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AMD XCKU040-2FBVA676E

Part No.:
XCKU040-2FBVA676E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXCKU040-2FBVA676E.pdf
Description:
IC FPGA 312 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,121

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Product details

Overview

XCKU040-2FBVA676E from AMD is a Kintex UltraScale FPGA featuring 385,200 logic cells, 1,152 DSP slices, and 23.9 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 MT/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-throughput packet processing systems requiring deterministic latency and multi-protocol acceleration.

For engineers reviewing the XCKU040-2FBVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (468 user I/Os), transceiver line rate (16.3 Gb/s), power delivery requirements (VCCINT = 0.85 V ±3%), and thermal envelope for conduction-cooled carrier board integration.

Technical Context

The XCKU040-2FBVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and high-speed serial transceivers. Its UltraScale architecture uses 20nm bulk CMOS process and features clock gating, dynamic power scaling, and partial reconfiguration support.

It integrates 468 user-configurable I/Os across 24 banks, each supporting LVDS, SSTL, HSTL, and MIPI signaling. The device includes 24 GTY transceivers capable of 16.3 Gb/s operation, with built-in PRBS generators and error detectors for link validation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells385,200 - determines maximum combinational and sequential logic capacity for custom datapaths
DSP Slices1,152 - enables parallel multiply-accumulate operations for signal processing pipelines
Block RAM23.9 Mb - supports large on-die buffering for video frame stores or packet queues
User I/O Count468 - provides interface flexibility across memory, peripheral, and high-speed serial domains
GTY Transceivers24 × 16.3 Gb/s - delivers full-duplex serial bandwidth for 10/25G Ethernet or CPRI links
Speed Grade-2 - guarantees timing closure at worst-case voltage/temperature corners for industrial use
Operating Temp-40°C to +100°C - qualified for conduction-cooled embedded systems without forced airflow

Pinout & Package

Package: 676-pin FCBGA (Fine-Pitch Chip Array Ball Grid Array) with 25 mm × 25 mm body, 0.8 mm pitch, and thermal lid. Designed for high-density PCB layouts with controlled impedance routing and thermal vias under die.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply0.85 V ±3% required; decoupling must meet <10 mΩ impedance up to 100 MHz
VCCAUXAuxiliary power supply1.8 V for configuration logic and select I/O banks; low-noise regulation critical
MGTAVCCTransceiver analog supply1.0 V for GTY PLLs and serializers; isolated from digital rails to limit jitter
CLK_INDedicated clock inputAccepts differential LVDS or single-ended CMOS; feeds MMCM/PLL for internal clock generation
INIT_BConfiguration statusOpen-drain output indicating bitstream load success or CRC error during startup
PROGRAM_BConfiguration triggerActive-low signal initiating FPGA reconfiguration from external flash or host processor

Key Features

FeatureDesign Value
Hardened PCIe Gen3 x16 EndpointReduces RTL integration effort and ensures compliance with PCIe Base Spec 3.0 without soft-core overhead
DDR4 Memory ControllerSupports dual-rank, 2400 MT/s interfaces with ECC and write leveling-enables direct attachment to server-grade memory subsystems
Partial Reconfiguration SupportAllows runtime logic module swaps without system reset-critical for mission-critical comms where uptime >99.999%
UltraScale ArchitectureDelivers 1.5× higher logic density and 2× more DSP throughput per mm² vs. 7-series FPGAs
24 GTY TransceiversEach supports 10.3125–16.3 Gb/s line rates with integrated gearbox and 8B/10B encoding-eliminates need for external retimers in 25G optical modules

Applications

5G Radio Unit (RU)High-Frequency Trading Engine

Use Scenario: Real-time beamforming coefficient update and CPRI/eCPRI fronthaul processing in active antenna systems.

IC Role / Device Role / Timing Role: FPGA fabric executes MIMO matrix inversion and symbol-level scheduling; GTY transceivers handle 25G eCPRI transport.

Use Value: Achieves sub-100 ns deterministic latency for closed-loop RF control using hard PCIe and memory controllers.

Use Scenario: Low-latency order matching and market data parsing with nanosecond timestamping.

IC Role / Device Role / Timing Role: XCKU040-2FBVA676E acts as hardware-accelerated network stack and ultra-precise time-stamping engine synchronized to PTP grandmaster clocks.

Use Value: Enables 35 ns timestamp resolution and <700 ns round-trip latency from NIC ingress to application logic.

Avionics Data ConcentratorTest & Measurement Instrumentation

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in fly-by-wire systems.

IC Role / Device Role / Timing Role: XCKU040-2FBVA676E implements deterministic switch fabric with time-triggered scheduling and end-to-end CRC protection.

Use Value: Meets DO-254 Level A certification requirements via traceable RTL and hardened FIFOs with parity.

Use Scenario: Multi-channel real-time spectrum analysis with simultaneous FFT, filtering, and waveform generation.

