AMD XCKU040-2FBVA676E
- Part No.:
- XCKU040-2FBVA676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU040-2FBVA676E.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,121
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU040-2FBVA676E from AMD is a Kintex UltraScale FPGA featuring 385,200 logic cells, 1,152 DSP slices, and 23.9 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-throughput packet processing systems requiring deterministic latency and multi-protocol acceleration.
For engineers reviewing the XCKU040-2FBVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (468 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements (VCCINT = 0.85 V ±3%), and thermal envelope for conduction-cooled carrier board integration.
Technical Context
The XCKU040-2FBVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and high-speed serial transceivers. Its UltraScale architecture uses 20nm bulk CMOS process and features clock gating, dynamic power scaling, and partial reconfiguration support.
It integrates 468 user-configurable I/Os across 24 banks, each supporting LVDS, SSTL, HSTL, and MIPI signaling. The device includes 24 GTY transceivers capable of 16.3 Gb/s operation, with built-in PRBS generators and error detectors for link validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 385,200 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 1,152 - enables parallel multiply-accumulate operations for signal processing pipelines |
| Block RAM | 23.9 Mb - supports large on-die buffering for video frame stores or packet queues |
| User I/O Count | 468 - provides interface flexibility across memory, peripheral, and high-speed serial domains |
| GTY Transceivers | 24 × 16.3 Gb/s - delivers full-duplex serial bandwidth for 10/25G Ethernet or CPRI links |
| Speed Grade | -2 - guarantees timing closure at worst-case voltage/temperature corners for industrial use |
| Operating Temp | -40°C to +100°C - qualified for conduction-cooled embedded systems without forced airflow |
Pinout & Package
Package: 676-pin FCBGA (Fine-Pitch Chip Array Ball Grid Array) with 25 mm × 25 mm body, 0.8 mm pitch, and thermal lid. Designed for high-density PCB layouts with controlled impedance routing and thermal vias under die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85 V ±3% required; decoupling must meet <10 mΩ impedance up to 100 MHz |
| VCCAUX | Auxiliary power supply | 1.8 V for configuration logic and select I/O banks; low-noise regulation critical |
| MGTAVCC | Transceiver analog supply | 1.0 V for GTY PLLs and serializers; isolated from digital rails to limit jitter |
| CLK_IN | Dedicated clock input | Accepts differential LVDS or single-ended CMOS; feeds MMCM/PLL for internal clock generation |
| INIT_B | Configuration status | Open-drain output indicating bitstream load success or CRC error during startup |
| PROGRAM_B | Configuration trigger | Active-low signal initiating FPGA reconfiguration from external flash or host processor |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe Base Spec 3.0 without soft-core overhead |
| DDR4 Memory Controller | Supports dual-rank, 2400 MT/s interfaces with ECC and write leveling-enables direct attachment to server-grade memory subsystems |
| Partial Reconfiguration Support | Allows runtime logic module swaps without system reset-critical for mission-critical comms where uptime >99.999% |
| UltraScale Architecture | Delivers 1.5× higher logic density and 2× more DSP throughput per mm² vs. 7-series FPGAs |
| 24 GTY Transceivers | Each supports 10.3125–16.3 Gb/s line rates with integrated gearbox and 8B/10B encoding-eliminates need for external retimers in 25G optical modules |
Applications
| 5G Radio Unit (RU) | High-Frequency Trading Engine |
|---|---|
Use Scenario: Real-time beamforming coefficient update and CPRI/eCPRI fronthaul processing in active antenna systems. IC Role / Device Role / Timing Role: FPGA fabric executes MIMO matrix inversion and symbol-level scheduling; GTY transceivers handle 25G eCPRI transport. Use Value: Achieves sub-100 ns deterministic latency for closed-loop RF control using hard PCIe and memory controllers. | Use Scenario: Low-latency order matching and market data parsing with nanosecond timestamping. IC Role / Device Role / Timing Role: XCKU040-2FBVA676E acts as hardware-accelerated network stack and ultra-precise time-stamping engine synchronized to PTP grandmaster clocks. Use Value: Enables 35 ns timestamp resolution and <700 ns round-trip latency from NIC ingress to application logic. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in fly-by-wire systems. IC Role / Device Role / Timing Role: XCKU040-2FBVA676E implements deterministic switch fabric with time-triggered scheduling and end-to-end CRC protection. Use Value: Meets DO-254 Level A certification requirements via traceable RTL and hardened FIFOs with parity. | Use Scenario: Multi-channel real-time spectrum analysis with simultaneous FFT, filtering, and waveform generation. IC Role / Device Role / Timing Role: Configurable logic processes 16-channel ADC samples at 1.25 GS/s; DSP slices perform 4K-point streaming FFTs. Use Value: Delivers 2.1 TFLOPS peak compute within 25 W TDP using distributed arithmetic and block RAM-based coefficient storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | Lower logic capacity (252,000 LUTs), fewer GTY transceivers (16), same package footprint | Suitable for cost-sensitive 10G Ethernet gateways but lacks bandwidth for 25G+ fronthaul | Select when PCIe Gen3 x8 and DDR4-2133 suffice; reduces BOM cost by ~18% |
| XCKU060-2FFVA676E | Higher logic density (562,500 LUTs), additional DSP slices (1,680), same speed grade and package | Required for full 4×25G line cards with integrated FEC and OTN mapping | Choose when >300K LUTs and ≥20 GTY lanes are needed for multi-protocol line interface cards |
Compared with XCKU035-2FFVA676E and XCKU060-2FFVA676E, the XCKU040-2FBVA676E offers optimal balance of transceiver count, logic resources, and thermal dissipation for mid-tier 5G infrastructure and defense electronics where 24 GTY lanes and 385K LUTs meet functional and SWaP-C constraints.
