AMD XCKU025-1FFVA1156I
- Part No.:
- XCKU025-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU025-1FFVA1156I.pdf
- Description:
- IC FPGA 312 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,233
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Product details
Overview
XCKU025-1FFVA1156I from AMD is a Kintex UltraScale FPGA featuring 640K logic cells, 28.8 Gb/s transceiver line rate, and 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging. It integrates hardened PCIe Gen3 x8, DDR4 memory controller, and 1920 DSP slices for high-throughput data processing in reconfigurable acceleration platforms.
For engineers reviewing the XCKU025-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (PCIe Gen3/SGMII), I/O voltage support (1.2V–1.8V), thermal design power (22W typical), and configuration interface (JTAG/SelectMAP).
Technical Context
The XCKU025-1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ transceivers supporting 28.8 Gb/s PAM4 and NRZ modes, and integrated hard IP blocks including PCIe Gen3 x8 root port and endpoint, 10G Ethernet MAC, and AXI-4 interconnect. It supports multi-voltage I/O banks with independent VCCO and VREF per bank.
Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256 authentication. The device operates across industrial temperature range (–40°C to +100°C junction) and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 640,000 - Enables complex RTL implementations such as multi-channel packet processors or real-time video pipelines. |
| Transceiver Line Rate | 28.8 Gb/s - Supports 100G Ethernet (4×25G) and PCIe Gen4 x4 forward compatibility with NRZ modulation. |
| DSP Slices | 1,920 - Delivers 1.2 TMAC/s at 500 MHz for radar beamforming or AI inference acceleration. |
| Memory Interface | DDR4-2400 @ 64-bit - Provides 19.2 GB/s peak bandwidth for frame buffer or streaming data buffering. |
| I/O Pins | 520 user-configurable - Supports mixed-voltage interfaces (1.2V/1.35V/1.5V/1.8V) with programmable slew and drive strength. |
| Configuration Mode | Master SPI / JTAG - Enables secure, field-upgradable bitstream loading with AES-256 decryption. |
| Thermal Design Power | 22 W typical - Dictates heatsink sizing and airflow requirements in compact 1U server or edge compute chassis. |
Pinout & Package
Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, industrial temperature grade (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering logic fabric and CLBs; requires low-noise decoupling. |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, transceiver reference, and clock management tiles. |
| VCCO_0 | I/O bank supply | Programmable 1.2V–1.8V output driver voltage for Bank 0; sets signal swing and termination. |
| MGTAVCC | Transceiver analog supply | 1.0V analog rail for GTY transceiver PLLs and serializers; sensitive to PSRR and ripple. |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream load failure or CRC error during startup. |
| CCLK | Configuration clock | Input clock for Master SPI mode; frequency ≤50 MHz determines configuration speed and timing margin. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces RTL integration effort and timing closure risk for host interface connectivity in accelerators. |
| UltraScale+ GTY Transceivers | Enables 28.8 Gb/s NRZ links with built-in PRBS generation/analyzer for SerDes validation. |
| AXI-4 Interconnect Fabric | Provides scalable, pipelined, out-of-order transaction support between processor subsystem and custom IP. |
| Partial Reconfiguration Support | Allows runtime swap of functional modules (e.g., crypto engine ↔ FFT core) without full FPGA reboot. |
| AES-256 Bitstream Encryption | Protects intellectual property against physical bitstream extraction and cloning attacks. |
Applications
| 5G Wireless Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Programmable baseband processor handling Layer 1 PHY layer computations with deterministic latency. Use Value: 1920 DSP slices deliver 1.2 TMAC/s at 500 MHz, enabling concurrent 64×64 matrix operations per cycle. | Use Scenario: Offloading HPC workloads (e.g., molecular dynamics, financial Monte Carlo) from CPU to FPGA-accelerated nodes. IC Role / Device Role / Timing Role: Reconfigurable accelerator interfacing via PCIe Gen3 x8 to host CPU with AXI-4 coherent memory mapping. Use Value: 28.8 Gb/s transceivers sustain 4×25G Ethernet or dual 100G interfaces for distributed compute cluster interconnect. |
