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AMD XCKU035-2FBVA676I
- Part No.:
- XCKU035-2FBVA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU035-2FBVA676I.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,569
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Product details
Overview
XCKU035-2FBVA676I from AMD is a Kintex UltraScale FPGA featuring 354,928 logic cells, 2,184 DSP slices, 23.5 Mb of block RAM, 96 transceivers supporting up to 16.3 Gb/s, and delivered in a 676-pin FCBGA package with 0.8 mm pitch. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU035-2FBVA676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support (1.2 V/1.35 V/1.8 V), thermal design power (24 W typical), and configuration interface compatibility (SPIx4, BPI, SelectMAP).
Technical Context
The XCKU035-2FBVA676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x8, 10/25/100G Ethernet MACs, and integrated memory controllers for DDR4/LPDDR4. Its transceivers support PAM4 and NRZ modulation schemes with built-in PRBS generators/checkers.
Configuration occurs via dual-boot SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device supports partial reconfiguration and dynamic function exchange, enabling runtime hardware adaptation without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 354,928 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,184 - enables parallel multiply-accumulate operations for FIR filters, FFTs, and matrix math |
| Block RAM | 23.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceivers | 96 × 16.3 Gb/s - supports multi-lane serial protocols including CPRI, eCPRI, and OTN framing |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - allows direct interfacing with sensors, ADCs, and memory devices |
| TDP | 24 W typical - defines thermal solution requirements for sustained operation in enclosed 5G baseband units |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FBGA), 27×27 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric and CLBs |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration logic, PCIe block, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Configurable 1.2/1.35/1.8 V output driver voltage for Bank 0 I/Os |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% powering high-speed SerDes analog circuitry |
| CONFIG_M0–M2 | Mode pins | Set configuration mode at power-up (e.g., SPI x4, BPI, JTAG) |
| INIT_B | Status indicator | Open-drain active-low signal indicating configuration status and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 hard IP | Reduces integration effort and latency for host CPU offload in edge compute accelerators |
| DDR4/LPDDR4 memory controller | Enables direct connection to 2400 MT/s memory without external PHY or glue logic |
| AES-256 bitstream encryption | Protects intellectual property against physical extraction and cloning attacks |
| Partial reconfiguration support | Allows dynamic swapping of functional modules during operation for multi-mode systems |
| UltraScale+ architecture | Delivers 2× logic density and 1.5× DSP performance over previous generation Kintex-7 |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time beam steering and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: Primary data path processor handling OFDM symbol demodulation, MIMO matrix inversion, and precoding. Use Value: 96 transceivers enable full-duplex fronthaul interface to remote radio units while logic fabric executes low-latency signal processing kernels. | Use Scenario: Adaptive nulling and Doppler filtering in airborne phased-array radar systems operating at X-band. IC Role / Device Role / Timing Role: High-throughput digital backend performing pulse compression, CFAR detection, and STAP processing. Use Value: 2,184 DSP slices deliver >1.2 TFLOPS peak compute for real-time adaptive filtering under size, weight, and power constraints. |
| High-Speed Test Equipment | Optical Transport Network Line Cards |
Use Scenario: Protocol-aware pattern generation and error injection for 100G/400G Ethernet compliance testing. IC Role / Device Role / Timing Role: Programmable protocol engine generating deterministic traffic streams and analyzing frame integrity. Use Value: Transceiver PAM4/NRZ dual-mode capability supports both legacy and next-generation optical module validation without hardware change. | Use Scenario: OTN multiplexing/demultiplexing and FEC decoding in metro DWDM line cards. IC Role / Device Role / Timing Role: Line-side transport processor handling OTU4 framing, Reed-Solomon decoding, and GFP encapsulation. Use Value: Hardened 100G Ethernet MACs and 16.3 Gb/s transceivers eliminate need for external retimers and reduce board-level signal integrity complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676I | Higher logic density (452,256 LUTs), +32% DSP slices, same package and pinout | Better suited for multi-standard radio convergence requiring simultaneous 5G NR and LTE processing | Select when additional logic headroom is required for future feature expansion without PCB redesign |
| XCKU025-2FBVA676I | Fewer logic cells (252,256), reduced transceiver count (60), lower TDP (18 W) | Targeted at cost-sensitive small-cell base stations with single-band operation | Choose for lower power and bill-of-materials cost where full XCKU035 capacity is unused |
Compared with XCKU040-2FBVA676I and XCKU025-2FBVA676I, the XCKU035-2FBVA676I delivers optimal balance of transceiver bandwidth, DSP throughput, and logic resources for mid-tier 5G and radar platforms-avoiding overdesign while ensuring margin for algorithm evolution.
