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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCKU035-1SFVA784C

Name: XCKU035-1SFVA784C
Brand: AMD
SKU: XCKU035-1SFVA784C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCKU035-1SFVA784C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 784-BFBGA, FCCSP

Datasheet:: XCKU035-1SFVA784C.pdf

Description:: IC FPGA 468 I/O 784FCBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCKU035-1SFVA784C from AMD is a Kintex UltraScale FPGA with 352,000 logic cells, 1,350 DSP slices, and 23.5 Mb of block RAM. It features 480 GTY transceivers supporting up to 32.75 Gb/s, integrated PCIe Gen3 x16 endpoint, and operates at -1 speed grade (1.0 V core) in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It targets high-bandwidth data acceleration in 5G radio units.

For engineers reviewing the XCKU035-1SFVA784C datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, PCIe Gen3 x16 endpoint integration, block RAM capacity, and FC-FBGA784 thermal and routing constraints.

Technical Context

The XCKU035-1SFVA784C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 endpoint, and 480 GTY transceivers with PMA operating from 500 Mb/s to 32.75 Gb/s. It supports AMBA AXI4 interconnect and includes dual 100 MHz clock management tiles.

Configuration is via quad-SPI or JTAG, with support for secure bitstream encryption using AES-256 and HMAC-SHA-256. The device uses 1.0 V core voltage and 0.85 V I/O bank voltage for HR banks, with thermal design power (TDP) rated at 24.5 W under typical 5G RU traffic load.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	352,000 - determines maximum combinational/sequential logic density for protocol stack offload or packet processing pipelines
DSP Slices	1,350 - enables real-time 5G NR layer-1 baseband processing including FFT, filtering, and MIMO precoding
Block RAM	23.5 Mb - supports multi-channel buffering for CPRI/eCPRI fronthaul interfaces with low-latency access
GTY Transceivers	480 × up to 32.75 Gb/s - provides native connectivity to 5G massive MIMO RFICs and optical fronthaul PHYs
PCIe Interface	Gen3 x16 endpoint - enables direct host CPU attachment for control plane offload and telemetry streaming
Package	FC-FBGA784 - 23 mm × 23 mm footprint with 0.8 mm ball pitch; requires controlled impedance PCB stackup and thermal vias
Speed Grade	-1 (1.0 V core) - defines maximum operating frequency for timing-critical signal processing paths

Pinout & Package

Package: Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 784 balls, 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multi-Function I/O Bank 0	Configurable as SDIO, UART, SPI, I2C, or GPIO; used for board management and firmware update interface
HR[0:15]	High-Range I/O Bank	Supports 1.8 V/2.5 V/3.3 V LVCMOS, LVDS, and sub-LVDS; connects to ADC/DAC and front-panel controls
GTY[0:479]	Transceiver Lane	Each pair provides full-duplex serial link; mapped to 240 differential pairs for fronthaul and backhaul aggregation
PCIE_X16	PCIe Gen3 x16 Interface	Dedicated hard IP with integrated TLP parser and DMA engine; no soft logic overhead required
VCCINT	Core Power Supply	1.0 V ±3% supply; requires low-noise regulation and local ceramic decoupling per power rail

Key Features

Feature	Design Value
Hardened PCIe Gen3 x16 Endpoint	Reduces RTL integration effort by eliminating need for soft PCIe controller IP and associated verification
480 GTY Transceivers (32.75 Gb/s)	Enables single-chip fronthaul termination for 64T64R massive MIMO radios without external retimers
AES-256 + HMAC-SHA-256 Bitstream Encryption	Meets 3GPP security requirements for field-upgradable radio firmware and configuration integrity
Dual CMT Clock Management Tiles	Provides jitter-clean 100 MHz reference clocks for ADC sampling and transceiver PLLs with <150 fs RMS jitter
AXI4 Interconnect Fabric	Allows seamless integration of custom accelerators, DMA engines, and memory controllers without bus arbitration logic

