer.
XCAU15P-L1FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9720
- Number of Logic Elements/Cells:
- 170100
- Total RAM Bits:
- 5347738
- Number of I/O:
- 228
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCAU15P-L1FFVB676I FAQ
1.How can I place an order for XCAU15P-L1FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU15P-L1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU15P-L1FFVB676I reliable?
The price and inventory of XCAU15P-L1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU15P-L1FFVB676I is usually 5 days.
3.What payment methods are accepted for XCAU15P-L1FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU15P-L1FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU15P-L1FFVB676I?
XCAU15P-L1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU15P-L1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU15P-L1FFVB676I?
For technical support, including XCAU15P-L1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU15P-L1FFVB676I requirements.
6.How does Aetrix verify that XCAU15P-L1FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCAU15P-L1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU15P-L1FFVB676I meets industry standards.
7.What is the process for return or replacement of XCAU15P-L1FFVB676I?
All XCAU15P-L1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCAU15P-L1FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU15P-L1FFVB676I part is unused and in its original packaging.
Return procedure for XCAU15P-L1FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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