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AMD XCKU040-1FFVA1156C
- Part No.:
- XCKU040-1FFVA1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU040-1FFVA1156C.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,869
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Product details
Overview
XCKU040-1FFVA1156C from AMD is a Kintex UltraScale FPGA featuring 375K logic cells, 2,160 DSP slices, 28.2 Mb of block RAM, 96 transceivers supporting up to 16.3 Gb/s, and integrated PCI Express Gen3 x8 endpoint/root complex functionality. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU040-1FFVA1156C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, PCIe Gen3 integration, and FFVA1156 package thermal performance for sustained compute workloads.
Technical Context
The XCKU040-1FFVA1156C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3, 10/25/100G Ethernet MACs, and UltraScale+ memory controllers. It supports DDR4 interfaces up to 2400 MT/s and includes dedicated clock management tiles with MMCM and PLL resources.
Configuration occurs via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device operates across commercial temperature range (0°C to 85°C) and requires multiple regulated supply rails: VCCINT (0.85 V), VCCAUX (1.8 V), VCCO (1.2–1.8 V), and VCCBRAM (0.85 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 375,000 – determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,160 – enables parallel fixed/floating-point computation for FFT, filtering, and beamforming |
| Block RAM | 28.2 Mb – supports large on-chip buffering for packet assembly, frame storage, or coefficient tables |
| Transceivers | 96 × 16.3 Gb/s – delivers aggregate bandwidth for multi-lane serial protocols like CPRI, JESD204B/C |
| PCIe Interface | Gen3 x8 endpoint/root complex – enables direct host CPU attachment without external switch logic |
| DDR4 Support | Up to 2400 MT/s – allows high-throughput memory interfacing with low-latency access timing |
Pinout & Package
The XCKU040-1FFVA1156C is housed in a 1156-pin FCBGA package (FFVA1156) with 0.8 mm pitch, designed for high I/O density and thermal dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference clock input for transceivers | Provides low-jitter timing reference for all 96 transceivers; requires dedicated differential pair routing |
| MRCC[0-1]/SRCC[0-1] | Multi-/single-ended clock input | Feeds global clock networks; MRCC drives multiple clock regions, SRCC serves single region |
| HP[0-3]_IO | High-performance I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.25 V/1.2 V standards with programmable slew and drive strength |
| VRP/VRN | Reference voltage pins | Set I/O bank reference voltage for SSTL/HSTL termination; must be connected to stable VREF source |
| INIT_B, PROGRAM_B | Configuration control | Active-low signals managing configuration startup sequence and reconfiguration capability |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables higher logic utilization and lower power per LUT versus 7-series, verified in radar waveform generation designs |
| Hardened PCIe Gen3 x8 | Reduces RTL integration effort and verification time by eliminating soft-core PCIe stack implementation |
| Integrated 100G Ethernet MAC | Accelerates protocol handling for fronthaul transport without external PHY or MAC logic |
| Secure Boot with HMAC | Prevents unauthorized bitstream loading by validating cryptographic signature during configuration |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions while maintaining system operation, critical for adaptive radio applications |
Applications
| 5G Massive MIMO Baseband | Radar Signal Processing |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: Primary baseband processor executing OFDM modulation/demodulation, MIMO matrix inversion, and precoding in deterministic latency cycles. Use Value: 96 transceivers enable direct interface to multiple RFICs; 2,160 DSP slices sustain >100 GOPS real-time computation. | Use Scenario: Pulse-Doppler processing and CFAR detection in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: Front-end signal conditioner performing ADC sample buffering, pulse compression, and Doppler FFT before host CPU ingestion. Use Value: 28.2 Mb block RAM stores full chirp buffers; hardened PCIe Gen3 x8 streams processed data to host at 7.8 GB/s. |
| High-Speed Test Equipment | Low-Latency Financial Trading |
Use Scenario: Protocol-aware pattern generation and error injection for 25G/100G Ethernet compliance testing. IC Role / Device Role / Timing Role: Line-rate packet generator/analyzer with precise timestamping and jitter injection control. Use Value: 16.3 Gb/s transceivers support native 25G KR/KR4; deterministic logic fabric ensures sub-2 ns path delay variation. | Use Scenario: Market data feed parsing, order matching, and risk calculation in co-located trading engines. IC Role / Device Role / Timing Role: Deterministic accelerator tightly coupled to x86 host via PCIe Gen3 x8, bypassing OS scheduling latency. Use Value: Hardened PCIe root complex reduces round-trip latency to <600 ns; DFX enables algorithm updates without system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1517I | Higher logic capacity (562K LC), 120 transceivers, extended industrial temp (-40°C to 100°C), larger FFVA1517 package | Suitable for multi-function radar platforms requiring additional SERDES lanes and wider temperature operation | Select when needing >375K logic cells or operation beyond 85°C ambient |
| XCKU115-2FLVD1517I | Higher DSP count (5,520 slices), 120 transceivers, same FFVA1517 package, higher speed grade | Preferred for compute-intensive applications like AI inference acceleration or wideband spectrum analysis | Select when DSP throughput or transceiver count exceeds XCKU040-1FFVA1156C capability |
Compared with XCKU040-1FFVA1156C, the XCKU060-2FFVA1517I offers greater logic headroom and extended thermal range, while the XCKU115-2FLVD1517I delivers significantly higher arithmetic throughput and SERDES density-both require PCB redesign due to different package footprints and power delivery requirements.
