My Inquiry
My Account
AMD XCKU035-2FBVA900E
- Part No.:
- XCKU035-2FBVA900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU035-2FBVA900E.pdf
- Description:
- IC FPGA 468 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,258
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU035-2FBVA900E from AMD is a Kintex UltraScale FPGA featuring 345,600 logic cells, 2,160 DSP slices, 28.1 Mb of block RAM, 96 transceivers supporting up to 16.3 Gb/s, and integrated PCIe Gen3 x8 endpoint/root complex functionality. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU035-2FBVA900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, DSP resource count, and PCIe Gen3 integration for low-latency host interface design.
Technical Context
The XCKU035-2FBVA900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DDR4 controller), and multi-rate transceivers using 20nm bulk CMOS process. It supports JTAG, SelectMAP, and Quad-SPI configuration modes.
It delivers deterministic timing closure for designs operating at 750 MHz system clock and supports DDR4-2400 memory interfaces with 16-bit/32-bit bus widths. The device includes dedicated clock management tiles with MMCM and PLL resources for jitter filtering and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 345,600 - total configurable LUTs + flip-flops for logic implementation |
| DSP Slices | 2,160 - fixed-point multiply-accumulate units for signal processing acceleration |
| Block RAM | 28.1 Mb - distributed and block memory for FIFOs, buffers, and lookup tables |
| Transceivers | 96 × 16.3 Gb/s - serial I/O supporting PCIe Gen3, CPRI, and JESD204B protocols |
| PCIe Interface | Gen3 x8 endpoint/root complex - integrated hard IP enabling direct CPU interconnect without external bridge |
| Memory Interface | DDR4-2400 - 16/32-bit interfaces with hardware calibration and error correction support |
Pinout & Package
The XCKU035-2FBVA900E is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for high-speed signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference Clock Input | Provides clean differential reference for transceiver PLLs; requires matched 100 Ω termination |
| HR_IO[0-175] | High-Range I/O Bank | Supports 1.8 V / 2.5 V / 3.3 V single-ended and differential standards (LVDS, TMDS) |
| HP_IO[0-215] | High-Performance I/O Bank | Supports 1.2 V / 1.35 V / 1.5 V / 1.8 V standards including SSTL and HSTL for memory interfacing |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated differential input for PCIe Gen3 PHY synchronization; must meet ±50 ppm stability |
| CONFIG_MODE[0-2] | Configuration Mode Select | Sets boot source: JTAG, SPI, BPI, or SelectMAP; active-high, pulled low by default |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces FPGA logic usage by ~12,000 LUTs and eliminates need for soft-core PCIe stack licensing |
| Multi-rate Transceivers | Enables protocol agility across 1–16.3 Gb/s without re-spinning PCB layout |
| UltraScale Architecture | Delivers 1.7× higher logic density and 2× DSP throughput vs. 7-series FPGAs at same power |
| Integrated Memory Controller | Supports dual-channel DDR4-2400 with ECC, reducing external memory controller IC count |
Applications
| 5G Massive MIMO Baseband | Aerospace Radar Beamforming |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and channel estimation across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary baseband processor handling FFT, filter banks, and adaptive algorithm execution. Use Value: 2,160 DSP slices enable concurrent DPD per antenna while maintaining sub-100 ns latency for closed-loop feedback. | Use Scenario: Phase-coherent beam steering and pulse compression in AESA radar systems. IC Role / Device Role / Timing Role: High-throughput signal processor synchronizing ADC/DAC sampling with deterministic timing via MMCM-controlled clocks. Use Value: 96 transceivers support 32× 12-bit @ 1 GSPS ADC links with JESD204B subclass 1 alignment. |
| Test Equipment Digital Front-End | High-Speed Data Acquisition |
Use Scenario: Protocol-aware packet generation and analysis for 25G Ethernet compliance testing. IC Role / Device Role / Timing Role: Line-rate packet engine with integrated 100G MAC and timestamping logic. Use Value: Hardened Ethernet MAC reduces RTL development time by 6+ months versus soft IP implementation. | Use Scenario: Multi-channel oscilloscope digitizer capturing synchronized waveforms at 1 GS/s per channel. IC Role / Device Role / Timing Role: Central acquisition controller managing DDR4 buffering, trigger arbitration, and PCIe host streaming. Use Value: Integrated PCIe Gen3 x8 enables sustained 7.8 GB/s host transfer, eliminating bottleneck from external DMA controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676E | Higher logic count (384,000 LUTs), fewer transceivers (64), same speed grade and PCIe Gen3 x8 | Better suited for logic-intensive control-plane tasks with reduced serial I/O needs | Select when DSP and transceiver count are secondary to logic capacity and footprint reduction |
| XCKU060-2FFVA1156E | Larger package (1156-pin), 4,320 DSP slices, 120 transceivers, PCIe Gen3 x16 support | Required for full 100G Ethernet line cards or multi-radar fusion processors | Choose when scaling beyond XCKU035-2FBVA900E's 96-transceiver limit or needing x16 PCIe bandwidth |
Compared with XCKU035-2FBVA900E, the XCKU040 offers denser logic in smaller package but less serial I/O headroom, while XCKU060 provides scalable transceiver and PCIe bandwidth at cost of larger board area and thermal envelope.
