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AMD XCKU035-3FBVA900E
- Part No.:
- XCKU035-3FBVA900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU035-3FBVA900E.pdf
- Description:
- IC FPGA 468 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,771
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Product details
Overview
XCKU035-3FBVA900E from AMD is a Kintex UltraScale FPGA featuring 384K logic cells, 2,160 DSP slices, and 28.4 Mb of block RAM. It supports up to 48 GTY transceivers operating at 12.5 Gb/s and targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU035-3FBVA900E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O voltage flexibility (1.2 V to 1.8 V), thermal performance in FBGA900 packaging, and support for PCIe Gen3 x16 endpoint configurations.
Technical Context
The XCKU035-3FBVA900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3, 10/25/100G Ethernet MACs, and DDR4 memory controllers. Its GTY transceivers integrate CDR, gearbox, and PRBS generators for serial protocol compliance.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device operates across industrial temperature range (–40°C to +100°C junction) and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 384,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,160 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 28.4 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage |
| GTY Transceivers | 48 lanes @ 12.5 Gb/s - supports multi-lane protocols including CPRI, JESD204B/C, and 100GbE |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interfacing to ADCs, DACs, and memory devices |
| Memory Interface | DDR4-2400, LPDDR4-4266 - allows high-throughput streaming to external memory without external bridge ICs |
Pinout & Package
Package: 900-pin Fine-Pitch Ball Grid Array (FBGA), 31×31 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8 V operation only |
| HP[0:71] | High-Performance I/O Bank | Supports 1.2 V to 1.8 V signaling; used for DDR4 address/control and high-speed SerDes reference clocks |
| GTY_RXN/TXN[0:47] | Differential Transceiver Pair | AC-coupled inputs/outputs for 10–12.5 Gb/s serial links; requires precise PCB trace length matching |
| VCCINT | Core Power Supply | 0.95 V ±3% supply for logic fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 1.8 V supply for configuration logic, PCIe hard IP, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface applications |
| UltraScale+ SelectIO Technology | Enables simultaneous multi-standard I/O operation across 12 banks with independent voltage control |
| Partial Reconfiguration Support | Allows runtime logic module swaps without full device reset-critical for adaptive radar and software-defined radio |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized bitstream loading and ensures firmware integrity in deployed systems |
| Thermal Monitoring Diode | On-die sensor feeds real-time junction temperature to system management controller for dynamic throttling |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time baseband signal processing for 64T64R antenna arrays with massive parallel FFTs and channel estimation. IC Role / Device Role / Timing Role: Primary compute accelerator handling layer-1 PHY functions, synchronized to 30.72 MHz and 122.88 MHz reference clocks. Use Value: Delivers deterministic latency under 5 µs for beam steering updates using 2,160 DSP slices and distributed memory architecture. | Use Scenario: Adaptive digital beamforming in X-band active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Real-time phase/weight computation engine interfacing to 128-channel ADC/DAC front-end via JESD204C. Use Value: Achieves >60 dB sidelobe suppression using 384K logic cells for custom filter banks and calibration logic. |
| High-Speed Test Equipment | Medical Imaging Data Acquisition |
Use Scenario: Multi-channel arbitrary waveform generation and real-time signal analysis in automated test equipment (ATE). IC Role / Device Role / Timing Role: Central signal processor managing 32-channel 1 GS/s digitizers and 16-channel 1.25 GS/s AWGs via DDR4 memory buffers. Use Value: Enables sub-nanosecond timestamp alignment across channels using deterministic clock routing and internal delay calibration. | Use Scenario: Raw data aggregation and preprocessing from 256-channel ultrasound transducer arrays. IC Role / Device Role / Timing Role: High-throughput data concentrator with lossless compression and beam-scan line buffering before GPU transfer. Use Value: Sustains 12.8 GB/s sustained bandwidth using 48 GTY lanes and DDR4-2400 memory controller for real-time image reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676I | Fewer logic cells (355K), lower speed grade (–2), smaller 676-pin package, no GTY transceivers (only GTH) | Limited to ≤10 Gb/s serial protocols; unsuitable for JESD204C or 100GbE line-rate processing | Select when cost-sensitive designs require PCIe Gen3 x8 and DDR4-2133 only, with relaxed thermal envelope |
| XCKU115-2FLVD1924E | Higher density (663K LC), more GTY lanes (64), larger 1924-pin package, higher power consumption | Required for multi-100G transport or AI inference acceleration where XCKU035-3FBVA900E lacks logic or memory bandwidth | Choose when scaling beyond 384K logic cells or needing ≥64 GTY lanes for optical interconnect aggregation |
Compared with XCKU040-2FBVA676I and XCKU115-2FLVD1924E, the XCKU035-3FBVA900E delivers optimal balance of transceiver count, logic density, and thermal footprint for mid-tier 5G and radar platforms-avoiding overdesign while meeting JESD204C and DDR4-2400 requirements.