Availability
XCKU040-1FFVA1156C is available at Aetrix Electronics and suitable for 5G infrastructure, radar systems, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU040-1FFVA1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, communications, and embedded markets.
The Kintex UltraScale family delivers optimized cost-performance balance for applications demanding high I/O bandwidth, transceiver density, and deterministic processing-targeting wireless infrastructure, defense electronics, and instrumentation.
FAQ
What is the operating temperature range for XCKU040-1FFVA1156C?
The XCKU040-1FFVA1156C is rated for commercial temperature operation from 0°C to +85°C ambient. This range applies to the junction temperature under specified airflow and power dissipation conditions. Thermal design must ensure case temperature remains within limits using the FFVA1156 package's thermal characteristics documented in AMD's XCKU040 datasheet. XCKU040-1FFVA1156C does not support industrial or extended temperature grades.
Does XCKU040-1FFVA1156C support PCIe Gen4?
No, XCKU040-1FFVA1156C integrates a hardened PCIe Gen3 x8 endpoint/root complex only. It does not support PCIe Gen4 signaling rates or associated protocol features. Designs requiring Gen4 must use Versal ACAP or newer Kria KV260 derivatives. XCKU040-1FFVA1156C maintains full backward compatibility with PCIe Gen1/Gen2/Gen3 hosts and switches.
What configuration modes are supported by XCKU040-1FFVA1156C?
XCKU040-1FFVA1156C supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI is commonly used for fast, secure boot from flash memory. JTAG is standard for debugging and programming during development. Configuration is initiated via PROGRAM_B and monitored through INIT_B and DONE pins. XCKU040-1FFVA1156C also supports fallback and multi-boot configurations using external flash partitioning.
Can XCKU040-1FFVA1156C interface directly with DDR4 memory?
Yes, XCKU040-1FFVA1156C includes dedicated DDR4 memory controller hard IP supporting data rates up to 2400 MT/s across up to 16 banks. It handles address/command timing, read/write leveling, and calibration automatically. External DDR4 components must meet JEDEC specifications and be placed within layout constraints defined in AMD's UltraScale Memory Interface Solutions User Guide. XCKU040-1FFVA1156C does not support LPDDR4 or GDDR6 natively.
Is partial reconfiguration supported on XCKU040-1FFVA1156C?
Yes, XCKU040-1FFVA1156C supports Dynamic Function eXchange (DFX), enabling partial reconfiguration of designated logic regions without disrupting system operation. This capability is implemented in Vivado Design Suite and requires specific floorplanning and checkpoint-based flow. XCKU040-1FFVA1156C has been validated for DFX in adaptive radio and protocol gateway applications where runtime function swapping is required.
XCKU040-1FFVA1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU040-1FFVA1156C FAQ
1.How can I place an order for XCKU040-1FFVA1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1FFVA1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1FFVA1156C reliable?
The price and inventory of XCKU040-1FFVA1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1FFVA1156C is usually 5 days.
3.What payment methods are accepted for XCKU040-1FFVA1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1FFVA1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1FFVA1156C?
XCKU040-1FFVA1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1FFVA1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1FFVA1156C?
For technical support, including XCKU040-1FFVA1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1FFVA1156C requirements.
6.How does Aetrix verify that XCKU040-1FFVA1156C is sourced from the original manufacturer or authorized distributors?
All XCKU040-1FFVA1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1FFVA1156C meets industry standards.
7.What is the process for return or replacement of XCKU040-1FFVA1156C?
All XCKU040-1FFVA1156C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1FFVA1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1FFVA1156C part is unused and in its original packaging.
Return procedure for XCKU040-1FFVA1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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