AMD XCKU040-2FBVA676I
- Part No.:
- XCKU040-2FBVA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU040-2FBVA676I.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU040-2FBVA676I from AMD (formerly Xilinx) is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,520 DSP slices, and 28.4 Mb of block RAM. It supports up to 48 GTY transceivers operating at 32.75 Gb/s, and is packaged in a 676-pin FCBGA with 0.8 mm pitch. It targets high-bandwidth data processing in 5G wireless infrastructure equipment.
For engineers reviewing the XCKU040-2FBVA676I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, logic density, I/O voltage support (1.2 V to 1.8 V), thermal design power (29.5 W typical), and industrial temperature grade (-40°C to +100°C).
Technical Context
The XCKU040-2FBVA676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 10/25/100G Ethernet MACs), and multi-rate GTY transceivers. It uses 20 nm bulk CMOS process technology and supports partial reconfiguration.
It delivers deterministic low-latency signal processing via dedicated routing for clock and reset networks, and integrates UltraScale+ SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and MIPI D-PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,520 - enables high-throughput fixed/floating-point math for radar, AI inference, and beamforming |
| Block RAM | 28.4 Mb - supports large on-chip buffering and FIFOs without external memory |
| GTY Transceivers | 48 lanes @ 32.75 Gb/s - provides native connectivity to 100G QSFP28, CEI-28G, and CPRI interfaces |
| I/O Standards | SSTL/HSTL/LVCMOS/LVDS/MIPI D-PHY - allows direct interfacing with DDR4, flash, sensors, and high-speed serdes PHYs |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor base station environments |
| TDP | 29.5 W typical - defines thermal solution requirements for sustained packet processing workloads |
Pinout & Package
Package: 676-pin Flip-Chip Ball Grid Array (FCBGA), 27 × 27 mm, 0.8 mm ball pitch, RoHS-compliant, industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% supply for logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration, PCIe, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V per bank; sets output swing and input threshold for associated pins |
| MR | Master Reset | Active-low asynchronous reset for configuration logic and internal state machines |
| CLK_IN | Configuration clock | Single-ended or differential input for JTAG and configuration clocking |
| GTYP/N | Transceiver differential pair | High-speed serial I/O supporting protocols up to 32.75 Gb/s (e.g., 100G Ethernet) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces latency and resource usage for host interface; eliminates need for soft PCIe cores |
| UltraScale+ SelectIO | Enables mixed-voltage I/O banks with independent VCCO control per bank |
| Partial Reconfiguration | Allows dynamic update of logic partitions without resetting entire device or halting operation |
| Hardened 10/25/100G Ethernet MAC | Offloads MAC-layer processing from CPU/FPGA fabric; supports IEEE 802.3bj/bs |
| Multi-rate GTY Transceivers | Supports protocol-specific rates from 1.6 to 32.75 Gb/s in same physical lane |
Applications
| 5G Massive MIMO Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz 5G NR base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling layer-1 PHY acceleration and precoding. Use Value: Delivers deterministic latency and >200 GOPS compute density using DSP slices and BRAM, eliminating external ASICs. | Use Scenario: Protocol-aware bit error rate testing and jitter tolerance validation for 100G optical modules. IC Role / Device Role / Timing Role: High-fidelity pattern generator and error detector with precise timing alignment across 48 GTY lanes. Use Value: Enables single-chip test instrumentation with full line-rate traffic generation and analysis at 32.75 Gb/s per lane. |
| Avionics Data Concentrators | Medical Imaging Signal Processors |
Use Scenario: Aggregating and time-synchronizing ARINC 818 video streams, AFDX, and discrete I/O in next-gen flight control systems. IC Role / Device Role / Timing Role: Deterministic interconnect hub with hard PCIe and Ethernet MACs for deterministic network bridging. Use Value: Meets DO-254 DAL-A timing constraints via hardened IP and predictable routing delay. | Use Scenario: Real-time reconstruction of MRI k-space data and ultrasound beamforming in portable imaging platforms. IC Role / Device Role / Timing Role: Low-latency signal co-processor offloading FFT, filtering, and interpolation from host SoC. Use Value: Achieves sub-100 µs pipeline latency using distributed arithmetic and BRAM-based coefficient storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | Higher logic density (562,500 LC), more GTY lanes (64), larger package (1156-pin FCBGA) | Better suited for multi-100G aggregation or dual-radio 5G macro base stations | Select when >443K LC or >48 GTY lanes are required; requires PCB redesign |
| XCKU035-2FFVA1156I | Lower logic count (375,000 LC), same GTY count (48), identical 1156-pin package | Targeted at cost-optimized 5G small cells or mid-tier test equipment | Choose for lower BOM cost where logic utilization stays below 85%; same footprint but reduced capability |
Compared with XCKU040-2FBVA676I, the XCKU060-2FFVA1156I offers higher scalability at the cost of larger board area and power, while the XCKU035-2FFVA1156I trades logic capacity for cost within the same package family-neither is pin-compatible due to differing ball counts and I/O assignments.
