AMD XCKU040-1FFVA1156I
- Part No.:
- XCKU040-1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU040-1FFVA1156I.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,678
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Product details
Overview
XCKU040-1FFVA1156I from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,160 DSP slices, and 28.4 Mb of block RAM. It integrates PCIe Gen3 x16, 100G Ethernet MACs, and supports DDR4 memory interfaces up to 2400 MT/s. It is deployed in high-bandwidth data acceleration and reconfigurable computing systems.
For engineers reviewing the XCKU040-1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (20× 12.5 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (29 W typical), and package pin compatibility with FFVA1156 footprint.
Technical Context
The XCKU040-1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 100G Ethernet, and memory controllers. It supports partial reconfiguration and AXI4 interconnect for system-on-chip integration.
It delivers deterministic low-latency signal processing via dedicated clocking resources including 24 MMCMs and 12 PLLs, and supports JTAG, ICAP, and SelectMAP configuration modes with dual-boot capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,160 - enables parallel multiply-accumulate operations for high-throughput math-intensive workloads |
| Block RAM | 28.4 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM dependency |
| Transceivers | 20 × 12.5 Gb/s - supports 100G Ethernet, PCIe Gen3 x16, or multi-lane serial protocols with PRBS generation/checking |
| I/O Standards | LVCMOS, SSTL, HSTL, DIFF_HSTL, MIPI - enables direct interfacing with DDR4, LPDDR4, and high-speed sensors |
| TDP | 29 W (typical) - defines thermal envelope requiring active cooling and PCB copper pour planning |
Pinout & Package
The XCKU040-1FFVA1156I uses a 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVA) package with 0.8 mm pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Must be independently filtered and regulated to ±3% tolerance for stable 12.5 Gb/s serial link operation |
| VRP / VRN | Reference voltage inputs | Set I/O bank termination voltage; each pair serves one I/O bank for SSTL/HSTL compliance |
| CONFIG_IO / DONE | Configuration status | Indicates successful bitstream loading; used for system boot sequencing and FPGA readiness signaling |
| CLK_IN / CLK_OUT | Global clock input/output | Connects to dedicated clock routing network; supports single-ended or differential clock sources |
| INIT_B / PROGRAM_B | Configuration control | Active-low signals managing configuration reset, reprogramming, and fallback recovery sequences |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface without soft-core overhead |
| 100G Ethernet MAC + PCS | Enables line-rate packet processing with integrated RS-FEC and 1588 timestamping support |
| Partial Reconfiguration | Allows dynamic logic module swapping during runtime-critical for multi-mode radar or protocol-agile comms |
| AXI4 Interconnect | Provides standardized, pipelined, out-of-order transaction support across CPU, DMA, and accelerator subsystems |
| Dual-Boot Configuration | Supports fail-safe firmware updates by storing primary and backup bitstreams in flash memory |
Applications
| 5G Baseband Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G gNodeB units. IC Role / Device Role / Timing Role: Configurable baseband processor handling layer-1 PHY functions with deterministic sub-microsecond latency. Use Value: Leverages 2,160 DSP slices and 20× 12.5 Gb/s transceivers to sustain 100+ Gbps fronthaul throughput while meeting 3GPP timing constraints. | Use Scenario: Offloading matrix multiplication and sparse tensor operations in AI inference servers. IC Role / Device Role / Timing Role: Reconfigurable accelerator tightly coupled to CPU via AXI4, operating as co-processor with synchronized memory access. Use Value: Delivers >2× throughput vs. fixed ASIC for evolving ML models, using 28.4 Mb block RAM for on-chip weight buffering. |
| Network Packet Processing | Test & Measurement Equipment |
Use Scenario: Deep packet inspection and real-time flow classification at 100G line rate. IC Role / Device Role / Timing Role: Line-rate packet processor with integrated 100G MAC, TCAM emulation, and stateful pattern matching engine. Use Value: Achieves zero packet loss under full load using hardened Ethernet IP and deterministic logic fabric timing. | Use Scenario: High-resolution digital oscilloscope front-end with real-time FFT and jitter analysis. IC Role / Device Role / Timing Role: Signal conditioning and analysis engine synchronizing ADC sampling, memory capture, and spectral computation. Use Value: Uses 24 MMCMs for ultra-low-jitter clock synthesis and 443,200 logic cells for parallel FFT pipelines at 1 GS/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FFVA1156I | Fewer logic cells (375,000), reduced DSP slices (1,728), same FFVA1156 package and transceiver count | Suitable for cost-optimized 5G small cells or mid-tier test equipment where full XCKU040 capacity is unused | Select when design fits within lower resource budget and TDP <25 W is required |
| XCKU060-2FFVA1156I | Higher logic density (562,400), faster speed grade (-2), increased TDP (38 W), same package | Required for full 100G+400G switch fabric or multi-tile radar beamforming with no resource margin | Choose when XCKU040-1FFVA1156I fails timing closure or exceeds utilization thresholds |
Compared with XCKU035-1FFVA1156I and XCKU060-2FFVA1156I, the XCKU040-1FFVA1156I offers balanced logic, DSP, and memory resources for mainstream 100G infrastructure-avoiding overdesign cost while maintaining headroom for feature upgrades.
