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AMD XCKU025-1FFVA1156C
- Part No.:
- XCKU025-1FFVA1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU025-1FFVA1156C.pdf
- Description:
- IC FPGA 312 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,596
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Product details
Overview
XCKU025-1FFVA1156C from AMD is a Kintex UltraScale FPGA featuring 640K logic cells, 28.8 Gb/s transceiver line rate, and 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging - deployed in high-bandwidth data acquisition systems for real-time signal processing.
For engineers reviewing the XCKU025-1FFVA1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.8V), transceiver count (24 GTY), and system-level timing closure capability with UltraScale architecture.
Technical Context
The XCKU025-1FFVA1156C implements AMD's UltraScale architecture with programmable logic blocks, hardened IP including GTY transceivers, and memory controllers supporting DDR4-2400. It supports multi-gigabit serial protocols including PCIe Gen3 x8 and 10G Ethernet.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device operates at junction temperature up to 100°C and supports -40°C to +100°C industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 640,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| GTY Transceivers | 24 units - enables 24 independent serial lanes up to 28.8 Gb/s each for high-speed interconnect |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, MIPI, and differential standards - allows direct interface to diverse peripherals and memory |
| Memory Interface | DDR4-2400, LPDDR4-4266 - provides validated high-bandwidth memory subsystem for streaming applications |
| Package | 1156-pin FC-FBGA (35×35 mm, 0.8 mm pitch) - defines PCB footprint, thermal dissipation path, and signal integrity constraints |
| Speed Grade | -1 - specifies maximum operating frequency for timing-critical paths under worst-case voltage/temperature conditions |
Pinout & Package
Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.95 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V ±3% to configuration logic, SelectIO, and transceiver reference circuitry |
| MGTAVCC | Transceiver analog supply | Delivers 1.0 V ±3% to GTY analog circuitry; sensitive to ripple and noise |
| CLK_IN_0 | Dedicated clock input | Primary single-ended or differential clock source for global clock network and PLL/MMCM |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Enables scalable logic density and routing efficiency across Kintex/UltraScale family without architectural redesign |
| GTY Transceiver Hard IP | Reduces RTL design effort and verification time for 10G+ serial protocols versus soft transceivers |
| PCIe Gen3 x8 Endpoint | Provides native root complex or endpoint capability without external bridge IC, simplifying host interface |
| Secure Boot with HMAC | Ensures authenticated bitstream loading to prevent unauthorized firmware execution or cloning |
| Dynamic Reconfiguration | Allows partial reconfiguration of logic regions during operation - critical for adaptive compute workloads |
Applications
| Radar Signal Processing | 5G Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom DSP kernels; GTY transceivers interface with ADC/DAC FMC modules at 12+ Gbps. Use Value: 640K logic cells enable parallel FFT and CFAR processing; -1 speed grade ensures deterministic latency under full load. | Use Scenario: Layer 1 PHY acceleration and fronthaul interface in massive MIMO base stations. IC Role / Device Role / Timing Role: Implements CPRI/eCPRI mapping, channel coding, and 24-lane JESD204B interface to RFICs. Use Value: 24 GTY transceivers support simultaneous JESD204B links to multiple RF front-ends; DDR4-2400 sustains burst data buffering. |
| High-Performance Test Equipment | Medical Imaging Accelerator |
Use Scenario: High-speed digital pattern generation and response analysis in ATE platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimulus waveforms while capturing responses with sub-nanosecond timing resolution. Use Value: UltraScale routing resources guarantee <1 ns skew across 200+ I/O banks; -1 speed grade validates timing closure at 800 MHz I/O rates. | Use Scenario: Real-time reconstruction pipeline for MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Accelerates back-projection and denoising kernels; interfaces with GPU via PCIe Gen3 x8 for host coordination. Use Value: Native PCIe Gen3 x8 endpoint eliminates protocol translation latency; secure boot protects proprietary reconstruction IP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-performance computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA1156I | Higher logic capacity (1M cells), faster speed grade (-2), extended temperature range (-40°C to +100°C) | Better suited for thermally demanding environments and larger RTL designs requiring >640K LUTs | Select when additional logic headroom or guaranteed timing margin at elevated temperature is required |
| XCKU040-1FBVA1156C | Different package (1156-pin FCBGA but 33.5×33.5 mm, 0.8 mm pitch); same logic count and speed grade | Requires PCB redesign due to smaller footprint and altered thermal pad layout | Choose only if board space reduction is prioritized and layout revision is feasible |
Compared with XCKU025-1FFVA1156C, the XCKU035-2FFVA1156I offers higher density and thermal robustness at cost premium, while XCKU040-1FBVA1156C trades identical logic performance for compact packaging - neither is pin-compatible, and both require distinct board-level validation.
