AMD XCKU040-2FFVA1156I
- Part No.:
- XCKU040-2FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU040-2FFVA1156I.pdf
- Description:
- IC FPGA 520 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,756
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Product details
Overview
XCKU040-2FFVA1156I from AMD is a Kintex UltraScale FPGA featuring 444,480 logic cells, 2,196 DSP slices, and 28.2 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and operates at -40°C to +100°C junction temperature. It is deployed in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial connectivity.
For engineers reviewing the XCKU040-2FFVA1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count (20 × 16.3 Gb/s GTY), I/O voltage support (1.2 V to 1.8 V), thermal design power (27 W typical), and package-specific I/O banking constraints.
Technical Context
The XCKU040-2FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3, 10/25G Ethernet MAC, memory controllers), and high-speed serial transceivers. It uses 20nm bulk CMOS process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG; startup time is ≤ 50 ms from master SPI flash. The device includes integrated configuration security features including AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 444,480 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,196 - enables parallel multiply-accumulate operations for signal processing and AI inference acceleration |
| Block RAM | 28.2 Mb - supports large on-chip data buffering and FIFOs without external memory dependency |
| Transceivers | 20 × GTY - delivers 16.3 Gb/s per lane for 10G/25G Ethernet, CPRI, and JESD204B applications |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential - allows direct interfacing with DDR4, sensors, ADCs, and FPGAs |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| TDP | 27 W typical - defines thermal solution sizing and airflow requirements in dense PCB layouts |
Pinout & Package
Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, 35 mm × 35 mm body size, and thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O bank | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V only |
| HP[0:71] | High-performance I/O bank | Supports DDR4, QDR, and GTY transceiver reference clocks; voltage-selectable (1.2–1.8 V) |
| GTY_TX/RX[0:19] | Transceiver differential pair | Each pair handles full-duplex 16.3 Gb/s; requires AC-coupling and controlled impedance routing |
| VCCINT | Core supply | Supplies 0.95 V to FPGA fabric; requires low-noise, high-current regulation |
| VCCAUX | Auxiliary supply | Supplies 1.8 V to configuration logic, PCIe block, and clock management tiles |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and guarantees compliance with PCIe 3.0 electrical and protocol layers |
| DDR4 Memory Controller | Enables direct connection to up to 8 banks of DDR4-2400 with ECC support and AXI4 interface |
| Partial Reconfiguration | Allows dynamic logic module swapping without system reset, enabling runtime adaptation in radar and comms systems |
| AES-256 Encryption | Protects bitstream confidentiality during configuration and storage in external flash memory |
| UltraScale Architecture | Delivers 2× higher performance-per-watt versus 7-series FPGAs for compute-intensive workloads |
Applications
| Radar Signal Processing | 5G Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT and CFAR algorithms; GTY transceivers interface with ADC/DAC FMC modules. Use Value: 20 GTY lanes enable simultaneous multi-channel digitization at 1.2 GS/s with sub-ns timing alignment across channels. | Use Scenario: Layer 1 PHY processing and fronthaul transport in massive MIMO 5G gNodeB units. IC Role / Device Role / Timing Role: Implements JESD204B subclass 1 links to RFICs and CPRI/eCPRI over SFP+ optical interfaces. Use Value: Hardened 25G Ethernet MAC and deterministic latency (< 100 ns) meet 5G URLLC timing budgets. |
| High-Speed Data Acquisition | Industrial Machine Vision |
Use Scenario: Multi-sensor synchronized capture in semiconductor test equipment with timestamp correlation. IC Role / Device Role / Timing Role: Acts as central timing and data aggregation hub; manages trigger distribution and PCIe Gen3 streaming to host CPU. Use Value: 27 W TDP and -40°C to +100°C rating allow deployment in fanless enclosures inside wafer probers. | Use Scenario: Real-time defect classification on production lines using CNN inference on image streams from 12 MP global-shutter sensors. IC Role / Device Role / Timing Role: Accelerates convolution and pooling layers; HP I/O drives SLVS-EC and MIPI CSI-2 camera interfaces. Use Value: 2,196 DSP slices deliver > 1.2 TOPS INT8 throughput while maintaining < 5 ms end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing and high-speed interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA1156I | 356,160 logic cells, 1,728 DSP slices, 22.1 Mb BRAM, same FFVA1156 package | Lower gate count and DSP resources limit complex radar waveform generation and multi-stream 5G PHY stacking | Select when target design fits within reduced resource budget and thermal envelope (22 W TDP) |
| XCKU060-2FFVA1156I | 562,560 logic cells, 2,760 DSP slices, 35.4 Mb BRAM, identical package and pinout | Enables larger-scale 5G baseband or AI-accelerated vision pipelines with additional hard IP (e.g., dual PCIe Gen3 x16) | Choose for designs requiring headroom in logic, memory, and transceiver count beyond XCKU040-2FFVA1156I capacity |
Compared with XCKU035-2FFVA1156I, the XCKU040-2FFVA1156I provides 25% more logic and 27% more DSP slices for higher algorithmic complexity; versus XCKU060-2FFVA1156I, it offers a balanced cost-performance point with verified thermal behavior in space-constrained industrial enclosures.
