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AMD XCKU035-2FBVA676E
- Part No.:
- XCKU035-2FBVA676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU035-2FBVA676E.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,157
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Product details
Overview
XCKU035-2FBVA676E from AMD is a Kintex UltraScale FPGA with 345,952 logic cells, 1,152 DSP slices, and 28.5 Mb of block RAM; supports PCIe Gen3 x16, DDR4-2400 memory interface, and operates at -2 speed grade in a 676-pin FCBGA package for high-performance compute acceleration and adaptive computing systems.
For engineers reviewing the XCKU035-2FBVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (468 user I/Os), transceiver line rate (16.3 Gb/s), thermal design power (22W typical), and configuration interface (SPIx4, JTAG, SelectMAP).
Technical Context
The XCKU035-2FBVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 root port/endpoint, and integrated 16.3 Gb/s GTY transceivers. It supports multi-rate serial protocols including CPRI, JESD204B/C, and SATA.
Configuration is performed via master SPI or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device uses 1.8 V I/O banks with support for LVDS, SSTL, HSTL, and MIPI D-PHY standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 345,952 - total configurable LUT-based resources for custom digital logic implementation |
| DSP Slices | 1,152 - fixed-point arithmetic units supporting 27×18 multiply-accumulate operations per slice |
| Block RAM | 28.5 Mb - distributed on-chip memory for FIFOs, buffers, and lookup tables |
| User I/O Count | 468 - single-ended or differential I/Os compatible with multiple voltage standards |
| Transceiver Line Rate | 16.3 Gb/s - maximum data rate per GTY transceiver channel for high-speed serial links |
| PCIe Interface | Gen3 x16 - hard IP supporting root port and endpoint modes with full protocol compliance |
| DDR4 Support | DDR4-2400 - 2400 MT/s memory interface with 64-bit data bus width and ECC capability |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FBGA), 27 × 27 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation |
| HP[0:63] | High-Performance I/O bank | Supports DDR4, PCIe, and transceiver reference clocks; 1.2–1.8 V selectable |
| GTY_TXN/GTY_TXP | Transceiver differential output | 16.3 Gb/s serial transmit pair with programmable pre-emphasis and swing control |
| GTY_RXN/GTY_RXP | Transceiver differential input | 16.3 Gb/s serial receive pair with adaptive equalization and clock recovery |
| CONFIG_M[2:0] | Configuration mode select | Determines boot source: SPIx4, BPI, or JTAG; active-low inputs |
| VCCINT | Core supply | 0.85 V ±3% regulated supply for FPGA fabric and logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 IP | Reduces integration effort and latency for host-attached acceleration cards without soft-core overhead |
| 16.3 Gb/s GTY Transceivers | Enables direct connection to 100G Ethernet PHYs, optical modules, and high-speed ADC/DAC interfaces |
| 28.5 Mb Block RAM | Supports large on-die buffering for video frame stores, radar processing pipelines, and packet buffering |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized bitstream loading and ensures runtime integrity verification |
| DDR4-2400 Memory Controller | Delivers 19.2 GB/s peak bandwidth for memory-intensive workloads like AI inference and baseband processing |
Applications
| 5G Wireless Baseband Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time layer-1 signal processing in massive MIMO radio units with low-latency FFT and channel estimation. IC Role / Device Role / Timing Role: Adaptive compute fabric executing reconfigurable numerically intensive kernels synchronized to 30.72 MHz system clock. Use Value: Enables dynamic waveform adaptation and beamforming updates within subframe boundaries using 1,152 DSP slices and 16.3 Gb/s interconnect to RFICs. | Use Scenario: Low-latency inference engine for vision analytics at network edge with real-time object detection and classification. IC Role / Device Role / Timing Role: Programmable accelerator hosting quantized CNN models, interfacing to DDR4-2400 memory and MIPI CSI-2 image sensors. Use Value: Delivers >12 TOPS INT8 throughput using parallelized logic cells and on-chip memory, reducing dependency on external GPUs. |
| High-Speed Test Equipment | Avionics Data Concentrator |
Use Scenario: Multi-channel digital pattern generator and analyzer with deterministic jitter <0.3 ps RMS and 16.3 Gb/s serial stimulus capture. IC Role / Device Role / Timing Role: Timing-critical I/O controller managing synchronous sampling across 48 channels with precise phase alignment. Use Value: Achieves sub-picosecond timing resolution using dedicated clock management tiles and GTY transceiver calibration registers. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers with dual-redundant Ethernet interfaces. IC Role / Device Role / Timing Role: Deterministic packet routing engine with time-triggered scheduling and hardware CRC offload. Use Value: Guarantees <5 µs end-to-end latency and zero packet loss under 100% load using hardened PCIe and DDR4 controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based adaptive compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676E | Higher logic capacity (384,000 LCs), same package and speed grade; +11% DSP slices | Suitable for larger algorithm partitions requiring additional pipeline stages or wider datapaths | Select when design exceeds XCKU035 resource utilization by >15% but retains identical board layout and thermal envelope |
| XCKU025-2FBVA676E | Lower logic count (252,480 LCs), same I/O and transceiver specs; reduced block RAM (19.5 Mb) | Better fit for cost-sensitive embedded vision or sensor fusion where DSP and memory headroom are lower | Choose when application fits within 75% of XCKU035 resources and power budget is constrained to ≤18 W |
Compared with XCKU035-2FBVA676E, the XCKU040-2FBVA676E offers higher compute density without PCB changes, while the XCKU025-2FBVA676E reduces BOM cost and thermal load at the expense of on-chip memory and logic scalability.
