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AMD XCKU040-1FBVA900I
- Part No.:
- XCKU040-1FBVA900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU040-1FBVA900I.pdf
- Description:
- IC FPGA 468 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,628
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Product details
Overview
XCKU040-1FBVA900I from AMD is a Kintex UltraScale FPGA with 443,200 logic cells, 2,160 DSP slices, and 28.4 Mb of block RAM. It features 520 I/O pins in a 900-pin FCBGA package and supports transceivers up to 16.3 Gb/s for high-speed serial connectivity in 5G infrastructure and radar processing systems.
For engineers reviewing the XCKU040-1FBVA900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V to 1.8 V), thermal performance (−40°C to +100°C case temperature), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XCKU040-1FBVA900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x8, 10/25/100G Ethernet MACs, and AXI-based interconnect. It uses 20 nm bulk CMOS process technology and supports partial reconfiguration for dynamic function swapping.
Configuration is performed via dual-boot SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter below 150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - total available LUT-based configurable logic resources |
| DSP Slices | 2,160 - fixed-point multiply-accumulate units supporting 27×18-bit operations |
| Block RAM | 28.4 Mb - distributed as 3,600 × 72 Kb BRAM primitives for on-chip data buffering |
| Transceiver Speed | 16.3 Gb/s - maximum line rate per GTY transceiver channel |
| I/O Pins | 520 - user-configurable single-ended and differential I/Os in FBGA900 |
| Operating Temp | −40°C to +100°C - industrial-grade case temperature range for rugged deployment |
| Configuration | Quad-SPI, JTAG, SelectMAP - multiple boot and debug interface options |
Pinout & Package
Package: 900-pin Fine-Pitch Ball Grid Array (FBGA), 31 mm × 31 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V only |
| GTY_TXN/GTY_TXP | High-Speed Transceiver Output | Differential pair driving up to 16.3 Gb/s; requires AC coupling and controlled impedance routing |
| GTY_RXN/GTY_RXP | High-Speed Transceiver Input | Differential pair receiving up to 16.3 Gb/s; supports adaptive equalization |
| VRP/VRN | Reference Voltage Inputs | Provide termination reference for differential I/O standards (e.g., LVDS, TMDS) |
| PROGRAM_B | Configuration Initiation | Active-Low signal triggering FPGA reconfiguration from external source |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex logic eliminating soft-core overhead and timing closure risk |
| 25G Ethernet MAC | Hardened 25Gbps Ethernet Media Access Controller with IEEE 802.3by compliance |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration and intellectual property theft during field updates |
| Partial Reconfiguration Support | Enables runtime logic module swapping without full device reset or system interruption |
| UltraScale+ Memory Controller | Supports DDR4, LPDDR4, and RLDRAM3 interfaces with up to 2,400 MT/s data rates |
Applications
| 5G Radio Unit (RU) | Phased Array Radar Processing |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in massive MIMO base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency signal processing pipelines; GTY transceivers interface directly with RFICs. Use Value: 16.3 Gb/s transceivers enable direct CPRI/eCPRI over fiber without retiming bridges. | Use Scenario: High-resolution target tracking and clutter suppression in airborne radar systems. IC Role / Device Role / Timing Role: Configurable logic implements pulse-Doppler FFT engines and CFAR detection; hard IP accelerates data movement. Use Value: 2,160 DSP slices deliver >1.2 TFLOPS peak compute for real-time SAR image formation. |
| Test & Measurement Equipment | High-Performance Computing Acceleration |
Use Scenario: Multi-channel high-speed digitizer with synchronized sampling across 32+ ADC channels. IC Role / Device Role / Timing Role: Clock management tiles distribute ultra-low-jitter clocks (<150 fs RMS) to ADCs and DACs. Use Value: Sub-picosecond clock alignment enables coherent wideband signal capture up to 10 GHz bandwidth. | Use Scenario: Custom accelerator for financial risk modeling and Monte Carlo simulation. IC Role / Device Role / Timing Role: Logic fabric hosts parallelized stochastic solvers; DDR4 memory controller manages 128 GB/s memory bandwidth. Use Value: 28.4 Mb on-chip BRAM reduces off-chip memory access latency by >60% versus GPU-based implementations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FBVA676I | Fewer logic cells (252,000), reduced DSP count (1,440), no 25G Ethernet MAC | Suitable for cost-sensitive 10G Ethernet edge nodes but lacks 25G/100G MAC integration | Select when transceiver count and DSP density requirements are lower and board space is constrained by 676-pin footprint |
| XCKU060-2FBVA900I | Higher speed grade (−2), increased logic (562,400), more BRAM (36.5 Mb), same package | Required for deterministic sub-100 ns latency in time-sensitive networking (TSN) gateways | Choose when higher timing margin, larger on-chip memory, or guaranteed 16.3 Gb/s operation across full temperature range is mandatory |
Compared with XCKU040-1FBVA900I, the XCKU035-1FBVA676I trades capacity and hardened IP for lower cost and smaller footprint, while the XCKU060-2FBVA900I delivers higher performance headroom at increased power and cost-both require separate PCB layout due to different ball maps and thermal profiles.