Availability
XCKU040-2FFVA1156I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-speed data acquisition requiring stable component supply across long-lifecycle industrial programs.
Supply support for XCKU040-2FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and AI acceleration.
The Kintex UltraScale family targets high-bandwidth, low-latency applications such as wireless infrastructure, test & measurement, and aerospace avionics where deterministic timing and hardened I/O are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU040-2FFVA1156I?
The XCKU040-2FFVA1156I supports DDR4 memory interfaces up to 2400 Mbps (1200 MHz clock). This capability is implemented through its hardened DDR4 memory controller, which handles address/command timing, write leveling, and read leveling automatically. The controller connects directly to HP I/O banks configured for SSTL_12 standards and supports up to eight 16-bit DDR4 components with ECC. XCKU040-2FFVA1156I achieves this speed without requiring external PHY or level-shifting circuitry.
Does XCKU040-2FFVA1156I support partial reconfiguration?
Yes, XCKU040-2FFVA1156I fully supports partial reconfiguration via its ICAP and FRAME_ECC primitives. This allows dynamic swapping of logic modules-such as filter banks or modulation engines-without resetting the entire device. The feature is enabled by the UltraScale architecture's frame-based bitstream structure and is validated in Xilinx Vivado 2022.2 and later. XCKU040-2FFVA1156I users leverage this for adaptive radar waveform updates and real-time protocol switching in 5G fronthaul.
What transceiver type and speed does XCKU040-2FFVA1156I include?
XCKU040-2FFVA1156I integrates 20 GTY transceivers, each capable of 16.3 Gb/s line rates. These transceivers support protocols including PCIe Gen3, 10G/25G Ethernet, CPRI, and JESD204B subclass 1. They feature built-in TX pre-emphasis, RX equalization, and clock-data recovery. XCKU040-2FFVA1156I implements them as differential pairs routed on dedicated high-speed layers, requiring strict PCB layout rules for impedance control and crosstalk mitigation.
Is XCKU040-2FFVA1156I pin-compatible with other Kintex UltraScale devices in FFVA1156 package?
XCKU040-2FFVA1156I shares the same 1156-ball FFVA package footprint and pinout with XCKU035-2FFVA1156I and XCKU060-2FFVA1156I. All three devices maintain identical ball assignments for power, ground, configuration, and I/O banks. However, unused pins differ in function assignment, and transceiver lane mapping varies between models. XCKU040-2FFVA1156I leverages all 20 GTY lanes, whereas XCKU035 uses only 16 and XCKU060 enables all 24 (though only 20 are bonded out in FFVA1156).
What configuration modes are supported by XCKU040-2FFVA1156I?
XCKU040-2FFVA1156I supports master SPI, slave serial, BPI, and JTAG configuration modes. Master SPI is most common for standalone boot from quad-SPI flash; startup time is ≤50 ms. Configuration bitstream can be encrypted using AES-256 and authenticated via HMAC-SHA256. XCKU040-2FFVA1156I also supports fallback configuration and multi-boot with golden image recovery, enhancing field reliability in unattended deployments.
XCKU040-2FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 520
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU040-2FFVA1156I FAQ
1.How can I place an order for XCKU040-2FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-2FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-2FFVA1156I reliable?
The price and inventory of XCKU040-2FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-2FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU040-2FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-2FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-2FFVA1156I?
XCKU040-2FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-2FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-2FFVA1156I?
For technical support, including XCKU040-2FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-2FFVA1156I requirements.
6.How does Aetrix verify that XCKU040-2FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU040-2FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-2FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU040-2FFVA1156I?
All XCKU040-2FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-2FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-2FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU040-2FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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