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AMD XCKU035-1FBVA900C
- Part No.:
- XCKU035-1FBVA900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU035-1FBVA900C.pdf
- Description:
- IC FPGA 468 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,853
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Product details
Overview
XCKU035-1FBVA900C from AMD is a Kintex UltraScale FPGA featuring 352,000 logic cells, 1,440 DSP slices, and 28.4 Mb of block RAM. It supports up to 48 GTY transceivers operating at 32.75 Gb/s, and is packaged in a 900-pin FCBGA with 0.8 mm pitch for high-speed serial interface and compute-accelerated embedded vision applications.
For engineers reviewing the XCKU035-1FBVA900C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, logic density, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal performance in compact FPGA-based signal processing systems.
Technical Context
The XCKU035-1FBVA900C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16, 10/25/100G Ethernet MACs, and DDR4 memory controllers. Its GTY transceivers support PAM4 and NRZ signaling with integrated clock data recovery.
It targets deterministic low-latency processing in radar, 5G fronthaul, and real-time video analytics. Configuration is via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - Enables implementation of complex control + datapath logic in single-chip radar beamforming or multi-channel video pipeline. |
| DSP Slices | 1,440 - Supports concurrent execution of >100 parallel multiply-accumulate operations per clock cycle for AI inference acceleration. |
| Block RAM | 28.4 Mb - Provides on-die buffering for full-frame 4K60 video streams or multi-antenna channel estimation buffers. |
| GTY Transceivers | 48 × 32.75 Gb/s - Enables direct attachment to 100G QSFP28 optical modules without retiming or gearbox ICs. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - Allows native interfacing to image sensors, DDR4 memory, and display interfaces without level shifters. |
| Configuration Interface | Quad-SPI, JTAG, SelectMAP - Supports field-upgradable bitstreams with authenticated secure boot via AES-256 and HMAC-SHA-256. |
Pinout & Package
Package: 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FBGA), 31×31 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, SPI, UART, or GPIO; supports 1.8 V/3.3 V operation for peripheral bridging. |
| HP[0:7][0:71] | High-Performance I/O Bank | Supports DDR4 SDRAM interfaces up to 2400 MT/s and MIPI D-PHY v2.1 for dual 12-bit image sensor inputs. |
| GTY_RXN/TXN[0:47] | Differential Transceiver Pair | Each pair handles full-duplex 32.75 Gb/s NRZ or 58 Gb/s PAM4; includes CDR, gearbox, and PRBS generator. |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | VCCINT = 0.85 V ±3%, VCCAUX = 1.8 V, VCCO = 1.2/1.35/1.8 V - Requires independent low-noise regulation per rail. |
| PROGRAM_B/INIT_B/DONE | Configuration Control | Active-low PROGRAM_B initiates configuration; DONE indicates successful bitstream load and device readiness. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces host-FPGA latency to <1.2 μs and eliminates soft-logic PCIe core resource consumption. |
| DDR4 Memory Controller (2400 MT/s) | Enables direct connection to 64-bit wide DDR4-2400 memory with ECC support for reliable frame buffer storage. |
| UltraScale+ Programmable Logic | Delivers 1.7× higher logic density and 2× DSP throughput vs. 7-series FPGAs for scalable algorithm partitioning. |
| Secure Boot with AES-256 | Prevents unauthorized bitstream loading and ensures runtime integrity via HMAC-SHA-256 signature verification. |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement within ±2°C accuracy for dynamic thermal throttling. |
Applications
| Radar Signal Processing | 5G Wireless Fronthaul |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in automotive and defense radar systems. IC Role / Device Role / Timing Role: Primary compute accelerator handling FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency. Use Value: 48 GTY transceivers enable direct RFIC interface at 24.33 Gb/s per lane, eliminating external SerDes and reducing BOM count by 3 ICs. | Use Scenario: CPRI/eCPRI-to-O-RAN conversion and low-latency packet processing in active antenna units. IC Role / Device Role / Timing Role: Protocol-aware packet processor with time-synchronized 100G Ethernet MAC and precise 10 ns timestamping. Use Value: Hardened 100G MAC + PTPv2 engine reduces timing jitter to <5 ns RMS, meeting O-RAN WG4 fronthaul requirements. |
| Medical Imaging Acceleration | AI Edge Inference Platform |
Use Scenario: Real-time reconstruction of CT/MRI volumetric data using iterative algorithms. IC Role / Device Role / Timing Role: High-throughput coprocessor interfacing to dual 256-bit DDR4 channels and 4× 32.75 Gb/s optical links to sensor arrays. Use Value: 1,440 DSP slices deliver 2.1 TFLOPS FP16 throughput, accelerating reconstruction latency from 800 ms to <90 ms per slice. | Use Scenario: Low-latency object detection and classification on 4K video streams in autonomous mobile robots. IC Role / Device Role / Timing Role: Programmable AI accelerator executing quantized CNN layers with on-chip weight caching and streaming DMA. Use Value: 28.4 Mb block RAM stores 32 MB of model weights, enabling full ResNet-50 inference without off-chip DRAM access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA900E | Higher speed grade (−2), 443K logic cells, 1,680 DSP slices, same package and I/O count. | Better suited for designs requiring >200 MHz system clock or tighter timing closure in 5G baseband processing. | Select when timing margin is critical and power budget allows 12% higher TDP. |
| XCKU025-1FBVA676C | Smaller package (676-pin), 252K logic cells, 1,120 DSP slices, reduced GTY count (32 lanes). | Targeted at cost-sensitive edge AI inference where 100G connectivity is not required. | Choose for space-constrained PCBs needing <25 W TDP and no optical front-panel I/O. |
Compared with XCKU035-1FBVA900C, the XCKU040-2FBVA900E offers higher timing margin at increased power, while the XCKU025-1FBVA676C trades logic capacity and transceiver count for lower cost and thermal footprint-enabling tiered platform scaling across performance bands.