Availability
XCKU040-1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing acceleration, and network packet processing requiring stable component supply and long-term industrial availability.
Supply support for XCKU040-1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale family targets reconfigurable acceleration in bandwidth-constrained, latency-sensitive applications such as wireless infrastructure and intelligent networking.
FAQ
What is the maximum supported DDR4 data rate for the XCKU040-1FFVA1156I?
The XCKU040-1FFVA1156I supports DDR4 memory interfaces up to 2400 MT/s with built-in memory controller hard IP. This rate is validated across all I/O banks configured for SSTL_12 I/O standard and requires matched trace lengths and proper termination per UG576. The XCKU040-1FFVA1156I achieves this using dedicated read/write leveling circuitry and programmable delay controls.
Does the XCKU040-1FFVA1156I include hardened PCIe Gen3 endpoints?
Yes, the XCKU040-1FFVA1156I integrates two hardened PCIe Gen3 x8 endpoints or one x16 endpoint, supporting root complex and endpoint roles. These blocks implement full PHY, data link, and transaction layers per PCI-SIG specification. The XCKU040-1FFVA1156I does not require external PHY chips or soft-core PCIe implementations for basic enumeration and DMA transfers.
What configuration modes are supported by the XCKU040-1FFVA1156I?
The XCKU040-1FFVA1156I supports JTAG, Master/Slave SelectMAP, and ICAP configuration modes, plus dual-boot capability using external SPI flash. Configuration bitstream can be loaded via boundary-scan, parallel bus, or internal reconfiguration port. The XCKU040-1FFVA1156I also supports encrypted bitstream loading using AES-256 keys stored in eFUSE.
Is partial reconfiguration supported on the XCKU040-1FFVA1156I?
Yes, partial reconfiguration is fully supported on the XCKU040-1FFVA1156I using Vivado Design Suite tools and hardware flow. It allows dynamic replacement of logical modules without resetting the entire device. The XCKU040-1FFVA1156I implements frame-based PR with CRC checking and secure update mechanisms for field-deployed systems.
What thermal management guidance applies to the XCKU040-1FFVA1156I?
The XCKU040-1FFVA1156I has a typical TDP of 29 W and requires a heatsink with thermal resistance ≤ 1.2°C/W under 200 LFM airflow. PCB layout must include ≥ 4 oz copper planes, thermal vias under the package, and alignment with the thermal lid. The XCKU040-1FFVA1156I includes on-die temperature sensors and thermal shutdown at 125°C junction temperature.
XCKU040-1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU040-1FFVA1156I FAQ
1.How can I place an order for XCKU040-1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1FFVA1156I reliable?
The price and inventory of XCKU040-1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU040-1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1FFVA1156I?
XCKU040-1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1FFVA1156I?
For technical support, including XCKU040-1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1FFVA1156I requirements.
6.How does Aetrix verify that XCKU040-1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU040-1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU040-1FFVA1156I?
All XCKU040-1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU040-1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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