Availability
XCKU040-2FBVA676E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, avionics data concentrators, and high-frequency trading platforms requiring stable component supply across extended product lifecycles.
Supply support for XCKU040-2FBVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high I/O bandwidth, hardened protocols, and scalable logic density-especially in communications, test equipment, and aerospace systems.
FAQ
What is the maximum supported DDR4 data rate for the XCKU040-2FBVA676E?
The XCKU040-2FBVA676E supports DDR4 memory interfaces up to 2400 MT/s with two independent 72-bit interfaces (64-bit data + 8-bit ECC). This capability is implemented via hardened memory controller IP and verified across industrial temperature range with JEDEC-compliant timing margins. The XCKU040-2FBVA676E achieves this performance using calibrated read/write leveling and on-die termination control.
Does the XCKU040-2FBVA676E include built-in PCIe Gen3 support?
Yes, the XCKU040-2FBVA676E integrates a hardened PCIe Gen3 x16 endpoint block compliant with PCI Express Base Specification 3.0. It supports both root port and endpoint configurations, includes AXI4 streaming interfaces, and delivers <100 ns transaction latency. The XCKU040-2FBVA676E requires no external PHY and meets PCIe electrical compliance when used with reference clock and layout guidelines.
What is the operating temperature range specified for the XCKU040-2FBVA676E?
The XCKU040-2FBVA676E is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the FBVA676 package variant and is validated per JEDEC JESD22-A104 stress testing. The XCKU040-2FBVA676E maintains full functionality-including all GTY transceivers and memory controllers-across this range without derating.
How many GTY transceivers does the XCKU040-2FBVA676E provide?
The XCKU040-2FBVA676E includes 24 GTY transceivers, each capable of line rates from 10.3125 Gb/s to 16.3 Gb/s. These transceivers support protocols including 10/25G Ethernet, CPRI, and PCIe Gen3. The XCKU040-2FBVA676E allocates them across four quads, with dedicated reference clock inputs and shared PLLs per quad.
Is partial reconfiguration supported on the XCKU040-2FBVA676E?
Yes, the XCKU040-2FBVA676E fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic swapping of logic modules while maintaining system operation-verified for use cases such as protocol adaptation in radio units and firmware updates in avionics. The XCKU040-2FBVA676E implements frame-based reconfiguration with CRC-protected bitstream loading and rollback capability.
XCKU040-2FBVA676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU040-2FBVA676E FAQ
1.How can I place an order for XCKU040-2FBVA676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-2FBVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-2FBVA676E reliable?
The price and inventory of XCKU040-2FBVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-2FBVA676E is usually 5 days.
3.What payment methods are accepted for XCKU040-2FBVA676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-2FBVA676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-2FBVA676E?
XCKU040-2FBVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-2FBVA676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-2FBVA676E?
For technical support, including XCKU040-2FBVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-2FBVA676E requirements.
6.How does Aetrix verify that XCKU040-2FBVA676E is sourced from the original manufacturer or authorized distributors?
All XCKU040-2FBVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-2FBVA676E meets industry standards.
7.What is the process for return or replacement of XCKU040-2FBVA676E?
All XCKU040-2FBVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-2FBVA676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-2FBVA676E part is unused and in its original packaging.
Return procedure for XCKU040-2FBVA676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU040-2FBVA676E Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
