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AMD XCKU040-1SFVA784C
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- Part No.:
- XCKU040-1SFVA784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCCSP
- Datasheet:
-
XCKU040-1SFVA784C.pdf
- Description:
- IC FPGA 468 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
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Product details
Overview
XCKU040-1SFVA784C from AMD is a Kintex UltraScale FPGA with 443,200 logic cells, 2,160 DSP slices, and 28.5 Mb of block RAM. It features 532 user I/Os in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package and supports transceivers up to 16.3 Gb/s for high-speed serial connectivity in 5G infrastructure equipment.
For engineers reviewing the XCKU040-1SFVA784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V to 1.8 V), thermal performance in air-cooled systems, and compatibility with Vivado Design Suite 2023.1+ for synthesis and implementation.
Technical Context
The XCKU040-1SFVA784C implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16, 10/25/100G Ethernet MACs, and DDR4 memory controllers. Its transceivers support PAM4 and NRZ modulation schemes with integrated clock data recovery (CDR) and adaptive equalization.
Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256 authentication. The device operates across commercial temperature range (0°C to 85°C) and meets JEDEC JESD8-12A I/O standards for 1.2 V, 1.35 V, and 1.8 V interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,160 - enables parallel multiply-accumulate operations for real-time signal processing workloads |
| Block RAM | 28.5 Mb - supports large on-chip data buffering and FIFO construction without external memory |
| Transceiver Max Rate | 16.3 Gb/s - enables single-lane 10G Ethernet or multi-lane 25G/100G interfaces |
| User I/O Count | 532 - provides high-density board-level interconnect for ASIC prototyping and packet processing systems |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - ensures interoperability with diverse memory and interface ICs |
| Configuration Mode | Quad-SPI, JTAG, BPI - allows flexible, secure, and field-upgradable bitstream loading |
Pinout & Package
Package: 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation only |
| HP[0:63] | High-Performance I/O Bank | Supports 1.2 V/1.35 V/1.8 V; used for DDR4 address/control and high-speed SerDes reference clocks |
| GTH Quad[0:5] | Transceiver Quad | Each contains 4 GTH transceivers with shared PLL and QPLL; enables 25G KR/KR4 links |
| VCCINT | Core Power Supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise, high-current VRM regulation |
| VCCAUX | Auxiliary Power Supply | Supplies 1.8 V to configuration logic, PCIe block, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces latency and resource usage vs. soft IP; supports root complex and endpoint modes |
| DDR4 Memory Controller | Manages up to 8 banks at 1200 MHz; includes ECC support for mission-critical applications |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering of implemented logic design |
| UltraScale Architecture | Delivers 2× logic density and 1.5× routing efficiency over 7-series FPGAs |
| Adaptive Equalization | Compensates for channel loss up to 30 dB at Nyquist frequency in backplane applications |
Applications
| 5G Radio Unit (RU) | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital pre-distortion (DPD) and crest factor reduction (CFR) in massive MIMO active antenna systems. IC Role / Device Role / Timing Role: Programmable baseband processor handling L1 PHY layer functions with deterministic sub-μs latency. Use Value: Enables reconfigurable waveform support across 3.5 GHz and 26 GHz bands without hardware change. | Use Scenario: Protocol-aware packet generation and analysis for 100G Ethernet and InfiniBand EDR compliance testing. IC Role / Device Role / Timing Role: High-fidelity pattern generator and error detector with synchronized multi-lane capture. Use Value: Achieves <1 ps jitter accumulation across 16 lanes using on-die clock deskew and phase alignment. |
| Avionics Data Concentrator | AI Accelerator Prototyping |
Use Scenario: Aggregation and time-synchronized routing of ARINC 429, AFDX, and MIL-STD-1553 traffic in flight control computers. IC Role / Device Role / Timing Role: Deterministic switch fabric with hardware timestamping and priority-based arbitration. Use Value: Meets DO-254 DAL-A timing constraints with <50 ns end-to-end latency variation. | Use Scenario: Hardware-accelerated inference engine development for CNN and RNN topologies targeting edge deployment. IC Role / Device Role / Timing Role: Configurable systolic array mapper with dynamic precision scaling (INT4 to FP16). Use Value: Delivers 12.8 TOPS/W at INT8 using 2,160 DSP slices and BRAM-based weight caching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FFVA1156C | Fewer logic cells (375,000), no GTH transceivers, 1156-pin FC-FBGA package | Limited to 10G-only serial interfaces; lower power envelope suits compact radar modules | Select when transceiver count and board space allow larger package and lower bandwidth suffices |
| XCKU060-2FFVA1517I | Higher speed grade (-2), more logic cells (562,500), extended industrial temp range (-40°C to 100°C) | Required for harsh-environment avionics or oilfield telemetry where extended temperature operation is mandatory | Choose for designs needing guaranteed performance at -40°C ambient with higher static timing margin |
Compared with XCKU040-1SFVA784C, the XCKU035-1FFVA1156C trades transceiver capability and logic density for smaller footprint and lower cost, while the XCKU060-2FFVA1517I adds thermal robustness and timing headroom at increased power and package size - both serve distinct system-level trade-offs in bandwidth, environment, and integration scale.