Availability
XCKU035-2FBVA900E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across long production cycles.
Supply support for XCKU035-2FBVA900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding advanced serial connectivity, memory bandwidth, and signal processing capability without ASIC-level NRE costs.
FAQ
What is the maximum supported data rate for transceivers on the XCKU035-2FBVA900E?
The XCKU035-2FBVA900E transceivers support up to 16.3 Gb/s per lane, validated for protocols including PCIe Gen3, CPRI, and JESD204B. This rate is achievable under specified voltage, temperature, and board layout conditions per UG578. The XCKU035-2FBVA900E does not support PAM4 signaling or rates above 16.3 Gb/s.
Does the XCKU035-2FBVA900E include a hard PCIe Gen3 controller?
Yes, the XCKU035-2FBVA900E integrates a hardened PCIe Gen3 x8 endpoint/root complex controller, eliminating the need for soft IP and reducing logic utilization. This hard IP supports both endpoint and root complex modes and is compliant with PCI Express Base Specification Revision 3.0. The XCKU035-2FBVA900E requires no external PCIe PHY.
What memory interfaces are supported by the XCKU035-2FBVA900E?
The XCKU035-2FBVA900E supports DDR4-2400 (16/32-bit), LPDDR4-2400, and RLDRAM3-1600 memory interfaces using dedicated hard memory controllers. Each interface includes built-in calibration, error detection, and write leveling. The XCKU035-2FBVA900E does not support DDR3 or GDDR6 natively.
Is the XCKU035-2FBVA900E pin-compatible with other Kintex UltraScale devices?
No, the XCKU035-2FBVA900E is not pin-compatible with other Kintex UltraScale FPGAs due to unique 900-pin FCBGA ball map optimized for its I/O bank distribution and power delivery. Migration to XCKU040 or XCKU060 requires PCB redesign. The XCKU035-2FBVA900E has no drop-in replacements within the UltraScale family.
What configuration methods does the XCKU035-2FBVA900E support?
The XCKU035-2FBVA900E supports JTAG, Quad-SPI, and SelectMAP configuration modes. Quad-SPI is most common for production, offering fast parallel loading from flash. JTAG is used for debugging and programming during development. The XCKU035-2FBVA900E does not support BPI or NAND flash configuration.
XCKU035-2FBVA900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU035-2FBVA900E FAQ
1.How can I place an order for XCKU035-2FBVA900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-2FBVA900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-2FBVA900E reliable?
The price and inventory of XCKU035-2FBVA900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-2FBVA900E is usually 5 days.
3.What payment methods are accepted for XCKU035-2FBVA900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-2FBVA900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-2FBVA900E?
XCKU035-2FBVA900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-2FBVA900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-2FBVA900E?
For technical support, including XCKU035-2FBVA900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-2FBVA900E requirements.
6.How does Aetrix verify that XCKU035-2FBVA900E is sourced from the original manufacturer or authorized distributors?
All XCKU035-2FBVA900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-2FBVA900E meets industry standards.
7.What is the process for return or replacement of XCKU035-2FBVA900E?
All XCKU035-2FBVA900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-2FBVA900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-2FBVA900E part is unused and in its original packaging.
Return procedure for XCKU035-2FBVA900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU035-2FBVA900E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
