AMD XCKU040-1SFVA784I
- Part No.:
- XCKU040-1SFVA784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCCSP
- Datasheet:
-
XCKU040-1SFVA784I.pdf
- Description:
- IC FPGA 468 I/O 784FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,515
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU040-1SFVA784I from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,160 DSP slices, 28.8 Mb of block RAM, 96 GTY transceivers supporting up to 32.75 Gb/s, and integrated PCIe Gen3 x16 endpoint/root complex. It targets high-bandwidth data processing in 5G wireless infrastructure baseband units.
For engineers reviewing the XCKU040-1SFVA784I datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, block RAM depth, PCIe Gen3 integration, and thermal performance in air-cooled 784-pin flip-chip BGA packaging.
Technical Context
The XCKU040-1SFVA784I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MAC, DDR4 PHY), and high-speed serial I/O. Its GTY transceivers support PAM4 and NRZ modulation with built-in FEC and PRBS generators.
It integrates dual 32-bit AXI4 interconnects, supports DDR4-2400 memory interfaces across 16 banks, and delivers deterministic timing closure for designs operating at 500 MHz system clock with 2 ns input/output setup/hold margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - supports large-scale signal processing pipelines with >10k parallel MAC operations |
| DSP Slices | 2,160 - enables real-time 4x4 MIMO precoding and LDPC decoding at 100+ Gbps throughput |
| Block RAM | 28.8 Mb - provides 128 deep × 256-bit buffers per BRAM column for burst-mode packet buffering |
| GTY Transceivers | 96 × 32.75 Gb/s - delivers full-duplex 3.1 Tbps aggregate I/O bandwidth for fronthaul/backhaul links |
| PCIe Interface | Gen3 x16 endpoint/root complex - enables direct host CPU co-processing without external switch logic |
| Package | 784-pin flip-chip BGA (SFVA784) - 23 mm × 23 mm footprint with 0.8 mm pitch and thermal lid for 25 W TDP operation |
Pinout & Package
Package: 784-pin flip-chip BGA (SFVA784), 23 mm × 23 mm, 0.8 mm pitch, thermal lid, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuits |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to GTY analog circuitry; isolated routing critical for jitter performance |
| CLK_IN_0 | Dedicated clock input | Accepts differential 100 MHz–750 MHz reference clocks for PLL/MMCM lock; routed via dedicated clock spine |
| PCIe_RST_N | Reset control | Active-low asynchronous reset for PCIe hard IP block; synchronized internally before assertion |
| GPIO_0 | User I/O bank | Configurable as LVDS, SSTL-12/15, or HSTL; supports 1.2 V–1.8 V I/O standards with programmable slew rate |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort by eliminating soft PCIe core licensing and verification overhead |
| 96 GTY transceivers | Enables single-chip 8× 400G Ethernet or 16× 100G coherent optical line card implementation |
| DDR4-2400 interface | Supports 16 memory banks with independent refresh control for multi-channel packet buffer management |
| UltraScale+ SelectIO | Allows mixed-voltage I/O banks on same package edge, simplifying interface consolidation with legacy ASICs |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I2C for thermal-aware scheduling |
Applications
| 5G Massive MIMO Baseband Unit | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming matrix computation and channel estimation across 64 antenna elements. IC Role / Device Role / Timing Role: Primary signal processing engine executing FPGA-accelerated FFT, CORDIC, and matrix inversion kernels. Use Value: Delivers 2.1 TFLOPS peak compute within 25 W envelope, enabling fanless deployment in remote radio heads. | Use Scenario: Multi-protocol protocol analyzer capturing and decoding PCIe Gen4, USB4, and DisplayPort 2.1 traffic simultaneously. IC Role / Device Role / Timing Role: Reconfigurable protocol bridge and pattern generator with sub-100 ps timestamp resolution. Use Value: Leverages 96 GTY transceivers and deterministic timing to capture 32 lanes at native line rates without oversampling penalty. |
| AI Inference Accelerator Card | Avionics Data Concentrator |
Use Scenario: Low-latency inference for vision-based autonomous navigation using INT8 quantized CNN models. IC Role / Device Role / Timing Role: Co-processor offloading inference from host CPU; manages DDR4-2400 memory for weight streaming and feature map buffering. Use Value: Achieves 128 TOPS/W efficiency via 2,160 DSP slices configured as systolic arrays with pipelined accumulation. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B bus aggregation in fly-by-wire flight control systems. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with hardware-enforced latency bounds (< 15 μs end-to-end). Use Value: Meets DO-254 DAL-A requirements using dual-lockstep configuration and built-in CRC-32 error detection on all packet paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Higher logic density (562,500 LC), 120 GTY transceivers, larger 1156-pin package, 35 W TDP | Required for >128-antenna 5G mmWave deployments or 32-lane PCIe Gen4 root complexes | Select when XCKU040-1SFVA784I resource utilization exceeds 85% across LUT, BRAM, and DSP usage metrics |
| XCKU035-1FFVA1156E | Lower logic count (375,000 LC), 60 GTY transceivers, commercial temp grade (-20°C to +100°C) | Suitable for cost-sensitive test equipment or non-safety-critical industrial gateways | Choose for reduced BOM cost where PCIe Gen3 x8 and 48 GTY lanes meet throughput requirements |
Compared with XCKU040-1SFVA784I, the XCKU060-2FFVA1156I offers higher I/O bandwidth and logic capacity at increased power and PCB area cost, while the XCKU035-1FFVA1156E trades transceiver count and temperature rating for lower acquisition cost in less demanding environments.