Availability
XCKU035-3FBVA900E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU035-3FBVA900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Kintex UltraScale family delivers optimized cost-performance for applications demanding high I/O bandwidth, hardened serial connectivity, and deterministic real-time processing-targeting wireless infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU035-3FBVA900E?
The XCKU035-3FBVA900E supports GTY transceivers rated up to 12.5 Gb/s per lane. This rating is validated across industrial temperature range and applies to protocols including JESD204B/C, CPRI, and 100GbE KR4. The actual achievable rate depends on PCB channel loss, reference clock jitter, and equalization settings configured in Vivado.
Does XCKU035-3FBVA900E support PCIe Gen4?
No, XCKU035-3FBVA900E does not support PCIe Gen4. It integrates hardened PCIe Gen3 x16 endpoint and root port controllers. Gen4 capability requires UltraScale+ MPSoC or Versal ACAP devices. For XCKU035-3FBVA900E, PCIe link training is limited to Gen3 speeds (8 GT/s) with automatic fallback to Gen1/Gen2 if required.
What is the recommended configuration mode for XCKU035-3FBVA900E in production systems?
The recommended configuration mode for XCKU035-3FBVA900E in production is QSPI x4 master SPI mode using an external flash device. This method supports encrypted bitstream loading, dual-image fallback, and fast startup (<100 ms). JTAG is reserved for debug and programming during development-not for field deployment.
Can XCKU035-3FBVA900E interface directly to DDR4-2666 memory?
No, XCKU035-3FBVA900E's integrated DDR4 memory controller is specified up to DDR4-2400 (1200 MHz). While some boards may achieve marginal stability at 2666 MT/s under ideal conditions, AMD does not guarantee timing closure or signal integrity beyond 2400 MT/s. Designs requiring DDR4-2666 must use external memory controllers or select higher-tier FPGAs.
Is partial reconfiguration supported on XCKU035-3FBVA900E, and what tools enable it?
Yes, partial reconfiguration is fully supported on XCKU035-3FBVA900E. It is enabled through Vivado Design Suite using the Reconfigurable Module (RM) flow. The feature requires specific floorplanning, checkpoint-based synthesis, and bitstream stitching-validated for use cases like adaptive filtering and protocol switching in radar and communications systems.
XCKU035-3FBVA900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 25391
- Number of Logic Elements/Cells:
- 444343
- Total RAM Bits:
- 19456000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU035-3FBVA900E FAQ
1.How can I place an order for XCKU035-3FBVA900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU035-3FBVA900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU035-3FBVA900E reliable?
The price and inventory of XCKU035-3FBVA900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU035-3FBVA900E is usually 5 days.
3.What payment methods are accepted for XCKU035-3FBVA900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU035-3FBVA900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU035-3FBVA900E?
XCKU035-3FBVA900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU035-3FBVA900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU035-3FBVA900E?
For technical support, including XCKU035-3FBVA900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU035-3FBVA900E requirements.
6.How does Aetrix verify that XCKU035-3FBVA900E is sourced from the original manufacturer or authorized distributors?
All XCKU035-3FBVA900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU035-3FBVA900E meets industry standards.
7.What is the process for return or replacement of XCKU035-3FBVA900E?
All XCKU035-3FBVA900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU035-3FBVA900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU035-3FBVA900E part is unused and in its original packaging.
Return procedure for XCKU035-3FBVA900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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