My Inquiry
My Account
AMD XCAU25P-2FFVB676E
- Part No.:
- XCAU25P-2FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCAU25P-2FFVB676E.pdf
- Description:
- IC FPGA ARTIX UP 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,905
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCAU25P-2FFVB676E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 2,586K logic cells, 1,492 DSP slices, and 92.4 Mb of block RAM; it supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade in a 676-pin FCBGA package for aerospace-grade reconfigurable computing applications.
For engineers reviewing the XCAU25P-2FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 32.75 Gb/s, and radiation-tolerant configuration SRAM for mission-critical systems.
Technical Context
This device belongs to AMD's Kintex UltraScale+ family with hardened PCIe Gen4 and 100G Ethernet MAC blocks, supporting deterministic low-latency processing in real-time signal chains. It integrates UltraScale architecture with 6-tap programmable FIR filters in DSP slices and dual-ported BRAM with true dual-port read/write capability.
The XCAU25P-2FFVB676E implements configuration via JTAG and SelectMAP interfaces, with bitstream encryption using AES-256 and HMAC authentication. Its configuration memory is SEU-hardened with built-in scrubbing logic and ECC protection on configuration frames.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,586,000 - Enables complex algorithm acceleration and multi-channel protocol stacking in single-device designs. |
| DSP Slices | 1,492 - Supports simultaneous execution of >100 parallel multiply-accumulate operations per clock cycle. |
| Block RAM | 92.4 Mb - Provides sufficient on-chip memory for frame buffering in 4K60 video pipelines or radar pulse compression. |
| Transceiver Max Rate | 32.75 Gb/s - Enables native 100G KR4/CR4 and 200G CAUI-4 interface implementation without gearbox logic. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - Allows direct interfacing to image sensors, ADCs/DACs, and memory controllers without level-shifting. |
| Speed Grade | -2 - Guarantees timing closure at maximum operating frequency under worst-case voltage/temperature conditions. |
Pinout & Package
676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB) with 0.8 mm pitch, thermal lid, and underfill support; designed for high-reliability mounting on multilayer ceramic substrates in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog power for GTY transceivers | Must be independently filtered and regulated to ±3% tolerance to maintain <0.5 UI jitter at 32.75 Gb/s. |
| VRP / VRN | Reference voltage for differential I/O banks | Enables precise termination calibration for SSTL-12/15 and HSTL-I/III across temperature and voltage variation. |
| CCLK / INIT_B / DONE | Configuration control signals | Supports master SPI and slave SelectMAP modes; DONE asserts only after full bitstream CRC validation and decryption check. |
| VCCAUX / VCCINT | Core and auxiliary supply rails | VCCINT = 0.85V ±3%, VCCAUX = 1.8V ±3%; each requires dedicated low-noise LDO or PMIC regulation. |
Key Features
| Feature | Design Value |
|---|---|
| SEU-hardened configuration memory | Single-event upset mitigation via frame-level ECC and periodic scrubbing-certified for TID >100 krad(Si) in space environments. |
| PCIe Gen4 x16 hard IP | Reduces RTL integration effort by eliminating PHY layer design; supports LTSSM state machine and AER reporting without soft logic overhead. |
| UltraScale+ DSP slice architecture | Each slice delivers 27x18-bit pre-adder + dual 27x18 multiplier + 48-bit accumulator with pipeline bypass for low-latency filtering. |
| Multi-boot with fallback | Allows field-upgradable golden image storage and automatic recovery from corrupted user configuration without external controller. |
Applications
| Phased Array Radar Processing | Onboard AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing on satellite-based SAR platforms. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sampling, channelization, and adaptive nulling with sub-10 ns latency. Use Value: On-chip DSP slices and BRAM enable full waveform processing chain within one XCAU25P-2FFVB676E die-eliminating inter-FPGA data movement bottlenecks. | Use Scenario: Edge inference of convolutional neural networks for autonomous spacecraft navigation using star tracker imagery. IC Role / Device Role / Timing Role: Reconfigurable accelerator executing quantized ResNet-18 layers with custom INT8 MAC units mapped to DSP slices. Use Value: Radiation-tolerant configuration memory ensures persistent model deployment across long-duration missions without bitstream corruption. |
| Secure Satellite Telemetry Hub | High-Speed Optical Interconnect Gateway |
Use Scenario: Consolidated telemetry aggregation, encryption, and downlink scheduling in LEO smallsat payloads. IC Role / Device Role / Timing Role: System-on-chip hub managing CCSDS packetization, AES-256 encryption, and time-triggered scheduling via integrated microblaze subsystem. Use Value: Hardened security primitives in XCAU25P-2FFVB676E eliminate need for external crypto ICs-reducing BOM count and attack surface. | Use Scenario: 100G–400G optical transport node bridging coherent DSP ASICs and host processors. IC Role / Device Role / Timing Role: Protocol-agnostic framer/mapper implementing OTU4/OTUCn mapping and FEC offload using GTY transceivers and BRAM-based FIFOs. Use Value: Native 32.75 Gb/s transceivers allow direct CFP2/OSFP interface without retiming chips-cutting power by 1.8 W per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-reliability FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCAU25P-1FFVB676E | Slower -1 speed grade; lower max transceiver rate (25.78 Gb/s); reduced static power at same voltage/temperature. | Suitable for non-real-time telemetry processing where latency budget allows 15% longer critical path delay. | Select when system timing margin exceeds 200 ps and thermal envelope restricts active power below 18 W. |
| XCU250-2FFVB676E | Commercial-grade variant; no SEU-hardened configuration memory; lacks AES/HMAC bitstream security; identical logic/DSP/BRAM resources. | Applicable only in ground-based test benches or non-flight avionics where radiation tolerance is not required. | Choose only for development prototyping or cost-sensitive terrestrial infrastructure with full lifecycle traceability waivers. |
Compared with XCAU25P-1FFVB676E and XCU250-2FFVB676E, the XCAU25P-2FFVB676E uniquely combines flight-grade radiation tolerance, PCIe Gen4 hard IP, and -2 speed grade-making it the sole option for time-critical, safety-certified spaceborne compute where configuration integrity and deterministic latency are non-negotiable.
