AMD XCKU040-2FBVA900I

Overview

XCKU040-2FBVA900I from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,184 DSP slices, and 28.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 up to 2400 Mbps, and 16.3 Gb/s transceivers. Used in high-throughput data acceleration and real-time signal processing systems.

For engineers reviewing the XCKU040-2FBVA900I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage flexibility, thermal performance in FBGA900 packaging, and support for hardened IP blocks including PCIe and memory controllers.

Technical Context

The XCKU040-2FBVA900I implements a heterogeneous architecture with programmable logic fabric, hardened ARM Cortex-R5F processors (in Zynq UltraScale+ MPSoC variants), and dedicated memory interfaces. It integrates 24 GTY transceivers with PMA operating up to 16.3 Gb/s and supports AMBA AXI4 interconnect protocols.

This device uses 20nm bulk CMOS process technology, delivers 1.2 V core voltage operation, and supports multi-voltage I/O banks (1.2 V to 1.8 V) with SelectIO™ technology. Configuration occurs via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption.

Key Specifications

Pinout & Package

The XCKU040-2FBVA900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in industrial and compute-acceleration applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XCKU040-2FBVA900I, the XCKU035-2FFVA676I trades transceiver count and logic capacity for lower cost and footprint, while the XCKU060-2FFVA1156I extends bandwidth and compute density at increased power and layout complexity.

Availability

XCKU040-2FBVA900I is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for XCKU040-2FBVA900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and embedded markets.

The Kintex UltraScale family targets high-throughput, low-latency applications where reconfigurable logic complements hardened IP for networking, compute acceleration, and signal processing.

FAQ

What is the maximum supported DDR4 data rate for the XCKU040-2FBVA900I?

The XCKU040-2FBVA900I supports DDR4 interfaces up to 2400 Mbps per pin. This is achieved using its integrated hard memory controller with dynamic calibration and built-in training sequences. The controller supports dual-rank configurations and optional ECC. Performance is validated across industrial temperature ranges and requires proper PCB layout adherence to AMD's memory interface guidelines. XCKU040-2FBVA900I achieves this rate without external PHY components.

Does the XCKU040-2FBVA900I include a built-in PCIe Gen3 controller?

Yes, the XCKU040-2FBVA900I integrates a hardened PCIe Gen3 x16 root port or endpoint controller compliant with PCI Express Base Specification 3.1. It handles link training, transaction layer packet handling, and error reporting in hardware. No soft-core implementation is required. XCKU040-2FBVA900I supports both endpoint and root complex modes depending on configuration, and operates with standard Linux kernel drivers.

What package type and ball pitch does the XCKU040-2FBVA900I use?

The XCKU040-2FBVA900I uses a 900-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch and 31 × 31 array configuration. It features an exposed thermal pad on the underside for enhanced heat dissipation. The package is RoHS-compliant and rated for industrial temperature range (–40°C to +100°C junction). XCKU040-2FBVA900I requires controlled-depth solder paste printing and reflow profile validation per AMD's packaging specification.

Can the XCKU040-2FBVA900I be configured via JTAG only?

No - while JTAG is supported for debugging and programming, the XCKU040-2FBVA900I requires primary configuration through dedicated interfaces: Quad-SPI flash, BPI parallel NOR flash, or SelectMAP. JTAG alone cannot load the full bitstream into configuration memory. XCKU040-2FBVA900I uses JTAG for boundary scan, debug access, and partial reconfiguration control, but not for initial boot.

Is AES-256 bitstream encryption supported on the XCKU040-2FBVA900I?

Yes, the XCKU040-2FBVA900I supports AES-256 encryption of the configuration bitstream using on-chip key storage and HMAC authentication. Keys are programmed via JTAG or eFUSE and protected against readback. Encrypted bitstreams prevent reverse engineering and unauthorized duplication. XCKU040-2FBVA900I enforces decryption before configuration, rejecting tampered or unauthenticated images.