| Avionics Data Concentrator | Industrial Vision Inspection System |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic protocol gateway with time-triggered scheduling and hardware timestamping. Use Value: Industrial temperature rating (–40°C to +100°C) and SEU-hardened configuration memory ensure reliability in airborne environments. | Use Scenario: High-speed image preprocessing (defect detection, blob analysis) on 100+ MP/s camera streams. IC Role / Device Role / Timing Role: Real-time vision pipeline accelerator with DDR4-2400 frame buffer and pixel-level parallelism. Use Value: 640K logic cells implement >20 parallel image processing lanes with sub-microsecond latency per frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA1156I | Higher logic density (820K LC), faster speed grade (–2), same package and pinout. | Supports larger designs requiring >640K LC or tighter timing closure at higher frequencies. | Select when additional logic capacity or improved timing margin is required without PCB change. |
| XCKU040-2FFVA1156I | 1.1M logic cells, 2400 DSP slices, same FC-FBGA-1156 footprint but different power delivery and thermal profile. | Suitable for next-generation compute-intensive workloads where 1920 DSP slices are insufficient. | Choose only after verifying board-level power integrity and thermal derating for 32W TDP. |
Compared with XCKU025-1FFVA1156I, the XCKU035-2FFVA1156I offers direct pin-compatible scalability, while the XCKU040-2FFVA1156I demands revised thermal and power delivery design due to higher TDP and increased DSP count.
Availability
XCKU025-1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and industrial machine vision systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU025-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through its FPGA, adaptive SoC, and GPU product lines.
The Kintex UltraScale family targets high-performance, cost-optimized reconfigurable systems demanding balanced logic, memory, and I/O resources for networking, test & measurement, and radar applications.
FAQ
What is the maximum supported DDR4 data rate for XCKU025-1FFVA1156I?
The XCKU025-1FFVA1156I supports DDR4-2400 (1200 MHz clock) across a 64-bit interface, delivering up to 19.2 GB/s peak bandwidth. This capability is implemented via dedicated hard memory controller IP and validated for industrial temperature operation with JEDEC-compliant timing parameters.
Does XCKU025-1FFVA1156I support PCIe Gen4?
The XCKU025-1FFVA1156I includes hardened PCIe Gen3 x8 endpoints and root ports. While its GTY transceivers operate up to 28.8 Gb/s, PCIe Gen4 compliance requires Gen4-specific PHY logic and protocol stack not integrated in this device; Gen4 implementation would require soft IP and significant resource overhead.
What configuration modes are supported by XCKU025-1FFVA1156I?
XCKU025-1FFVA1156I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Master SPI is commonly used for fast, single-image boot; JTAG enables debugging and programming during development and field updates with AES-256 encrypted bitstream support.
Is partial reconfiguration supported on XCKU025-1FFVA1156I?
Yes, XCKU025-1FFVA1156I fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logical partitions-such as switching between different filter kernels or protocol engines-without resetting the entire device or disrupting active I/O channels.
What is the operating temperature range for XCKU025-1FFVA1156I?
XCKU025-1FFVA1156I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification applies to the I-grade device variant and is verified under worst-case voltage and process corners per AMD's Kintex UltraScale DC and AC characteristics documentation.
XCKU025-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 18180
- Number of Logic Elements/Cells:
- 318150
- Total RAM Bits:
- 13004800
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU025-1FFVA1156I FAQ
1.How can I place an order for XCKU025-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU025-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU025-1FFVA1156I reliable?
The price and inventory of XCKU025-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU025-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU025-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU025-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU025-1FFVA1156I?
XCKU025-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU025-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU025-1FFVA1156I?
For technical support, including XCKU025-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU025-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU025-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU025-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU025-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU025-1FFVA1156I?
All XCKU025-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU025-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU025-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU025-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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