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AMD XCKU035-3FBVA676E
- Part No.:
- XCKU035-3FBVA676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU035-3FBVA676E.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,125
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Product details
Overview
XCKU035-3FBVA676E from AMD is a Kintex UltraScale FPGA featuring 352,000 logic cells, 1,440 DSP slices, and 23.5 Mb of block RAM. It supports PCIe Gen3 x16, 24.7 Gb/s transceivers, and operates at -3 speed grade with extended temperature range (-40°C to +100°C). It is deployed in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XCKU035-3FBVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, thermal envelope, power delivery requirements, and package-compatible migration paths within the Kintex UltraScale family.
Technical Context
The XCKU035-3FBVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC), and ultra-low-jitter clock management tiles. It integrates 24 GTY transceivers supporting protocols including CPRI, JESD204B/C, and SATA.
Configuration is performed via quad-SPI or BPI flash, with support for partial reconfiguration and bitstream encryption using AES-256. The device uses SelectIO technology with support for SSTL, HSTL, LVCMOS, and differential standards up to 1.8 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,440 - enables parallel fixed/floating-point computation for radar, beamforming, or video processing |
| Block RAM | 23.5 Mb - provides on-die memory for buffering, FIFOs, or lookup tables without external DRAM |
| Transceivers | 24 GTY - supports 24.7 Gb/s serial links for JESD204B/C, CPRI, or 10G/25G Ethernet interfaces |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency under worst-case voltage/temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| I/O Standards | SSTL-15/18, HSTL-I/II, LVCMOS - enables direct interfacing with DDR3/4, FPGAs, ADCs, and microcontrollers |
Pinout & Package
The XCKU035-3FBVA676E is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and boot interface |
| GTYP/GTYN | High-speed transceiver differential pair | Carries serialized data at up to 24.7 Gb/s; requires controlled impedance routing and AC coupling |
| VRP/VRN | Reference voltage pins | Provide termination reference for differential I/O standards like LVDS and TMDS |
| VCCINT | Core supply | Delivers 0.85 V ±3% to FPGA fabric; requires low-noise, high-current regulation |
| CONFIG_MODE | Configuration mode select | Determines boot source (e.g., QSPI, BPI, or JTAG) during power-up initialization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 block | Reduces integration effort and latency versus soft-core implementations; supports root complex and endpoint roles |
| Partial Reconfiguration | Enables dynamic function swapping without full device reset-critical for mission-critical or multi-mode systems |
| AES-256 Bitstream Encryption | Protects intellectual property against cloning or reverse engineering in untrusted environments |
| UltraScale+ SelectIO Technology | Supports mixed-voltage I/O banks with independent VCCO per bank for heterogeneous interface consolidation |
| Integrated Clock Management | Includes MMCM and PLL with sub-100 fs jitter for high-fidelity sampling clock generation |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and interpolation kernels; GTY transceivers interface with ADC/DAC arrays. Use Value: 24.7 Gb/s transceivers enable direct connection to high-speed RF sampling converters, eliminating intermediate serialization stages. | Use Scenario: Distributed unit (DU) and active antenna unit (AAU) baseband processing in open RAN architectures. IC Role / Device Role / Timing Role: Implements Layer 1 PHY acceleration, CPRI/eCPRI transport, and real-time scheduler logic. Use Value: 1,440 DSP slices deliver >2 TeraMAC/s for massive MIMO matrix operations while maintaining deterministic latency. |
| Medical Imaging Data Hub | Test & Measurement Instrumentation |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound or MRI raw sensor data before GPU offload. IC Role / Device Role / Timing Role: Acts as high-bandwidth data concentrator with JESD204B/C receiver front-end and AXI4-Stream DMA engine. Use Value: 23.5 Mb block RAM buffers bursty sensor streams, enabling gapless acquisition at 10+ Gbps aggregate throughput. | Use Scenario: High-resolution oscilloscope or protocol analyzer with multi-lane serial decode capability. IC Role / Device Role / Timing Role: Performs real-time pattern matching, timestamping, and protocol parsing on 24.7 Gb/s captured lanes. Use Value: -3 speed grade ensures reliable operation at full sample depth and maximum trigger rate under thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676I | Lower speed grade (-2), same package, 400K logic cells, higher power consumption | Better suited for cost-sensitive designs where timing margin exceeds requirement | Select when thermal budget allows higher static power and design does not require -3 timing headroom |
| XCKU060-3FFVA1156E | Larger package (1156-pin FCBGA), 560K logic cells, 32 GTY transceivers, higher I/O count | Required for designs scaling beyond 352K LUTs or needing >24 transceivers | Choose when migrating upward in logic density or serial I/O count while retaining UltraScale+ architecture compatibility |
Compared with XCKU035-3FBVA676E, the XCKU040-2FBVA676I trades timing margin for cost and the XCKU060-3FFVA1156E adds logic capacity and transceivers at the expense of board space and thermal complexity-both maintain architectural continuity but address distinct scalability vectors.
