AMD XCAU25P-1SFVB784I

Overview

XCAU25P-1SFVB784I from AMD is a high-performance FPGA in the Xilinx UltraScale+ family, featuring 2.5M logic cells, 1,248 DSP slices, and 96.5 Mb of block RAM; it supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and is used in 5G radio unit acceleration and AI inference edge servers.

For engineers reviewing the XCAU25P-1SFVB784I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 32.75 Gb/s, thermal design power (TDP) of 45 W, and -40°C to +100°C industrial temperature grade.

Technical Context

This device implements a fully programmable fabric with hardened IP blocks including PCIe Gen4 Root Port/Endpoint, 100G Ethernet MAC, and integrated DDR4 memory controllers. It uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.

The XCAU25P-1SFVB784I integrates 72 GTY transceivers operating at up to 32.75 Gb/s, configurable I/O banks supporting SSTL, HSTL, and LVCMOS standards, and dual-core ARM Cortex-A53 processor subsystem for embedded control tasks.

Key Specifications

Pinout & Package

Package: Flip-Chip BGA, 784-pin, 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XCAU25P-1SFVB784I, the -1E variant reduces thermal overhead but sacrifices environmental ruggedness, while the -2I variant improves timing margin at higher power and cost-making the -1I optimal for balanced industrial 5G and AI edge deployments.

Availability

XCAU25P-1SFVB784I is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and industrial vision systems requiring stable component supply across long product lifecycles.

Supply support for XCAU25P-1SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions through its acquisition of Xilinx, with focus on FPGA, adaptive SoC, and ACAP technologies.

The XCAU25P-1SFVB784I belongs to the Xilinx UltraScale+ FPGA product line, engineered for high-bandwidth, low-latency, and thermally constrained applications in wireless infrastructure and intelligent edge systems.

FAQ

What is the maximum supported DDR4 memory speed for XCAU25P-1SFVB784I?

The XCAU25P-1SFVB784I integrates a hardened DDR4 memory controller supporting dual-channel 72-bit DDR4-2400 operation with ECC. This delivers 38.4 GB/s peak bandwidth and is validated for JEDEC-compliant DIMMs and discrete memory components meeting tRFC and tFAW timing requirements. The controller includes built-in calibration and refresh management logic.

Does XCAU25P-1SFVB784I include an embedded processor subsystem?

Yes, XCAU25P-1SFVB784I features a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz, with 256 KB shared L2 cache, TrustZone security extensions, and dedicated peripherals including Gigabit Ethernet, USB 3.0, and SDIO. This enables boot, system management, and real-time control alongside programmable logic execution.

What transceiver technology does XCAU25P-1SFVB784I use, and what protocols does it support?

XCAU25P-1SFVB784I uses GTY transceivers capable of 32.75 Gb/s per lane. It natively supports PCIe Gen4, 100G Ethernet (RS-FEC/FC-FEC), CPRI/eCPRI, and JESD204B/C protocols via hardened IP blocks. Line-rate configuration is done per transceiver quad using the Vivado IDE transceiver wizard.

Is partial reconfiguration supported on XCAU25P-1SFVB784I?

Yes, XCAU25P-1SFVB784I supports dynamic partial reconfiguration (PR) through the UltraScale+ architecture. PR allows bitstream segments to be loaded into designated reconfigurable partitions without resetting the entire device or disrupting active logic. This capability is enabled via Vivado's PR flow and requires specific floorplanning and checkpointing.

What is the thermal design power (TDP) and recommended cooling approach for XCAU25P-1SFVB784I?

XCAU25P-1SFVB784I has a specified TDP of 45 W under typical industrial workload conditions. AMD recommends a heatsink with ≥0.25°C/W thermal resistance and forced airflow of ≥200 LFM. PCB layout must include ≥6 oz copper on inner layers, thermal vias under the package, and alignment with the integrated thermal lid for effective heat transfer.