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AMD XCKU035-2FFVA1156E
- Part No.:
- XCKU035-2FFVA1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU035-2FFVA1156E.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,551
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Product details
Overview
XCKU035-2FFVA1156E from AMD is a Kintex UltraScale FPGA with 354,928 logic cells, 2,124 DSP slices, and 28.2 Mb of block RAM. It features 580 I/O pins in an FCBGA-1156 package, supports transceivers up to 16.3 Gb/s, and targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU035-2FFVA1156E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed, logic density, I/O voltage flexibility (1.2 V to 1.8 V), and thermal performance in compact RF front-end modules.
Technical Context
The XCKU035-2FFVA1156E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3 x16, 10/25/100G Ethernet MAC, and integrated DDR4 memory controllers supporting up to 2,400 MT/s. Its UltraScale+ architecture uses 20 nm process technology and includes dedicated clock management tiles with MMCM and PLL resources.
It supports partial reconfiguration, AXI4-Stream interfaces for real-time data flow, and configuration via Quad-SPI, BPI, or JTAG. The device operates across industrial temperature range (–40°C to +100°C) and meets JESD8-12A I/O standards for 1.2 V, 1.35 V, and 1.8 V signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 354,928 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,124 - enables parallel execution of multiply-accumulate operations for FIR filtering and beamforming |
| Block RAM | 28.2 Mb - supports large on-chip buffering for video frame storage or packet queuing without external memory |
| Transceiver Speed | 16.3 Gb/s - enables direct interface to 25G Ethernet PHYs and CPRI/eCPRI fronthaul links |
| I/O Pins | 580 - provides high-density interconnect for multi-chip carrier boards and high-speed ADC/DAC aggregation |
| Package | FCBGA-1156 - 35 mm × 35 mm body with 1.0 mm ball pitch, optimized for controlled impedance routing and thermal dissipation |
| Operating Temp | –40°C to +100°C - qualified for deployment in outdoor base stations and avionics environmental enclosures |
Pinout & Package
The XCKU035-2FFVA1156E is housed in a 1156-ball Fine-Pitch Column Grid Array (FCBGA) package with 35 mm × 35 mm footprint and 1.0 mm ball pitch. Thermal and power delivery are enhanced by dedicated VCCINT, VCCAUX, VCCO, and GND balls distributed across the array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Supplies 0.85 V core logic voltage; requires low-noise regulation and local decoupling near the ball |
| K17 | VCCAUX | Provides 1.8 V to configuration logic, transceivers, and clock management circuitry |
| R14 | VCCO_34 | IO bank 34 output supply; configurable from 1.2 V to 1.8 V for interfacing with diverse peripheral voltage domains |
| T1 | MGTREFCLK0 | Dedicated differential reference clock input for GTY transceivers; must be routed with matched length and controlled impedance |
| Y19 | PROGRAM_B | Active-low asynchronous reset that initiates configuration reload from external flash or host processor |
| A1 | GND | System ground return path; multiple GND balls ensure low-impedance return for high-speed switching currents |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface applications without soft-core overhead |
| DDR4 Memory Controller | Supports dual-rank, 64-bit wide DDR4-2400 with ECC, enabling reliable high-throughput memory access for baseband processing |
| Partial Reconfiguration | Allows dynamic swapping of functional modules (e.g., modulation schemes) during runtime without full system reset |
| AXI4-Stream Interface | Enables zero-overhead streaming between IP blocks for real-time signal chain pipelines (e.g., FFT → CORDIC → QAM mapper) |
| UltraScale+ Architecture | Delivers 1.5× higher logic density per mm² vs. 7-series, reducing board area for SWaP-constrained radar subsystems |
Applications
| 5G Massive MIMO Radio Unit | Phased Array Radar Processing |
|---|---|
Use Scenario: Real-time beamforming weight calculation and digital pre-distortion for 64T64R active antenna systems. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling L1/L2 PHY layer functions with deterministic latency under 5 µs. Use Value: 2,124 DSP slices enable concurrent execution of 64 independent DPD channels at 122.88 MHz sampling rate. | Use Scenario: Pulse-Doppler processing and CFAR detection in airborne fire-control radar with sub-microsecond response requirements. IC Role / Device Role / Timing Role: Real-time signal processor executing matched filtering, FFT, and angle-of-arrival estimation in hardware-accelerated pipeline. Use Value: 28.2 Mb block RAM buffers 128 chirp waveforms for coherent integration without off-chip DRAM latency. |
| High-Speed Test Equipment | Optical Transport Network Line Card |
Use Scenario: Protocol-aware pattern generation and error injection for 100G/400G Ethernet compliance testing. IC Role / Device Role / Timing Role: Multi-protocol serializer/deserializer engine with precise jitter injection control and PRBS generation. Use Value: 16.3 Gb/s GTY transceivers support native 100G CAUI-4 and 400G DR4 electrical interface mapping. | Use Scenario: OTN framing, FEC decoding, and wavelength switching control in metro DWDM line cards. IC Role / Device Role / Timing Role: System-on-chip controller managing OTU4 mapping, forward error correction, and optical supervisory channel (OSC) interface. Use Value: PCIe Gen3 x16 hard IP enables direct DMA to host CPU for real-time performance monitoring and alarm reporting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Higher logic density (442,560 LC), 2,688 DSP slices, same package and pinout | Better suited for multi-standard radio convergence (5G + Wi-Fi 6E + CBRS) requiring additional soft-core processors | Select when >350K LC headroom is needed for future firmware expansion or dual-RF chain support |
| XCKU025-2FFVA1156E | Fewer logic cells (252,288), 1,536 DSP slices, identical I/O and transceiver specs | Targeted at cost-sensitive 5G small cells where beamforming complexity is reduced to 32T32R | Choose when system-level throughput requirements fit within 250K LC budget and thermal envelope is tighter |
Compared with XCKU035-2FFVA1156E, the XCKU040 offers headroom for evolving protocol stacks while the XCKU025 reduces BOM cost and power draw-both retain identical 1156-ball layout and transceiver compatibility for scalable platform design.