Availability
XCKU035-3FBVA676E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and medical imaging systems requiring stable component supply across long production lifecycles.
Supply support for XCKU035-3FBVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale family delivers optimized performance-per-watt for compute-intensive, I/O-rich applications such as wireless infrastructure, test equipment, and aerospace avionics.
FAQ
What is the maximum transceiver data rate supported by the XCKU035-3FBVA676E?
The XCKU035-3FBVA676E supports GTY transceivers with a maximum data rate of 24.7 Gb/s. This rate is validated for protocols including JESD204B/C, CPRI, and 10G/25G Ethernet. The -3 speed grade ensures reliable operation at this rate across the full industrial temperature range. Designers must follow AMD's IBIS-AMI modeling guidelines and PCB stackup recommendations to achieve signal integrity compliance.
Does the XCKU035-3FBVA676E support partial reconfiguration?
Yes, the XCKU035-3FBVA676E fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of functional modules without resetting the entire device. Use cases include runtime protocol switching in test equipment or adaptive filtering in radar systems. Implementation requires dedicated P-block constraints and bitstream partitioning-XCKU035-3FBVA676E hardware resources are allocated accordingly during place-and-route.
What configuration modes are available for the XCKU035-3FBVA676E?
The XCKU035-3FBVA676E supports multiple configuration modes: Quad-SPI flash, BPI flash, JTAG, and SelectMAP. Mode selection is controlled by the CONFIG_MODE pins at power-up. Quad-SPI is most common for production deployment due to density and reliability; JTAG is used for debug and programming. All modes are natively supported in Vivado, and XCKU035-3FBVA676E bitstream authentication can be enabled independently per mode.
Is the XCKU035-3FBVA676E pin-compatible with other Kintex UltraScale devices?
No, the XCKU035-3FBVA676E is not pin-compatible with other Kintex UltraScale FPGAs-even those in the same 676-pin FCBGA package variant-due to differing I/O bank assignments, power pin allocations, and transceiver placement. Migration between variants requires PCB redesign. XCKU035-3FBVA676E pinout is fixed and documented in AMD UG570; no alternate pin mappings are supported.
What thermal management guidance applies to the XCKU035-3FBVA676E?
The XCKU035-3FBVA676E is rated for -40°C to +100°C case temperature and requires a thermal solution capable of dissipating up to 22 W typical power under full load. AMD recommends a 4-layer or greater PCB with internal copper planes, thermal vias under the package, and an externally mounted heatsink. Thermal simulation using XCKU035-3FBVA676E power estimates from XPE is mandatory before final layout-actual junction temperature must remain below 125°C.
XCKU035-3FBVA676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU035-3FBVA676E FAQ
1.How can I place an order for XCKU035-3FBVA676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-3FBVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-3FBVA676E reliable?
The price and inventory of XCKU035-3FBVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-3FBVA676E is usually 5 days.
3.What payment methods are accepted for XCKU035-3FBVA676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-3FBVA676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-3FBVA676E?
XCKU035-3FBVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-3FBVA676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-3FBVA676E?
For technical support, including XCKU035-3FBVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-3FBVA676E requirements.
6.How does Aetrix verify that XCKU035-3FBVA676E is sourced from the original manufacturer or authorized distributors?
All XCKU035-3FBVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-3FBVA676E meets industry standards.
7.What is the process for return or replacement of XCKU035-3FBVA676E?
All XCKU035-3FBVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-3FBVA676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-3FBVA676E part is unused and in its original packaging.
Return procedure for XCKU035-3FBVA676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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