Availability
XCKU025-1FFVA1156C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-performance test equipment requiring stable component supply across long production cycles.
Supply support for XCKU025-1FFVA1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale FPGA product line delivers optimized performance-per-watt for high-throughput, low-latency signal and packet processing in communications and instrumentation systems.
FAQ
What is the maximum transceiver line rate supported by XCKU025-1FFVA1156C?
The XCKU025-1FFVA1156C supports a maximum transceiver line rate of 28.8 Gb/s per GTY channel. This specification is validated for operation across the full industrial temperature range and applies to all 24 GTY transceivers on the device. The XCKU025-1FFVA1156C achieves this rate using adaptive equalization and clock-data recovery circuits integrated into the GTY hard IP block.
Does XCKU025-1FFVA1156C support PCIe Gen4?
No, XCKU025-1FFVA1156C does not support PCIe Gen4. It implements PCIe Gen3 x8 endpoint or root complex functionality with a maximum link speed of 8 GT/s. PCIe Gen4 support requires GTY transceivers rated for 16 GT/s, which are not present in the XCKU025-1FFVA1156C. The XCKU025-1FFVA1156C remains fully compliant with PCIe Gen3 specifications per AMD UG578 v1.13.
What configuration modes are supported by XCKU025-1FFVA1156C?
XCKU025-1FFVA1156C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is the default and most commonly used method, enabling autonomous boot from external flash. JTAG is used for debugging and programming during development. The XCKU025-1FFVA1156C also supports dual-boot and fallback configurations via dedicated mode pins and internal configuration registers.
Is XCKU025-1FFVA1156C qualified for automotive applications?
No, XCKU025-1FFVA1156C is not AEC-Q100 qualified and is specified only for industrial temperature range (-40°C to +100°C). It lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and qualification documentation. For automotive use, AMD offers the XCKU025-1FFVA1156I variant with extended screening, but the XCKU025-1FFVA1156C itself is intended for industrial and communications infrastructure applications.
What is the purpose of the MGTAVCC supply pin on XCKU025-1FFVA1156C?
The MGTAVCC supply pin on XCKU025-1FFVA1156C delivers 1.0 V ±3% analog power to the GTY transceiver's analog circuitry, including CDR, equalizers, and serializers. It must be isolated from digital supplies and filtered with low-ESR ceramic capacitors. Noise on MGTAVCC directly impacts jitter performance and bit error rate - a critical requirement for reliable operation of the XCKU025-1FFVA1156C at 28.8 Gb/s.
XCKU025-1FFVA1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18180
- Number of Logic Elements/Cells:
- 318150
- Total RAM Bits:
- 13004800
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU025-1FFVA1156C FAQ
1.How can I place an order for XCKU025-1FFVA1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU025-1FFVA1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU025-1FFVA1156C reliable?
The price and inventory of XCKU025-1FFVA1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU025-1FFVA1156C is usually 5 days.
3.What payment methods are accepted for XCKU025-1FFVA1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU025-1FFVA1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU025-1FFVA1156C?
XCKU025-1FFVA1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU025-1FFVA1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU025-1FFVA1156C?
For technical support, including XCKU025-1FFVA1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU025-1FFVA1156C requirements.
6.How does Aetrix verify that XCKU025-1FFVA1156C is sourced from the original manufacturer or authorized distributors?
All XCKU025-1FFVA1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU025-1FFVA1156C meets industry standards.
7.What is the process for return or replacement of XCKU025-1FFVA1156C?
All XCKU025-1FFVA1156C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU025-1FFVA1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU025-1FFVA1156C part is unused and in its original packaging.
Return procedure for XCKU025-1FFVA1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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