Availability
XCKU035-2FBVA676I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCKU035-2FBVA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high I/O bandwidth, advanced transceivers, and hardened IP for communications and signal processing.
FAQ
What is the maximum supported data rate per transceiver lane for the XCKU035-2FBVA676I?
The XCKU035-2FBVA676I supports up to 16.3 Gb/s per transceiver lane in NRZ mode and 32.6 Gb/s in PAM4 mode. This capability is verified in the UltraScale Architecture Transceivers User Guide (UG576 v1.13). The XCKU035-2FBVA676I achieves this using dedicated clocking structures and adaptive equalization to maintain signal integrity over backplane and optical interfaces.
Does the XCKU035-2FBVA676I support DDR4 memory interfaces?
Yes, the XCKU035-2FBVA676I integrates a hardened DDR4/LPDDR4 memory controller supporting data rates up to 2400 MT/s. It includes calibration logic and DQS gating for reliable operation. The XCKU035-2FBVA676I's controller complies with JEDEC DDR4 SDRAM standard JESD79-4 and supports 16-bit and 32-bit data widths with ECC.
What configuration modes are supported by the XCKU035-2FBVA676I?
The XCKU035-2FBVA676I supports multiple configuration modes including SPI x4, BPI, SelectMAP, and JTAG. Mode selection is controlled by CONFIG_M0–M2 pins at power-up. The XCKU035-2FBVA676I also supports dual-boot capability using two separate bitstreams stored in SPI flash for field-upgradable firmware.
Is bitstream encryption available on the XCKU035-2FBVA676I?
Yes, the XCKU035-2FBVA676I implements AES-256 encryption with HMAC-SHA256 authentication for bitstream protection. Keys are stored in on-chip eFUSE and can be programmed during manufacturing. The XCKU035-2FBVA676I enforces secure boot and prevents unauthorized configuration or cloning of the programmed logic design.
What is the thermal design power (TDP) of the XCKU035-2FBVA676I under typical operating conditions?
The XCKU035-2FBVA676I has a typical thermal design power of 24 W, measured under representative 5G baseband workload conditions. This value assumes operation at junction temperature ≤100°C with adequate heatsinking. The XCKU035-2FBVA676I's TDP is specified in the Kintex UltraScale DC and Switching Characteristics Data Sheet (DS892 v1.21).
XCKU035-2FBVA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU035-2FBVA676I FAQ
1.How can I place an order for XCKU035-2FBVA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-2FBVA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-2FBVA676I reliable?
The price and inventory of XCKU035-2FBVA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-2FBVA676I is usually 5 days.
3.What payment methods are accepted for XCKU035-2FBVA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-2FBVA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-2FBVA676I?
XCKU035-2FBVA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-2FBVA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-2FBVA676I?
For technical support, including XCKU035-2FBVA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-2FBVA676I requirements.
6.How does Aetrix verify that XCKU035-2FBVA676I is sourced from the original manufacturer or authorized distributors?
All XCKU035-2FBVA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-2FBVA676I meets industry standards.
7.What is the process for return or replacement of XCKU035-2FBVA676I?
All XCKU035-2FBVA676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-2FBVA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-2FBVA676I part is unused and in its original packaging.
Return procedure for XCKU035-2FBVA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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