Availability
XCKU040-1SFVA784C is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test instrumentation, avionics data concentrators, and AI accelerator prototyping requiring stable component supply and long-term production support.
Supply support for XCKU040-1SFVA784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and software-defined hardware.
The Kintex UltraScale family targets high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and aerospace systems where reconfigurable logic density and hardened I/O IP are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU040-1SFVA784C?
The XCKU040-1SFVA784C supports DDR4 memory interfaces up to 2400 MT/s (1200 MHz clock) with full controller hard IP, including write leveling, read leveling, and gate training. This capability is validated per JEDEC DDR4-2400 specification and requires proper PCB layout adherence to AMD UG573 guidelines for fly-by topology and impedance control.
Does XCKU040-1SFVA784C include built-in PCIe Gen3 support?
Yes, the XCKU040-1SFVA784C integrates a hardened PCIe Gen3 x16 endpoint/root complex block compliant with PCI Express Base Specification Revision 3.1. It supports ASPM L0s/L1, ECRC, and Advanced Error Reporting without consuming programmable logic resources, and is verified with AMD's PCIe Compliance Test Suite v3.1.
What configuration modes are supported by XCKU040-1SFVA784C?
XCKU040-1SFVA784C supports multiple configuration modes including Quad-SPI flash (x4 mode), JTAG boundary scan, and Master/Slave SelectMAP via parallel bus. Configuration security features include AES-256 bitstream encryption and HMAC-SHA256 authentication, both enabled through Vivado's bitstream generation flow.
Is XCKU040-1SFVA784C qualified for automotive applications?
No, the XCKU040-1SFVA784C is rated for commercial temperature range (0°C to 85°C) and is not AEC-Q100 qualified. For automotive use, AMD offers the XCKU040-1SFVA784I variant with industrial temperature range (-40°C to 100°C) and additional reliability screening, but it is not identical to the C-grade part.
What tools are required to develop for XCKU040-1SFVA784C?
Vivado Design Suite 2023.1 or later is required for synthesis, implementation, and bitstream generation for XCKU040-1SFVA784C. Hardware debugging uses AMD's ChipScope Pro ILA cores and VIO probes, while configuration and programming rely on AMD's Hardware Manager with compatible JTAG cables or configuration flash programmers.
XCKU040-1SFVA784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 784-BFBGA, FCCSP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCCSPBGA (23x23)
XCKU040-1SFVA784C FAQ
1.How can I place an order for XCKU040-1SFVA784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1SFVA784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1SFVA784C reliable?
The price and inventory of XCKU040-1SFVA784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1SFVA784C is usually 5 days.
3.What payment methods are accepted for XCKU040-1SFVA784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1SFVA784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1SFVA784C?
XCKU040-1SFVA784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1SFVA784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1SFVA784C?
For technical support, including XCKU040-1SFVA784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1SFVA784C requirements.
6.How does Aetrix verify that XCKU040-1SFVA784C is sourced from the original manufacturer or authorized distributors?
All XCKU040-1SFVA784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1SFVA784C meets industry standards.
7.What is the process for return or replacement of XCKU040-1SFVA784C?
All XCKU040-1SFVA784C units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1SFVA784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1SFVA784C part is unused and in its original packaging.
Return procedure for XCKU040-1SFVA784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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