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AMD XCKU040-1FBVA676I
- Part No.:
- XCKU040-1FBVA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU040-1FBVA676I.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,349
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Product details
Overview
XCKU040-1FBVA676I from AMD is a Kintex UltraScale FPGA with 385,200 logic cells, 2,196 DSP slices, and 28.4 Mb of block RAM. It features 480 GTY transceivers supporting up to 32.75 Gb/s, and operates at -1 speed grade (1.0 V core, industrial temperature range). It is used in high-bandwidth data acquisition systems requiring deterministic low-latency processing.
For engineers reviewing the XCKU040-1FBVA676I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, available BRAM depth, logic cell utilization margin, and thermal performance under sustained 28G operation.
Technical Context
The XCKU040-1FBVA676I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 PHY), and ultra-low-jitter GTY transceivers. Its configuration uses dual-boot fallback with AES-256 bitstream encryption and HMAC authentication.
It supports JTAG, SelectMAP, and Quad-SPI configuration interfaces. The device includes integrated system monitoring (on-die temperature, supply voltage, and current sensors) and dynamic power management via partial reconfiguration and clock gating across SLR boundaries.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 385,200 - usable LUT/FF pairs for complex RTL implementation |
| DSP Slices | 2,196 - fixed-point and floating-point arithmetic units with 27×18 multipliers |
| Block RAM | 28.4 Mb - configurable as 18 Kb or 36 Kb primitives for FIFOs, buffers, or lookup tables |
| GTY Transceivers | 480 lanes - each supports 1.6–32.75 Gb/s with PMA/FEC/PCS layers |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - supports DDR4-2400, PCIe Gen3, and DisplayPort 1.4 |
| Speed Grade | -1 - guarantees timing closure at 1.0 V core, -40°C to +100°C junction temperature |
Pinout & Package
Package: 676-pin Flip-Chip Ball Grid Array (FBGA), 27×27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I²C, or GPIO; connects to PS-side peripherals |
| HR Bank 65 | High-Range I/O | Supports 1.8 V/2.5 V/3.3 V signaling; used for DDR4 address/control and peripheral interfaces |
| HP Bank 53 | High-Performance I/O | 1.2 V/1.35 V/1.5 V compatible; optimized for DDR4 data bus and high-speed SerDes reference clocks |
| GTY_RXN/P[0:479] | Transceiver Differential Input | AC-coupled differential pairs for 10–32.75 Gb/s serial protocols |
| VCCINT | Core Power Supply | 1.0 V ±3% regulated input feeding FPGA fabric and CLB logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Controller | Reduces RTL integration effort and ensures compliance without external bridge IC |
| Integrated DDR4 Memory Controller | Supports dual-rank 72-bit wide DDR4-2400 with ECC, eliminating external memory controller IC |
| Partial Reconfiguration Support | Enables runtime logic swapping without full device reset, critical for mission-critical fault recovery |
| AES-256 + HMAC Bitstream Security | Prevents cloning and unauthorized configuration; required for defense and medical applications |
| System Monitor with On-Die Sensors | Provides real-time thermal and voltage telemetry for adaptive thermal throttling and power budgeting |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse compression on airborne SAR platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and interpolation kernels; GTY transceivers interface to ADC/DAC JESD204B links. Use Value: 480 GTY lanes enable simultaneous multi-channel JESD204B capture at 12.5 Gbps per lane, reducing front-end analog complexity. | Use Scenario: Distributed unit (DU) baseband processing for 64T64R massive MIMO radio units with fronthaul latency <100 μs. IC Role / Device Role / Timing Role: Implements CPRI/eCPRI packet processing, layer-1 acceleration, and real-time channel estimation using DSP slices and BRAM. Use Value: 2,196 DSP slices deliver >2.1 TMAC/s for real-time matrix inversion and precoding under deterministic timing. |
| High-Frequency Trading Engine | Medical CT Image Reconstruction |
Use Scenario: Sub-microsecond order execution pipeline with hardware-accelerated risk checking and market data parsing. IC Role / Device Role / Timing Role: Configurable logic processes FIX/FAST protocol decoding; GTY transceivers connect to low-latency network adapters. Use Value: Deterministic 1.2 ns input-to-output path delay enables consistent sub-500 ns round-trip latency across all trading cores. | Use Scenario: Real-time back-projection and iterative reconstruction of 512×512 sinogram data during CT scan acquisition. IC Role / Device Role / Timing Role: Executes parallelized FBP and MBIR algorithms using BRAM-based line buffers and DSP-intensive filtering. Use Value: 28.4 Mb block RAM provides on-chip storage for full sinogram buffering, eliminating off-chip DRAM bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FBVA676E | Faster speed grade (-2), 1.1 V core, commercial temp range (0°C to +85°C) | Better timing margin for high-frequency designs; not rated for industrial ambient | Select when operating environment is controlled and maximum clock frequency is prioritized over temperature range |
| XCKU035-1FBVA676I | Reduced capacity: 285,000 logic cells, 1,728 DSP slices, 21.1 Mb BRAM | Limited for large-scale beamforming or full 64T64R MIMO; lower power consumption | Select when application fits within smaller resource footprint and thermal/power envelope is constrained |
Compared with XCKU040-2FBVA676E, the XCKU040-1FBVA676I trades 10% higher static power for guaranteed operation at 100°C junction; compared with XCKU035-1FBVA676I, it delivers 35% more logic and 27% more BRAM for scalable algorithm partitioning without external memory expansion.
