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AMD XCKU040-1FBVA900C
- Part No.:
- XCKU040-1FBVA900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU040-1FBVA900C.pdf
- Description:
- IC FPGA 468 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,873
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Product details
Overview
XCKU040-1FBVA900C from Xilinx is a high-performance Kintex UltraScale FPGA featuring 443,200 logic cells, 2,520 DSP slices, and 32.1 Mb of block RAM, designed for high-bandwidth data processing in 5G infrastructure, radar signal processing, and high-end test equipment.
For engineers reviewing the XCKU040-1FBVA900C datasheet, pinout, applications, or equivalent options, this device supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and multi-gigabit transceivers operating up to 16.3 Gbps - critical for deterministic latency and throughput in real-time embedded systems.
Technical Context
The XCKU040-1FBVA900C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe, memory controllers, transceivers), and clock management tiles supporting ultra-low-jitter operation. It integrates 24 GTY transceivers with built-in PRBS generators/checkers and adaptive equalization for serial link integrity.
Its configuration architecture uses dual-boot capability with fallback support via SPIx4 or BPI flash, and secure bitstream encryption with AES-256 and HMAC authentication ensures tamper-resistant deployment in industrial and defense applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - enables complex RTL designs including multi-channel FFT engines or packet classification pipelines |
| DSP Slices | 2,520 - supports simultaneous 256-tap FIR filtering across 8 channels at 400 MHz sample rate |
| Block RAM | 32.1 Mb - sufficient for dual-port buffering of 4K60 video frames or deep packet inspection tables |
| GTY Transceivers | 24 × 16.3 Gbps - delivers 391.2 Gbps aggregate serial bandwidth for JESD204B/C ADC/DAC interfacing |
| Memory Interface | DDR4-2400 (x72) - provides 172.8 GB/s peak memory bandwidth for streaming sensor fusion workloads |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - supports direct connection to image sensors, RFICs, and memory without level-shifting |
| Package | FBGA900 (27×27 mm, 0.8 mm pitch) - compatible with standard HDI PCB processes and thermal vias for 15W TDP dissipation |
Pinout & Package
The XCKU040-1FBVA900C is housed in a 900-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch and 27×27 mm body size. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO banks and thermal balls in the center array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO - connects directly to PMIC, eMMC, or debug peripherals |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4, QDR, and source-synchronous interfaces up to 1.6 Gbps with dynamic phase alignment |
| GTY_RXN/P[0:23] | Differential Transceiver Input | Accepts AC-coupled 100 Ω differential signals compliant with PCIe Gen3, CPRI, and SATA standards |
| GTY_TXN/P[0:23] | Differential Transceiver Output | Drives 100 Ω differential traces with programmable pre-emphasis and swing control for channel loss compensation |
| CLK_IN1_N/P | Dedicated Clock Input | Feeds MMCM/PLL clock networks with sub-100 fs jitter - required for sampling clock generation in ADC interfaces |
| PROGRAM_B | Configuration Initiation | Active-Low asynchronous reset that triggers full reconfiguration from external flash or JTAG |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale Architecture | Column-based routing with dedicated interconnect for predictable timing closure on 500+ MHz designs |
| Hardened PCIe Gen3 x16 Block | Reduces integration effort by eliminating soft-core PCIe IP licensing and verification overhead |
| Integrated Memory Controller | Supports DDR4, DDR3L, LPDDR4 with ECC and AXI4 interface - eliminates need for external memory controller ASIC |
| Secure Boot with AES-256 | Prevents unauthorized firmware execution and protects intellectual property in deployed systems |
| Partial Reconfiguration Support | Enables runtime hardware updates (e.g., waveform changes in SDR) without system reset or downtime |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time uplink/downlink precoding and channel estimation across 64+ antenna elements in sub-6 GHz 5G NR base stations. IC Role / Device Role / Timing Role: Primary compute accelerator executing massive parallel matrix operations using DSP slices and BRAM-based buffers. Use Value: Delivers >2.1 TMAC/s sustained throughput while meeting 100 μs air-interface latency constraints via deterministic AXI interconnect. | Use Scenario: Coherent integration and adaptive nulling across phased-array radar receive channels in airborne surveillance systems. IC Role / Device Role / Timing Role: High-precision digital beamformer implementing real-time STAP and Doppler filtering with sub-nanosecond clock domain alignment. Use Value: Enables 48-channel simultaneous processing at 12-bit/1 GSPS with <1 ps inter-channel skew using GTY transceivers and MMCM jitter cleaning. |
| Automated Test Equipment (ATE) | High-Resolution Medical Imaging |
Use Scenario: Multi-site parallel functional testing of SoCs with synchronized digital pattern generation and high-speed response capture. IC Role / Device Role / Timing Role: Timing controller and protocol engine managing JTAG, STIL, and IEEE 1149.1/6 compliance with picosecond-level edge placement accuracy. Use Value: Achieves 400 Mbps vector rate over 512-pin DUT interface using HP I/O banks with dynamic calibration and deskew. | Use Scenario: Real-time reconstruction of 3D ultrasound volumes from raw RF echo streams acquired at 40 MSPS per channel. IC Role / Device Role / Timing Role: Pipeline accelerator performing GPU-offloaded backprojection and speckle reduction using BRAM-based line buffers and DSP-intensive filters. Use Value: Reduces reconstruction latency from 120 ms to <18 ms per volume while maintaining DICOM-compliant SNR and spatial resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Higher logic density (542,400 LC), 36 GTY transceivers, larger FBGA1156 package | Required for designs needing >32.1 Mb BRAM or >24 transceivers - e.g., full-duplex 100G Ethernet MAC + PHY | Select when scaling beyond XCKU040 capacity; requires PCB redesign due to different package and power delivery |
| XCKU035-1FBVA900C | Lower logic count (252,400 LC), 16 GTY transceivers, same FBGA900 footprint | Suitable for cost-sensitive 5G small cells or entry-level radar where 24 transceivers are unused | Drop-in replacement only if design fits within reduced resources; identical thermal and mechanical interface simplifies migration |
Compared with XCKU040-1FBVA900C, the XCKU060 offers headroom for future feature expansion but increases BOM and layout complexity, while the XCKU035 reduces cost and power at the expense of transceiver count and memory bandwidth - making it viable only for resource-constrained implementations.