Availability
XCKU040-1FBVA900I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU040-1FBVA900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale family targets high-throughput, low-latency applications in communications, defense, and instrumentation where hardware adaptability and hardened IP integration are critical.
FAQ
What is the maximum supported transceiver line rate for XCKU040-1FBVA900I?
The XCKU040-1FBVA900I supports a maximum transceiver line rate of 16.3 Gb/s per GTY channel. This specification is validated across the full industrial temperature range (−40°C to +100°C) and applies to both transmit and receive paths. The GTY transceivers comply with industry standards including PCIe Gen3, 10/25/100G Ethernet, and CPRI/eCPRI protocols. XCKU040-1FBVA900I achieves this performance using adaptive equalization and continuous-time linear equalization (CTLE) circuitry.
Does XCKU040-1FBVA900I support partial reconfiguration?
Yes, XCKU040-1FBVA900I fully supports partial reconfiguration through its ICAP and PCAP interfaces. This capability allows dynamic swapping of logic modules without resetting the entire device or interrupting active I/O operations. Implementation requires Vivado Design Suite 2020.1 or later and adherence to frame-based placement constraints. XCKU040-1FBVA900I's configuration logic includes dedicated CRC checking and error reporting for reconfigured regions.
What configuration modes are supported by XCKU040-1FBVA900I?
XCKU040-1FBVA900I supports Quad-SPI, JTAG, and SelectMAP configuration modes. Quad-SPI enables fast boot from serial flash with dual-image fallback capability. JTAG provides boundary-scan testing and debug access. SelectMAP allows high-speed parallel configuration via microprocessor or ASIC host. All modes support AES-256 encrypted bitstreams. XCKU040-1FBVA900I also supports dual-boot functionality with automatic failover between primary and backup images stored in SPI flash.
What is the I/O voltage range supported by XCKU040-1FBVA900I?
XCKU040-1FBVA900I supports I/O voltages from 1.2 V to 1.8 V across its 520-user I/O pins. Each of the 22 I/O banks can be independently powered within this range, enabling mixed-voltage interface designs. Supported standards include LVCMOS, SSTL, HSTL, and differential protocols such as LVDS and TMDS. VRP/VRN reference pins must be supplied at appropriate levels for differential signaling. XCKU040-1FBVA900I does not support 3.3 V I/O.
Is XCKU040-1FBVA900I qualified for automotive applications?
No, XCKU040-1FBVA900I is rated for industrial temperature range (−40°C to +100°C case temperature) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure mode analysis documentation, and extended lifetime validation required for automotive ECUs or ADAS domains. For automotive use cases, AMD offers the XCKU040-1FBVA900I's automotive-grade counterpart XCKU040-1FBVA900I-AC, which includes enhanced screening, lot traceability, and PPAP documentation. XCKU040-1FBVA900I remains suitable for industrial and aerospace applications meeting its thermal and ESD specifications.
XCKU040-1FBVA900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU040-1FBVA900I FAQ
1.How can I place an order for XCKU040-1FBVA900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1FBVA900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1FBVA900I reliable?
The price and inventory of XCKU040-1FBVA900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1FBVA900I is usually 5 days.
3.What payment methods are accepted for XCKU040-1FBVA900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1FBVA900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1FBVA900I?
XCKU040-1FBVA900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1FBVA900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1FBVA900I?
For technical support, including XCKU040-1FBVA900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1FBVA900I requirements.
6.How does Aetrix verify that XCKU040-1FBVA900I is sourced from the original manufacturer or authorized distributors?
All XCKU040-1FBVA900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1FBVA900I meets industry standards.
7.What is the process for return or replacement of XCKU040-1FBVA900I?
All XCKU040-1FBVA900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1FBVA900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1FBVA900I part is unused and in its original packaging.
Return procedure for XCKU040-1FBVA900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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