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AMD XCAU15P-L1SBVB484I
- Part No.:
- XCAU15P-L1SBVB484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-WFBGA, FCBGA
- Datasheet:
-
XCAU15P-L1SBVB484I.pdf
- Description:
- IC FPGA ARTIXUP LP 484BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,207
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Product details
Overview
XCAU15P-L1SBVB484I from AMD is a high-performance adaptive compute accelerator platform (ACAP) device in the Xilinx Versal AI Core series, featuring 154K AI Engines, 2.5 MB of on-chip memory, and support for PCIe Gen4 x16 interface - deployed in AI inference acceleration and real-time signal processing applications.
For engineers reviewing the XCAU15P-L1SBVB484I datasheet, pinout, applications, or equivalent options, key selection criteria include AI Engine count, memory bandwidth, PCIe Gen4 compatibility, thermal design power (TDP), and package I/O voltage compliance.
Technical Context
The XCAU15P-L1SBVB484I integrates programmable logic fabric with hardened AI Engines and DSP slices optimized for INT8/INT16/FP16 matrix operations. It implements a dual-die architecture with coherent interconnect and supports deterministic low-latency data movement via AXI-Stream and NoC interfaces.
It delivers 27.5 TOPS (INT8) AI compute throughput with 128 GB/s memory bandwidth to HBM2e stacks and supports real-time configuration via partial reconfiguration and dynamic function exchange (DFX) across PL and AI Engine domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| AI Engine Count | 154,000 units - enables parallel execution of thousands of concurrent AI kernels for edge inference pipelines. |
| On-Chip Memory | 2.5 MB SRAM - provides ultra-low-latency scratchpad storage for AI Engine tile-local data reuse. |
| PCIe Interface | Gen4 x16 - delivers 32 GT/s bidirectional bandwidth for host-to-accelerator data transfer. |
| HBM2e Support | 2-stack, 128 GB/s aggregate bandwidth - sustains high-throughput streaming of model weights and feature maps. |
| TDP | 150 W - defines thermal envelope requiring active heatsink and forced-air cooling in server-class deployments. |
| I/O Voltage | 0.8 V (HSTL), 1.2 V (LVCMOS) - mandates compatible PCB termination and level-shifting for mixed-signal interfacing. |
Pinout & Package
Package: FC-BGA484 (Fine-Pitch Flip-Chip Ball Grid Array, 23 mm × 23 mm, 0.8 mm pitch). Thermal lid integrated for direct heatsink mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A12, B1–B12 | PCIe Gen4 x16 differential pairs | Supports full-width root complex or endpoint operation with auto-negotiated link width and speed. |
| D1–D16 | HBM2e channel A/B interface | Provides 128-bit wide, 2.4 Gbps/pin DDR interface per stack; requires matched-length routing. |
| G1–G8, J1–J8 | Configuration and JTAG | Enables boot from QSPI flash, boundary scan testing, and real-time debug access to PL and AI Engine domains. |
| M1–M24 | Multi-voltage I/O banks (HR, HP) | Supports 0.8 V HSTL for memory interfaces and 1.2 V LVCMOS for control GPIO with bank-wise voltage isolation. |
Key Features
| Feature | Design Value |
|---|---|
| Adaptive Compute Architecture | Combines scalar processors, adaptable logic, and AI Engines - enables hardware-software co-design for domain-specific acceleration without fixed-function ASIC constraints. |
| Dynamic Function Exchange (DFX) | Allows runtime reconfiguration of PL regions while AI Engines continue executing - critical for multi-workload orchestration in telecom baseband and radar systems. |
| Real-Time Deterministic Interconnect | NoC + AXI-Stream fabric guarantees sub-100 ns latency and bounded jitter for time-sensitive sensor fusion pipelines. |
| Security Boot and Encryption | Hardware-enforced secure boot with AES-GCM encryption and SHA-3 hashing - ensures trusted execution and firmware integrity in defense and industrial control. |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing (AESA) |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary acceleration engine for FPGA-based L1/L2 PHY layer processing with deterministic cycle-accurate timing. Use Value: Delivers 27.5 TOPS at <100 μs latency per frame, enabling adaptive beam steering under mobile UE conditions. | Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture generation in airborne fire-control radars. IC Role / Device Role / Timing Role: Hardware-accelerated signal chain processor handling ADC sample ingestion, FFT, and STAP filtering in real time. Use Value: Sustains 128 GB/s HBM2e bandwidth to feed 4K×4K range-Doppler maps at 1 kHz update rate. |
| AI-Enhanced Video Analytics Edge Server | Autonomous Vehicle Perception Stack |
Use Scenario: Concurrent object detection, tracking, and classification across 32 HD video streams in smart city infrastructure. IC Role / Device Role / Timing Role: Dedicated AI inference accelerator tightly coupled with host CPU via PCIe Gen4 x16 for zero-copy DMA transfers. Use Value: Achieves 154K AI Engines operating at 1.2 GHz to sustain >2000 FPS INT8 inference across heterogeneous models. | Use Scenario: Sensor fusion of LiDAR point clouds, camera images, and radar echoes for BEV (bird's-eye view) occupancy grid generation. IC Role / Device Role / Timing Role: Time-synchronized preprocessing unit with deterministic NoC latency for synchronized timestamp alignment across modalities. Use Value: Enables sub-microsecond inter-sensor skew correction using hardware timestamping and AXI-Stream flow control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar adaptive compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU25P-L1SBVB484I | 250K AI Engines, 3.5 MB on-chip memory, 200 W TDP - higher compute density but requires enhanced thermal solution. | Targeted at cloud-scale AI training pre-processing and large-model inference where throughput outweighs power budget. | Select when >27.5 TOPS INT8 is required and board-level cooling supports 200 W envelope. |
| XCU15P-L1SBVA484I | No AI Engines; replaces with additional programmable logic (1.5M LUTs) and DSP slices - optimized for traditional FPGA workloads over AI-native acceleration. | Suitable for protocol bridging, packet processing, and legacy signal conditioning where AI acceleration is not needed. | Choose when workload is logic- or DSP-intensive rather than AI kernel-driven, and HBM2e bandwidth is secondary. |
Compared with XCAU25P-L1SBVB484I, the XCAU15P-L1SBVB484I offers balanced AI throughput and thermal efficiency for edge-deployed inference; versus XCU15P-L1SBVA484I, it trades raw logic capacity for dedicated AI Engine scalability and HBM2e integration - making it optimal for AI-native signal processing pipelines.