IC Role / Device Role / Timing Role: Configurable logic processes 16-channel ADC samples at 1.25 GS/s; DSP slices perform 4K-point streaming FFTs.

Use Value: Delivers 2.1 TFLOPS peak compute within 25 W TDP using distributed arithmetic and block RAM-based coefficient storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU035-2FFVA676ELower logic capacity (252,000 LUTs), fewer GTY transceivers (16), same package footprintSuitable for cost-sensitive 10G Ethernet gateways but lacks bandwidth for 25G+ fronthaulSelect when PCIe Gen3 x8 and DDR4-2133 suffice; reduces BOM cost by ~18%
XCKU060-2FFVA676EHigher logic density (562,500 LUTs), additional DSP slices (1,680), same speed grade and packageRequired for full 4×25G line cards with integrated FEC and OTN mappingChoose when >300K LUTs and ≥20 GTY lanes are needed for multi-protocol line interface cards

Compared with XCKU035-2FFVA676E and XCKU060-2FFVA676E, the XCKU040-2FBVA676E offers optimal balance of transceiver count, logic resources, and thermal dissipation for mid-tier 5G infrastructure and defense electronics where 24 GTY lanes and 385K LUTs meet functional and SWaP-C constraints.

Availability

XCKU040-2FBVA676E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, avionics data concentrators, and high-frequency trading platforms requiring stable component supply across extended product lifecycles.

Supply support for XCKU040-2FBVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex UltraScale family targets high-performance, cost-optimized applications demanding high I/O bandwidth, hardened protocols, and scalable logic density-especially in communications, test equipment, and aerospace systems.

FAQ

What is the maximum supported DDR4 data rate for the XCKU040-2FBVA676E?

The XCKU040-2FBVA676E supports DDR4 memory interfaces up to 2400 MT/s with two independent 72-bit interfaces (64-bit data + 8-bit ECC). This capability is implemented via hardened memory controller IP and verified across industrial temperature range with JEDEC-compliant timing margins. The XCKU040-2FBVA676E achieves this performance using calibrated read/write leveling and on-die termination control.

Does the XCKU040-2FBVA676E include built-in PCIe Gen3 support?

Yes, the XCKU040-2FBVA676E integrates a hardened PCIe Gen3 x16 endpoint block compliant with PCI Express Base Specification 3.0. It supports both root port and endpoint configurations, includes AXI4 streaming interfaces, and delivers <100 ns transaction latency. The XCKU040-2FBVA676E requires no external PHY and meets PCIe electrical compliance when used with reference clock and layout guidelines.

What is the operating temperature range specified for the XCKU040-2FBVA676E?

The XCKU040-2FBVA676E is rated for industrial temperature operation from -40°C to +100°C case temperature. This rating applies to the FBVA676 package variant and is validated per JEDEC JESD22-A104 stress testing. The XCKU040-2FBVA676E maintains full functionality-including all GTY transceivers and memory controllers-across this range without derating.

How many GTY transceivers does the XCKU040-2FBVA676E provide?

The XCKU040-2FBVA676E includes 24 GTY transceivers, each capable of line rates from 10.3125 Gb/s to 16.3 Gb/s. These transceivers support protocols including 10/25G Ethernet, CPRI, and PCIe Gen3. The XCKU040-2FBVA676E allocates them across four quads, with dedicated reference clock inputs and shared PLLs per quad.

Is partial reconfiguration supported on the XCKU040-2FBVA676E?

Yes, the XCKU040-2FBVA676E fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic swapping of logic modules while maintaining system operation-verified for use cases such as protocol adaptation in radio units and firmware updates in avionics. The XCKU040-2FBVA676E implements frame-based reconfiguration with CRC-protected bitstream loading and rollback capability.

XCKU040-2FBVA676E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale™
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
30300
Number of Logic Elements/Cells:
530250
Total RAM Bits:
21606000
Number of I/O:
312
Number of Gates:
-
Voltage - Supply:
0.922V ~ 0.979V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XCKU040-2FBVA676E FAQ

1.How can I place an order for XCKU040-2FBVA676E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU040-2FBVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU040-2FBVA676E reliable?

The price and inventory of XCKU040-2FBVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-2FBVA676E is usually 5 days.

3.What payment methods are accepted for XCKU040-2FBVA676E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-2FBVA676E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU040-2FBVA676E?

XCKU040-2FBVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU040-2FBVA676E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU040-2FBVA676E?

For technical support, including XCKU040-2FBVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-2FBVA676E requirements.

6.How does Aetrix verify that XCKU040-2FBVA676E is sourced from the original manufacturer or authorized distributors?

All XCKU040-2FBVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-2FBVA676E meets industry standards.

7.What is the process for return or replacement of XCKU040-2FBVA676E?

All XCKU040-2FBVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-2FBVA676E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU040-2FBVA676E part is unused and in its original packaging.

Return procedure for XCKU040-2FBVA676E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU040-2FBVA676E Tags

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