Availability
XCKU035-2FFVA1156E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XCKU035-2FFVA1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale family delivers high-performance, cost-optimized programmable logic for bandwidth-intensive applications such as wireless infrastructure, military radar, and high-speed connectivity where deterministic latency and power efficiency are critical.
FAQ
What is the maximum supported data rate for transceivers on the XCKU035-2FFVA1156E?
The XCKU035-2FFVA1156E integrates GTY transceivers rated for operation up to 16.3 Gb/s per lane. This specification is validated across the industrial temperature range and supports protocols including 25G Ethernet, CPRI, and 100G KR4. The XCKU035-2FFVA1156E transceiver architecture includes built-in clock data recovery and adaptive equalization to maintain signal integrity at full speed.
Does the XCKU035-2FFVA1156E support DDR4 memory interfaces?
Yes, the XCKU035-2FFVA1156E includes a hardened DDR4 memory controller supporting dual-rank, 64-bit wide interfaces at speeds up to 2400 MT/s with optional ECC. This controller is implemented in dedicated silicon and does not consume programmable logic resources. The XCKU035-2FFVA1156E DDR4 interface complies with JEDEC DDR4-2400 specifications and supports write leveling and read leveling calibration.
What is the operating temperature range for the XCKU035-2FFVA1156E?
The XCKU035-2FFVA1156E is specified for industrial temperature operation from –40°C to +100°C case temperature. This rating applies to the full I/O and transceiver functionality, including all 580 user I/Os and 24 GTY transceiver quads. The XCKU035-2FFVA1156E thermal design requires adherence to AMD's recommended PCB copper pour and thermal vias per UG578.
Is partial reconfiguration supported on the XCKU035-2FFVA1156E?
Yes, the XCKU035-2FFVA1156E fully supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logical partitions-such as modulation-specific IP blocks-without resetting the entire device or disrupting active data paths. The XCKU035-2FFVA1156E implements dedicated configuration logic and frame-based bitstream addressing to enable secure, low-latency reconfiguration.
What configuration modes are available for the XCKU035-2FFVA1156E?
The XCKU035-2FFVA1156E supports master SPI, slave serial, slave selectMAP, and JTAG configuration modes. Quad-SPI mode enables fast boot from standard serial flash devices, while JTAG is used for debugging and boundary-scan verification. The XCKU035-2FFVA1156E also supports fallback configuration and multi-boot using internal configuration memory for field-upgradable designs.
XCKU035-2FFVA1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU035-2FFVA1156E FAQ
1.How can I place an order for XCKU035-2FFVA1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-2FFVA1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-2FFVA1156E reliable?
The price and inventory of XCKU035-2FFVA1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-2FFVA1156E is usually 5 days.
3.What payment methods are accepted for XCKU035-2FFVA1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-2FFVA1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-2FFVA1156E?
XCKU035-2FFVA1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-2FFVA1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-2FFVA1156E?
For technical support, including XCKU035-2FFVA1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-2FFVA1156E requirements.
6.How does Aetrix verify that XCKU035-2FFVA1156E is sourced from the original manufacturer or authorized distributors?
All XCKU035-2FFVA1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-2FFVA1156E meets industry standards.
7.What is the process for return or replacement of XCKU035-2FFVA1156E?
All XCKU035-2FFVA1156E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-2FFVA1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-2FFVA1156E part is unused and in its original packaging.
Return procedure for XCKU035-2FFVA1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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