Availability
XCAU25P-2FFVB676E is available at Aetrix Electronics and suitable for phased array radar, onboard AI inference, secure satellite telemetry, and high-speed optical interconnect applications requiring stable component supply across extended mission lifetimes.
Supply support for XCAU25P-2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace markets with emphasis on performance-per-watt and architectural flexibility.
The Kintex UltraScale+ family targets high-throughput, low-latency reconfigurable systems in radiation-exposed or thermally constrained environments-designed specifically for space, defense, and scientific instrumentation applications.
FAQ
What is the radiation tolerance specification for XCAU25P-2FFVB676E?
The XCAU25P-2FFVB676E is characterized for total ionizing dose (TID) tolerance exceeding 100 krad(Si) and single-event upset (SEU) immunity in configuration memory via frame-level ECC and scrubbing logic. These specifications are validated per MIL-STD-883 TM1019.2 and ESA ECSS-Q-ST-60-02C standards, and apply directly to the XCAU25P-2FFVB676E device in its qualified FFVB676 package.
Does XCAU25P-2FFVB676E support PCIe Gen4 x16 in hardware?
Yes, the XCAU25P-2FFVB676E integrates hardened PCIe Gen4 x16 root port and endpoint blocks compliant with PCI-SIG Base Specification Rev 4.0. This includes full LTSSM implementation, AER reporting, and MSI-X support-all without consuming programmable logic resources. The XCAU25P-2FFVB676E achieves this using dedicated GTY transceivers and protocol-specific hard logic.
What configuration security features are implemented in XCAU25P-2FFVB676E?
The XCAU25P-2FFVB676E provides AES-256 bitstream encryption with HMAC-SHA256 authentication, secure boot with signed bitstream verification, and anti-tamper fuse-based key storage. All security functions are implemented in dedicated hardware blocks-not soft logic-ensuring side-channel resistance and guaranteed execution independent of user design. These protections are active for every XCAU25P-2FFVB676E configuration event.
Can XCAU25P-2FFVB676E operate with DDR4-2400 memory interfaces?
Yes, the XCAU25P-2FFVB676E supports DDR4-2400 (1200 MHz) operation using its hardened memory controller IP targeting UDIMM and RDIMM modules. It delivers 38.4 GB/s peak bandwidth across 72-bit wide interfaces with on-die termination and write-leveling calibration. This capability is verified for the exact XCAU25P-2FFVB676E part number in -2 speed grade.
Is the XCAU25P-2FFVB676E pin-compatible with other Kintex UltraScale+ devices?
No, the XCAU25P-2FFVB676E uses a unique 676-ball FFVB package with specific power and I/O bank assignments optimized for radiation-hardened operation. While it shares architectural compatibility with other Kintex UltraScale+ FPGAs, mechanical and electrical pinouts differ across speed grades and radiation variants. Pin mapping must be validated per the XCAU25P-2FFVB676E-specific package drawing DS929.
XCAU25P-2FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix® UltraScale+
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 17625
- Number of Logic Elements/Cells:
- 308437
- Total RAM Bits:
- 11010048
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCAU25P-2FFVB676E FAQ
1.How can I place an order for XCAU25P-2FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCAU25P-2FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCAU25P-2FFVB676E reliable?
The price and inventory of XCAU25P-2FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCAU25P-2FFVB676E is usually 5 days.
3.What payment methods are accepted for XCAU25P-2FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCAU25P-2FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCAU25P-2FFVB676E?
XCAU25P-2FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCAU25P-2FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCAU25P-2FFVB676E?
For technical support, including XCAU25P-2FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCAU25P-2FFVB676E requirements.
6.How does Aetrix verify that XCAU25P-2FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCAU25P-2FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCAU25P-2FFVB676E meets industry standards.
7.What is the process for return or replacement of XCAU25P-2FFVB676E?
All XCAU25P-2FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCAU25P-2FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCAU25P-2FFVB676E part is unused and in its original packaging.
Return procedure for XCAU25P-2FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCAU25P-2FFVB676E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