Availability
XCKU035-1FBVA900C is available at Aetrix Electronics and suitable for radar signal processing, 5G fronthaul infrastructure, and medical imaging systems requiring stable component supply over extended production lifecycles.
Supply support for XCKU035-1FBVA900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The XCKU035-1FBVA900C belongs to the Kintex UltraScale+ FPGA family, designed for high-bandwidth, low-latency compute acceleration in communications infrastructure, test & measurement, and real-time imaging systems.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU035-1FBVA900C?
The XCKU035-1FBVA900C supports up to 32.75 Gb/s per GTY transceiver lane in NRZ mode and 58 Gb/s in PAM4 mode. These rates are validated under specified thermal and power conditions per AMD UG578 v1.14. The XCKU035-1FBVA900C achieves this using integrated CDR, linear equalization, and decision feedback equalization circuitry.
Does XCKU035-1FBVA900C support DDR4 memory interfaces?
Yes, XCKU035-1FBVA900C integrates a hardened DDR4 memory controller supporting up to 2400 MT/s across 64-bit wide interfaces with ECC capability. This controller is implemented in the PS (Processing System) and PL (Programmable Logic) domains, and XCKU035-1FBVA900C requires HP I/O banks configured for SSTL12 I/O standard to interface directly with DDR4 components.
What configuration modes are supported by XCKU035-1FBVA900C?
XCKU035-1FBVA900C supports Quad-SPI, JTAG, and SelectMAP configuration modes. Quad-SPI is commonly used for fast, secure bitstream loading from flash memory, while JTAG enables boundary-scan testing and debug. The XCKU035-1FBVA900C also supports fallback configuration and multi-boot with authentication via AES-256 encryption.
Is XCKU035-1FBVA900C pin-compatible with other Kintex UltraScale devices?
No, XCKU035-1FBVA900C is not pin-compatible with other Kintex UltraScale devices due to unique ball map assignments for GTY transceivers, power rails, and configuration signals. While the FBVA900 package is shared across several Kintex UltraScale+ devices, the XCKU035-1FBVA900C has distinct pin functions and I/O bank allocations that require dedicated PCB layout.
What thermal management features does XCKU035-1FBVA900C include?
XCKU035-1FBVA900C includes an on-die thermal monitoring diode with ±2°C accuracy, programmable thermal shutdown thresholds, and dedicated thermal sensor pins (TSENSE) for external analog readout. These features allow real-time junction temperature tracking and dynamic frequency scaling. The XCKU035-1FBVA900C thermal lid design also enhances heat dissipation in conduction-cooled environments.
XCKU035-1FBVA900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU035-1FBVA900C FAQ
1.How can I place an order for XCKU035-1FBVA900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-1FBVA900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-1FBVA900C reliable?
The price and inventory of XCKU035-1FBVA900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-1FBVA900C is usually 5 days.
3.What payment methods are accepted for XCKU035-1FBVA900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-1FBVA900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-1FBVA900C?
XCKU035-1FBVA900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-1FBVA900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-1FBVA900C?
For technical support, including XCKU035-1FBVA900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-1FBVA900C requirements.
6.How does Aetrix verify that XCKU035-1FBVA900C is sourced from the original manufacturer or authorized distributors?
All XCKU035-1FBVA900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-1FBVA900C meets industry standards.
7.What is the process for return or replacement of XCKU035-1FBVA900C?
All XCKU035-1FBVA900C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-1FBVA900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-1FBVA900C part is unused and in its original packaging.
Return procedure for XCKU035-1FBVA900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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