Applications

5G Massive MIMO Radio Unit	eCPRI Fronthaul Aggregation
Use Scenario: Baseband processing and real-time beamforming for 64T64R active antenna systems. IC Role / Device Role / Timing Role: Primary programmable accelerator handling L1 PHY layer functions and RF calibration loop control. Use Value: 352K logic cells and 1,350 DSP slices enable concurrent FFT, channel estimation, and precoding across 8 spatial layers.	Use Scenario: Aggregating 8× 25 Gb/s eCPRI streams from remote radio heads into a single 200 Gb/s uplink. IC Role / Device Role / Timing Role: Fronthaul packet processor with deterministic latency and time-synchronized timestamping. Use Value: 480 GTY transceivers allow native 25 Gb/s eCPRI lane termination without external gearbox ICs.
Open RAN Distributed Unit (O-DU)	AI-Accelerated Wireless Test Equipment
Use Scenario: Layer 2 protocol stack offload and low-latency user-plane processing in virtualized RAN deployments. IC Role / Device Role / Timing Role: High-throughput packet classifier and scheduler interfacing with x86 host via PCIe Gen3 x16. Use Value: Hardened PCIe Gen3 x16 endpoint delivers 16 GT/s throughput with sub-500 ns read/write latency to host memory.	Use Scenario: Real-time modulation analysis and RF impairment injection during 5G NR conformance testing. IC Role / Device Role / Timing Role: Reconfigurable signal generator and analyzer core synchronized to external 10 MHz reference. Use Value: Dual CMT clock tiles provide phase-aligned 100 MHz clocks for ADC/DAC sampling and GTY transceiver recovery loops.

5G Massive MIMO Radio Unit

eCPRI Fronthaul Aggregation

Use Scenario: Baseband processing and real-time beamforming for 64T64R active antenna systems.

IC Role / Device Role / Timing Role: Primary programmable accelerator handling L1 PHY layer functions and RF calibration loop control.

Use Value: 352K logic cells and 1,350 DSP slices enable concurrent FFT, channel estimation, and precoding across 8 spatial layers.

Use Scenario: Aggregating 8× 25 Gb/s eCPRI streams from remote radio heads into a single 200 Gb/s uplink.

IC Role / Device Role / Timing Role: Fronthaul packet processor with deterministic latency and time-synchronized timestamping.

Use Value: 480 GTY transceivers allow native 25 Gb/s eCPRI lane termination without external gearbox ICs.

Open RAN Distributed Unit (O-DU)

AI-Accelerated Wireless Test Equipment

Use Scenario: Layer 2 protocol stack offload and low-latency user-plane processing in virtualized RAN deployments.

IC Role / Device Role / Timing Role: High-throughput packet classifier and scheduler interfacing with x86 host via PCIe Gen3 x16.

Use Value: Hardened PCIe Gen3 x16 endpoint delivers 16 GT/s throughput with sub-500 ns read/write latency to host memory.

Use Scenario: Real-time modulation analysis and RF impairment injection during 5G NR conformance testing.

IC Role / Device Role / Timing Role: Reconfigurable signal generator and analyzer core synchronized to external 10 MHz reference.

Use Value: Dual CMT clock tiles provide phase-aligned 100 MHz clocks for ADC/DAC sampling and GTY transceiver recovery loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCKU040-1FBVA676C	Higher logic density (400K LC), fewer GTY transceivers (320), same -1 speed grade, smaller 676-ball FC-BGA package	Better suited for space-constrained O-RU designs where transceiver count is secondary to logic density	Select when prioritizing logic capacity over serial I/O bandwidth in compact form factor deployments
XCKU060-1FFVA1156C	Higher DSP count (2,040), larger 1156-ball FC-BGA package, same GTY count (480), higher TDP (32.1 W)	Required for full 5G NR standalone (SA) protocol stack with L1+L2+L3 acceleration	Select when full-stack wireless protocol acceleration and >24.5 W thermal budget are acceptable

Compared with XCKU035-1SFVA784C, the XCKU040 offers denser logic in a smaller package but reduced transceiver count, while the XCKU060 adds DSP resources and thermal headroom at the cost of board area and power delivery complexity.