Availability
XCKU040-2FBVA676I is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU040-2FBVA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding high bandwidth and deterministic latency-especially in wireless infrastructure, test & measurement, and aerospace systems.
FAQ
What is the maximum supported transceiver data rate for the XCKU040-2FBVA676I?
The XCKU040-2FBVA676I supports GTY transceivers with a maximum data rate of 32.75 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CEI-28G, and CPRI Option 10. The XCKU040-2FBVA676I achieves this using adaptive equalization and low-jitter clocking architecture, and requires proper PCB stackup and controlled impedance routing to maintain signal integrity.
Does the XCKU040-2FBVA676I support partial reconfiguration?
Yes, the XCKU040-2FBVA676I fully supports partial reconfiguration through Vivado Design Suite. This capability allows runtime updates of specific logic regions without disrupting active functions such as PCIe links or transceiver operations. The XCKU040-2FBVA676I implements frame-based reconfiguration with secure bitstream authentication, enabling field-upgradable features in deployed 5G baseband units.
What I/O standards are supported by the XCKU040-2FBVA676I?
The XCKU040-2FBVA676I supports SSTL, HSTL, LVCMOS, LVDS, and MIPI D-PHY across its 400+ user I/O pins. Each of the 24 I/O banks can be independently configured for 1.2 V to 1.8 V VCCO, enabling mixed-standard interfaces-for example, DDR4 memory (SSTL12) alongside MIPI camera sensors (D-PHY) on the same device. The XCKU040-2FBVA676I does not support RSDS or BLVDS.
Is the XCKU040-2FBVA676I qualified for industrial temperature operation?
Yes, the XCKU040-2FBVA676I is rated for industrial temperature range: –40°C to +100°C case temperature. It is tested per JEDEC JESD22-A104 and JESD22-A108 reliability standards, with burn-in and HTOL qualification. This makes the XCKU040-2FBVA676I suitable for outdoor 5G radio units and avionics edge nodes where ambient thermal cycling exceeds commercial-grade limits.
What hardened IP blocks are integrated into the XCKU040-2FBVA676I?
The XCKU040-2FBVA676I integrates hardened PCIe Gen3 x16, 10/25/100G Ethernet MACs, and 100G Interlaken controllers. These blocks operate at full line rate with deterministic latency and zero fabric resource consumption. The XCKU040-2FBVA676I also includes clock management tiles (CMTs) with MMCM and PLL, and system monitor for on-die temperature and voltage sensing-no external monitoring IC required.
XCKU040-2FBVA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU040-2FBVA676I FAQ
1.How can I place an order for XCKU040-2FBVA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-2FBVA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-2FBVA676I reliable?
The price and inventory of XCKU040-2FBVA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-2FBVA676I is usually 5 days.
3.What payment methods are accepted for XCKU040-2FBVA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-2FBVA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-2FBVA676I?
XCKU040-2FBVA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-2FBVA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-2FBVA676I?
For technical support, including XCKU040-2FBVA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-2FBVA676I requirements.
6.How does Aetrix verify that XCKU040-2FBVA676I is sourced from the original manufacturer or authorized distributors?
All XCKU040-2FBVA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-2FBVA676I meets industry standards.
7.What is the process for return or replacement of XCKU040-2FBVA676I?
All XCKU040-2FBVA676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-2FBVA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-2FBVA676I part is unused and in its original packaging.
Return procedure for XCKU040-2FBVA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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