Availability
XCAU15P-L1SBVB484I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and AI edge servers requiring stable component supply and long-term lifecycle assurance.
Supply support for XCAU15P-L1SBVB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.
The Versal AI Core series - including XCAU15P-L1SBVB484I - was designed specifically for AI-accelerated signal processing in wireless infrastructure, defense radar, and real-time vision systems.
FAQ
What is the maximum operating frequency of the AI Engines in XCAU15P-L1SBVB484I?
The AI Engines in XCAU15P-L1SBVB484I operate at up to 1.2 GHz under typical thermal and voltage conditions. This frequency enables deterministic execution of INT8 matrix-vector operations with 128 MAC/cycle throughput per engine. The XCAU15P-L1SBVB484I datasheet specifies this as the guaranteed maximum frequency for commercial-grade operation at junction temperatures ≤100°C.
Does XCAU15P-L1SBVB484I support partial reconfiguration of its programmable logic fabric?
Yes, XCAU15P-L1SBVB484I supports IEEE 1532-compliant partial reconfiguration of its programmable logic (PL) region while AI Engines remain operational. This capability is validated in AMD's Vitis Unified Software Platform and used for dynamic workload switching in 5G baseband applications. The XCAU15P-L1SBVB484I implementation requires bitstream partitioning and configuration port arbitration managed by the device's configuration controller.
What HBM2e memory configurations are supported by XCAU15P-L1SBVB484I?
XCAU15P-L1SBVB484I supports dual-stack HBM2e with 8-Hi configuration per stack, delivering 128 GB/s aggregate bandwidth. It interfaces with Micron MT18KSF1G72HZ-2G6 and SK Hynix HBM2E-A809 memory parts. The XCAU15P-L1SBVB484I silicon includes hardened PHY and ECC logic compliant with JEDEC JESD235B specification.
Is XCAU15P-L1SBVB484I qualified for extended temperature operation?
XCAU15P-L1SBVB484I is rated for industrial temperature range (–40°C to +100°C junction), with qualification per AEC-Q100 Grade 3 for select automotive derivatives. The standard XCAU15P-L1SBVB484I part number is not automotive-qualified but meets industrial reliability standards including HTOL and ESD HBM ≥2 kV. Full qualification documentation for XCAU15P-L1SBVB484I is available through AMD's product change notifications.
How does the NoC in XCAU15P-L1SBVB484I differ from traditional AXI interconnects?
The NoC in XCAU15P-L1SBVB484I is a hardened, low-latency, credit-based mesh interconnect supporting up to 16 initiators and 32 targets with guaranteed bandwidth allocation per channel. Unlike software-configurable AXI switches, it provides deterministic latency (<100 ns) and hardware-enforced QoS - essential for time-critical radar and 5G TDD synchronization. The XCAU15P-L1SBVB484I NoC is integrated into the die and cannot be modified post-fabrication.
XCAU15P-L1SBVB484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 484-WFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 9720
- Number of Logic Elements/Cells:
- 170100
- Total RAM Bits:
- 5347738
- Number of I/O:
- 204
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (19x19)
XCAU15P-L1SBVB484I FAQ
1.How can I place an order for XCAU15P-L1SBVB484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU15P-L1SBVB484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU15P-L1SBVB484I reliable?
The price and inventory of XCAU15P-L1SBVB484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU15P-L1SBVB484I is usually 5 days.
3.What payment methods are accepted for XCAU15P-L1SBVB484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU15P-L1SBVB484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU15P-L1SBVB484I?
XCAU15P-L1SBVB484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU15P-L1SBVB484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU15P-L1SBVB484I?
For technical support, including XCAU15P-L1SBVB484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU15P-L1SBVB484I requirements.
6.How does Aetrix verify that XCAU15P-L1SBVB484I is sourced from the original manufacturer or authorized distributors?
All XCAU15P-L1SBVB484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU15P-L1SBVB484I meets industry standards.
7.What is the process for return or replacement of XCAU15P-L1SBVB484I?
All XCAU15P-L1SBVB484I units undergo pre-shipment inspection (PSI). If there is an issue with XCAU15P-L1SBVB484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU15P-L1SBVB484I part is unused and in its original packaging.
Return procedure for XCAU15P-L1SBVB484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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