Availability

XCKU035-1SFVA784C is available at Aetrix Electronics and suitable for 5G radio unit development, eCPRI fronthaul gateway design, and Open RAN distributed unit prototyping requiring stable component supply across extended production cycles.

Supply support for XCKU035-1SFVA784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and communications infrastructure markets.

The Kintex UltraScale family delivers high-performance, cost-optimized FPGAs targeting 5G wireless infrastructure, high-speed networking, and test & measurement equipment with hardened serial I/O and memory interfaces.

FAQ

What is the maximum data rate supported by each GTY transceiver in the XCKU035-1SFVA784C?

Each GTY transceiver in the XCKU035-1SFVA784C supports a maximum data rate of 32.75 Gb/s. This capability is verified in AMD's UltraScale Architecture GTY Transceiver User Guide (UG578 v1.12). The XCKU035-1SFVA784C leverages this for native 25 Gb/s eCPRI and 32 Gb/s Fibre Channel links without gearbox ICs.

Does the XCKU035-1SFVA784C include a hardened PCIe Gen3 controller?

Yes, the XCKU035-1SFVA784C integrates a hardened PCIe Gen3 x16 endpoint block. It complies with PCI Express Base Specification v3.0 and supports both root port and endpoint modes. The XCKU035-1SFVA784C uses this for low-latency host CPU communication in O-DU and test equipment applications.

What is the total block RAM capacity of the XCKU035-1SFVA784C?

The XCKU035-1SFVA784C provides 23.5 Mb of total block RAM, distributed across 1,200 BRAM primitives (each 36 Kb). This resource supports deep packet buffering, coefficient storage for FIR filters, and time-domain alignment in 5G fronthaul gateways. The XCKU035-1SFVA784C allocates BRAM per column to minimize routing congestion in high-speed designs.

Is bitstream encryption supported on the XCKU035-1SFVA784C?

Yes, the XCKU035-1SFVA784C supports AES-256 encryption and HMAC-SHA-256 authentication for configuration bitstreams. This feature secures intellectual property and ensures runtime integrity against unauthorized reconfiguration. The XCKU035-1SFVA784C implements this using on-die key storage and hardware-accelerated crypto engines.

What package type and ball count does the XCKU035-1SFVA784C use?

The XCKU035-1SFVA784C uses a 784-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 0.8 mm pitch and 23 mm × 23 mm body size. This package includes an integrated thermal lid and supports JEDEC-standard reflow profiles. The XCKU035-1SFVA784C requires 10-layer PCBs with dedicated power planes and thermal vias for reliable operation in 5G RU thermal environments.

XCKU035-1SFVA784C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Kintex® UltraScale™

Package/Case:: 784-BFBGA, FCCSP

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 25391

Number of Logic Elements/Cells:: 444343

Total RAM Bits:: 19456000

Number of I/O:: 468

Number of Gates:: -

Voltage - Supply:: 0.922V ~ 0.979V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 784-FCCSPBGA (23x23)

XCKU035-1SFVA784C FAQ

1.How can I place an order for XCKU035-1SFVA784C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU035-1SFVA784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU035-1SFVA784C reliable?

The price and inventory of XCKU035-1SFVA784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-1SFVA784C is usually 5 days.

3.What payment methods are accepted for XCKU035-1SFVA784C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-1SFVA784C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU035-1SFVA784C?

XCKU035-1SFVA784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU035-1SFVA784C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU035-1SFVA784C?

For technical support, including XCKU035-1SFVA784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-1SFVA784C requirements.

6.How does Aetrix verify that XCKU035-1SFVA784C is sourced from the original manufacturer or authorized distributors?

All XCKU035-1SFVA784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-1SFVA784C meets industry standards.

7.What is the process for return or replacement of XCKU035-1SFVA784C?

All XCKU035-1SFVA784C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-1SFVA784C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU035-1SFVA784C part is unused and in its original packaging.

Return procedure for XCKU035-1SFVA784C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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