Availability
XCKU040-1FBVA676I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband infrastructure, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU040-1FBVA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale family targets bandwidth- and compute-intensive applications where deterministic latency, hardened I/O, and security are mandatory - including aerospace, telecom infrastructure, and diagnostic imaging.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU040-1FBVA676I?
The XCKU040-1FBVA676I supports up to 32.75 Gb/s per GTY transceiver lane. This rate is validated under industrial temperature conditions and requires proper PCB stack-up, AC coupling, and reference clock jitter below 300 fs RMS. The XCKU040-1FBVA676I achieves this using its integrated PMA with adaptive equalization and decision feedback equalization (DFE).
Does XCKU040-1FBVA676I include a hard processor system (PS)?
No, the XCKU040-1FBVA676I is a fabric-only FPGA and does not integrate a hard ARM processor subsystem. It belongs to the Kintex UltraScale series, which lacks the Zynq-style PS-PL integration. For applications requiring embedded processing, the XCKU040-1FBVA676I must be paired with an external microprocessor or use soft-core solutions like MicroBlaze running in the PL fabric.
What configuration modes are supported by XCKU040-1FBVA676I?
The XCKU040-1FBVA676I supports JTAG, SelectMAP, and Quad-SPI master configuration modes. Quad-SPI is commonly used for single-image boot from flash, while JTAG enables debugging and programming during development. The XCKU040-1FBVA676I also supports dual-boot fallback with secure authentication for field updates and fail-safe recovery.
Is XCKU040-1FBVA676I pin-compatible with other Kintex UltraScale devices in the same package?
No, the XCKU040-1FBVA676I is not pin-compatible with other Kintex UltraScale devices in the FBVA676 package. While package footprint and ball map are identical, I/O bank assignments, voltage requirements, and transceiver placement differ across density variants. Migration between XCKU035 and XCKU040 requires board-level redesign due to incompatible I/O banking and power delivery constraints.
What is the industrial temperature rating for XCKU040-1FBVA676I?
The XCKU040-1FBVA676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the -1 speed grade and is verified per JEDEC JESD22-A104. Thermal design must maintain junction temperature within this range using appropriate heatsinking and airflow, especially under sustained GTY transceiver activity at 28+ Gb/s.
XCKU040-1FBVA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU040-1FBVA676I FAQ
1.How can I place an order for XCKU040-1FBVA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1FBVA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1FBVA676I reliable?
The price and inventory of XCKU040-1FBVA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1FBVA676I is usually 5 days.
3.What payment methods are accepted for XCKU040-1FBVA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1FBVA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1FBVA676I?
XCKU040-1FBVA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1FBVA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1FBVA676I?
For technical support, including XCKU040-1FBVA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1FBVA676I requirements.
6.How does Aetrix verify that XCKU040-1FBVA676I is sourced from the original manufacturer or authorized distributors?
All XCKU040-1FBVA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1FBVA676I meets industry standards.
7.What is the process for return or replacement of XCKU040-1FBVA676I?
All XCKU040-1FBVA676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1FBVA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1FBVA676I part is unused and in its original packaging.
Return procedure for XCKU040-1FBVA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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