Availability
XCKU040-1SFVA784I is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test instrumentation, and AI acceleration applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU040-1SFVA784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client markets with leadership in FPGA, CPU, and GPU architectures.
The Kintex UltraScale family delivers high-performance, cost-optimized FPGAs targeting wired/wireless communications, video processing, and compute acceleration with hardened I/O and memory controllers.
FAQ
What is the maximum supported data rate per GTY transceiver in XCKU040-1SFVA784I?
The XCKU040-1SFVA784I supports up to 32.75 Gb/s per GTY transceiver in NRZ mode and 58 Gb/s in PAM4 mode with forward error correction enabled. This specification is validated per AMD UG578 v1.13 and applies to all 96 GTY channels under industrial temperature conditions with proper reference clock jitter compliance.
Does XCKU040-1SFVA784I include a hard PCIe Gen3 controller?
Yes, XCKU040-1SFVA784I integrates a hardened PCIe Gen3 x16 endpoint/root complex block compliant with PCI Express Base Specification Revision 3.1. It supports both link training and configuration space access without requiring soft IP synthesis, reducing design cycle time by approximately 3 weeks.
What memory interface standards does XCKU040-1SFVA784I support natively?
XCKU040-1SFVA784I supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 through dedicated memory controller blocks. The DDR4 interface operates across 16 independent banks with programmable read/write leveling and on-die termination calibration, verified per JEDEC JESD209-4.
Is XCKU040-1SFVA784I qualified for extended temperature operation?
Yes, the XCKU040-1SFVA784I is rated for industrial temperature range (–40°C to +100°C case temperature) and carries the 'I' suffix per AMD's ordering nomenclature. Thermal validation includes junction temperature monitoring via on-die sensors and derating curves published in DS922.
What configuration modes are supported by XCKU040-1SFVA784I?
XCKU040-1SFVA784I supports master/slave SPI, BPI, and JTAG configuration modes. Quad-SPI boot from 128 MB flash is standard, with fallback to JTAG for debug and field updates. Configuration bitstream encryption and HMAC authentication are supported using AES-256 keys stored in eFUSE.
XCKU040-1SFVA784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 784-BFBGA, FCCSP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCCSPBGA (23x23)
XCKU040-1SFVA784I FAQ
1.How can I place an order for XCKU040-1SFVA784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-1SFVA784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-1SFVA784I reliable?
The price and inventory of XCKU040-1SFVA784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-1SFVA784I is usually 5 days.
3.What payment methods are accepted for XCKU040-1SFVA784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-1SFVA784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-1SFVA784I?
XCKU040-1SFVA784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-1SFVA784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-1SFVA784I?
For technical support, including XCKU040-1SFVA784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-1SFVA784I requirements.
6.How does Aetrix verify that XCKU040-1SFVA784I is sourced from the original manufacturer or authorized distributors?
All XCKU040-1SFVA784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-1SFVA784I meets industry standards.
7.What is the process for return or replacement of XCKU040-1SFVA784I?
All XCKU040-1SFVA784I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-1SFVA784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-1SFVA784I part is unused and in its original packaging.
Return procedure for XCKU040-1SFVA784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU040-1SFVA784I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

.jpg)