Availability
XCKU040-1FBVA900C is available at Aetrix Electronics and suitable for 5G infrastructure, radar signal processing, and high-end test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU040-1FBVA900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx (now part of AMD) is a semiconductor company specializing in adaptive computing solutions, with leadership in FPGA, adaptive SoC, and ACAP technologies since 1984.
The Kintex UltraScale family targets high-throughput, low-latency applications demanding both programmable logic and hardened IP - optimized for wireless infrastructure, aerospace, and scientific instrumentation.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU040-1FBVA900C?
The XCKU040-1FBVA900C supports GTY transceivers operating up to 16.3 Gbps per lane. This enables compliance with JESD204B/C, PCIe Gen3, and CPRI standards. The actual achievable rate depends on board layout, reference clock quality, and equalization settings - verified in Xilinx UG576 and PG182 documentation. XCKU040-1FBVA900C designs targeting 16.3 Gbps must use AC-coupled 100 Ω differential routing and calibrated termination.
Does the XCKU040-1FBVA900C support DDR4 memory interfaces?
Yes, the XCKU040-1FBVA900C includes a hardened memory controller supporting DDR4-2400 (1200 MHz) with x72 data bus width and ECC. It meets JEDEC DDR4 specifications for tRFC, tFAW, and refresh timing. XCKU040-1FBVA900C designs require proper fly-by topology, on-die termination, and VREF calibration - validated using Xilinx MIG v7.2 and UG586 guidelines.
What configuration modes are supported by the XCKU040-1FBVA900C?
The XCKU040-1FBVA900C supports Master SPIx4, Slave SelectMAP, and JTAG configuration modes. Dual-boot with fallback is enabled via dedicated CONFIG_PIN and fallback address bits in the configuration memory. XCKU040-1FBVA900C also supports secure boot using AES-256 encrypted bitstreams stored in external flash, with HMAC authentication enforced during startup.
Is partial reconfiguration supported on the XCKU040-1FBVA900C?
Yes, the XCKU040-1FBVA900C fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic hardware updates without full device reset. This capability is used in software-defined radio and adaptive test systems. XCKU040-1FBVA900C requires dedicated ICAP and FRAME_ECC primitives, and partial bitstreams must be validated for timing and connectivity per UG904.
What is the operating temperature range for the XCKU040-1FBVA900C commercial grade?
The XCKU040-1FBVA900C commercial-grade variant (suffix 'C') operates from 0°C to +85°C ambient temperature. Junction temperature must remain below 100°C under full load, requiring thermal vias and copper pour per Xilinx AR69452. Industrial-grade variants (suffix 'I') extend to –40°C to +100°C and are available for harsh-environment deployments of XCKU040-1FBVA900C.
XCKU040-1FBVA900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU040-1FBVA900C FAQ
1.How can I place an order for XCKU040-1FBVA900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1FBVA900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1FBVA900C reliable?
The price and inventory of XCKU040-1FBVA900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1FBVA900C is usually 5 days.
3.What payment methods are accepted for XCKU040-1FBVA900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1FBVA900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1FBVA900C?
XCKU040-1FBVA900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1FBVA900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1FBVA900C?
For technical support, including XCKU040-1FBVA900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1FBVA900C requirements.
6.How does Aetrix verify that XCKU040-1FBVA900C is sourced from the original manufacturer or authorized distributors?
All XCKU040-1FBVA900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1FBVA900C meets industry standards.
7.What is the process for return or replacement of XCKU040-1FBVA900C?
All XCKU040-1FBVA900C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1FBVA900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1FBVA900C part is unused and in its original packaging.
Return procedure for XCKU040-1FBVA900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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