AMD XCKU035-2SFVA784I

Overview

XCKU035-2SFVA784I from AMD is a Kintex UltraScale FPGA with 352,000 logic cells, 1,920 DSP slices, and 24.8 Mb of block RAM. It features 532 user I/Os in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package and operates at -2 speed grade for high-performance industrial and aerospace applications requiring deterministic timing closure.

For engineers reviewing the XCKU035-2SFVA784I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 1.8 V), transceiver line rates up to 16.3 Gb/s, and integrated PCIe Gen3 x8 endpoint/root complex capability.

Technical Context

The XCKU035-2SFVA784I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including UltraScale+ transceivers, memory controllers, and PCIe Gen3 endpoints. It supports DDR4 memory interfaces up to 2400 MT/s and includes 24 transceiver quads capable of 16.3 Gb/s operation.

This device uses 20 nm bulk CMOS process technology and integrates clock management tiles with MMCM and PLL resources supporting jitter filtering and frequency synthesis across multiple domains. Configuration is supported via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU035-2SFVA784I, the XCKU040-2FFVA1156I offers higher scalability for future feature growth, while the XCKU025-2FFVA676I reduces BOM cost and PCB area where full performance headroom is unnecessary.

Availability

XCKU035-2SFVA784I is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and aerospace avionics requiring stable component supply across extended product lifecycles.

Supply support for XCKU035-2SFVA784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and client devices.

The Kintex UltraScale family targets high-bandwidth, low-latency applications in communications, defense, and instrumentation where performance-per-watt and deterministic timing are critical.

FAQ

What is the operating temperature range for XCKU035-2SFVA784I?

The XCKU035-2SFVA784I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is verified per AMD's qualification testing and applies to the -2 speed grade in the SFVA784 package. The device supports thermal monitoring via on-die sensors and includes thermal shutdown protection. XCKU035-2SFVA784I must be mounted with appropriate heatsinking in high-power configurations to maintain reliable operation within this range.

Does XCKU035-2SFVA784I support JESD204B subclass 1?

Yes, XCKU035-2SFVA784I supports JESD204B subclass 1 through its UltraScale+ transceivers, enabling deterministic latency and synchronized multi-device sampling. The device provides dedicated SYNC and SYSREF pins, and its transceiver PMA/PMD layers implement the required lane alignment and framing. XCKU035-2SFVA784I requires proper clock tree design and SYSREF phase alignment to achieve subclass 1 compliance in end systems.

What configuration modes are supported by XCKU035-2SFVA784I?

XCKU035-2SFVA784I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Quad-SPI mode enables fast bitstream loading from serial flash, while JTAG supports boundary-scan testing and debug. Configuration security features include AES-256 bitstream encryption and HMAC authentication. XCKU035-2SFVA784I also supports fallback configuration and dual-boot capability using external flash devices.

Can XCKU035-2SFVA784I interface directly with DDR4-2400 memory?

Yes, XCKU035-2SFVA784I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to 32-bit wide interfaces. It includes calibration logic for write-leveling, read-leveling, and gate training. XCKU035-2SFVA784I supports ECC, address/command parity, and refresh management. Board layout must follow AMD's impedance and routing guidelines to meet timing closure requirements.

Is XCKU035-2SFVA784I pin-compatible with other Kintex UltraScale devices?

No, XCKU035-2SFVA784I is not pin-compatible with other Kintex UltraScale FPGAs due to differences in package size, ball count, and I/O bank arrangement. The SFVA784 package is unique to select members of the family, including XCKU035 and XCKU040 variants. Migration between packages requires PCB redesign. XCKU035-2SFVA784I pinout is fixed and documented in AMD UG570 v1.14, Table 1-12.