Availability
XCKU035-2FBVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge servers, and avionics systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCKU035-2FBVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Kintex UltraScale family delivers optimized balance of logic capacity, I/O bandwidth, and power efficiency for compute-intensive, low-latency applications such as wireless infrastructure and real-time signal processing.
FAQ
What is the maximum supported DDR4 memory speed for the XCKU035-2FBVA676E?
The XCKU035-2FBVA676E supports DDR4-2400 memory interfaces with a 64-bit data bus width and optional ECC. This delivers up to 19.2 GB/s peak bandwidth. The memory controller is hardened and configured during bitstream generation; actual achievable speed depends on PCB layout, termination, and DIMM qualification. XCKU035-2FBVA676E requires external DDR4 memory chips and does not integrate DRAM.
Does the XCKU035-2FBVA676E include built-in PCIe Gen3 support?
Yes, the XCKU035-2FBVA676E integrates a hardened PCIe Gen3 x16 endpoint/root port IP block. It supports both link training and transaction layer protocols without consuming logic resources. XCKU035-2FBVA676E requires external PCIe retimers or switches only for topologies exceeding x16 width or spanning multiple slots.
What configuration methods are supported by the XCKU035-2FBVA676E?
The XCKU035-2FBVA676E supports master SPI (x4), JTAG, and SelectMAP configuration modes. Configuration mode is selected via CONFIG_M[2:0] pins at power-up. Bitstream encryption using AES-256 and HMAC authentication is available for secure boot. XCKU035-2FBVA676E does not support passive serial or BPI configuration in this package variant.
What is the thermal design power (TDP) of the XCKU035-2FBVA676E?
The XCKU035-2FBVA676E has a typical thermal design power of 22 W under worst-case operating conditions (full utilization, DDR4-2400 active, GTY transceivers at 16.3 Gb/s). Power consumption varies with design utilization, I/O activity, and voltage scaling. XCKU035-2FBVA676E requires a heatsink and forced airflow for sustained operation above 70% logic utilization.
Is the XCKU035-2FBVA676E pin-compatible with other Kintex UltraScale devices in the FBVA676 package?
Yes, all Kintex UltraScale FPGAs in the FBVA676 package-including XCKU025, XCKU035, and XCKU040-share identical pinouts and ball maps. This enables footprint compatibility across performance tiers. XCKU035-2FBVA676E can be upgraded to XCKU040-2FBVA676E or downgraded to XCKU025-2FBVA676E without PCB revision, provided power delivery and thermal design accommodate the new device's TDP.
XCKU035-2FBVA676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU035-2FBVA676E FAQ
1.How can I place an order for XCKU035-2FBVA676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-2FBVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-2FBVA676E reliable?
The price and inventory of XCKU035-2FBVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-2FBVA676E is usually 5 days.
3.What payment methods are accepted for XCKU035-2FBVA676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-2FBVA676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-2FBVA676E?
XCKU035-2FBVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-2FBVA676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-2FBVA676E?
For technical support, including XCKU035-2FBVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-2FBVA676E requirements.
6.How does Aetrix verify that XCKU035-2FBVA676E is sourced from the original manufacturer or authorized distributors?
All XCKU035-2FBVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-2FBVA676E meets industry standards.
7.What is the process for return or replacement of XCKU035-2FBVA676E?
All XCKU035-2FBVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-2FBVA676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-2FBVA676E part is unused and in its original packaging.
Return procedure for XCKU035-2FBVA676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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