AMD XCKU040-2SFVA784E
- Part No.:
- XCKU040-2SFVA784E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCCSP
- Datasheet:
-
XCKU040-2SFVA784E.pdf
- Description:
- IC FPGA 468 I/O 784FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,716
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU040-2SFVA784E from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,156 DSP slices, 28.4 Mb of block RAM, 960 I/O pins, and -2 speed grade with extended temperature range operation. It serves as a high-performance programmable logic fabric for data acceleration, high-speed interface bridging, and real-time signal processing in 5G infrastructure and radar systems.
For engineers reviewing the XCKU040-2SFVA784E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), transceiver line rates up to 16.3 Gb/s, and configuration via PCIe Gen3 x8 or quad-SPI flash.
Technical Context
The XCKU040-2SFVA784E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3, 10/25/100G Ethernet MACs, DDR4 PHY), and ultra-low-latency transceivers. It supports multi-rate serial protocols including CPRI, JESD204B/C, and OTN.
Configuration is performed through Master SPI, SelectMAP, or PCIe-based fallback modes. The device uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - total available LUT-based configurable logic resources |
| DSP Slices | 2,156 - fixed-point arithmetic units supporting 27×18 multiply-accumulate operations |
| Block RAM | 28.4 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| I/O Pins | 960 - user-configurable bidirectional pins supporting LVDS, SSTL, HSTL, and MIPI standards |
| Transceiver Max Rate | 16.3 Gb/s - per lane serial line rate for high-bandwidth interconnects |
| Speed Grade | -2 - timing performance bin enabling operation at 725 MHz system clock in worst-case conditions |
| Operating Temp | -40°C to +100°C - extended industrial temperature range for harsh-environment deployment |
Pinout & Package
Package: 784-pin Flip-Chip Ball Grid Array (FCBGA) with 27 × 27 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 1.8V supply for configuration logic, transceivers, and I/O banks |
| MGTAVCC | Transceiver Analog Supply | 1.0V analog supply for high-speed transceiver PLLs and serializers |
| CLK_IN | Primary Configuration Clock | Dedicated differential input for configuration and startup clocking |
| PROGRAM_B | Global Reset Control | Active-low asynchronous reset that clears configuration memory and initiates reload |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex supporting hot-plug, AER, and MSI-X without soft logic overhead |
| DDR4 Memory Controller | Hardened PHY supporting 2400 MT/s with ECC and AXI4 interface for direct SoC integration |
| JESD204B/C Support | Up to 16 lanes at 12.5 Gb/s per lane for ADC/DAC interfacing in software-defined radio |
| Partial Reconfiguration | Dynamic module swapping enables runtime adaptation of signal processing pipelines |
| UltraScale Architecture | Column-based routing and hierarchical clocking reduce congestion and improve timing closure |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Programmable baseband processor handling parallel FFT/IFFT, matrix inversion, and digital up/down conversion. Use Value: XCKU040-2SFVA784E delivers deterministic latency under 500 ns for closed-loop control loops in TDD systems. | Use Scenario: Pulse-Doppler processing, CFAR detection, and SAR image reconstruction in airborne radar platforms. IC Role / Device Role / Timing Role: High-throughput data path accelerator interfacing with 12-bit 2.5 GSPS ADCs via JESD204C. Use Value: XCKU040-2SFVA784E enables 48 Gb/s aggregate ADC data ingestion while maintaining sub-cycle timing alignment. |
| Optical Transport Network Line Card | Test & Measurement Equipment |
Use Scenario: OTU4 framing, FEC decoding, and 100G/400G Ethernet mapping in DWDM edge routers. IC Role / Device Role / Timing Role: Protocol-aware packet processor with integrated 100G Ethernet MAC and forward error correction engine. Use Value: XCKU040-2SFVA784E reduces BOM count by integrating 100G MAC + RS(255,239) FEC + SerDes into single die. | Use Scenario: High-resolution waveform generation and real-time spectrum analysis in vector signal analyzers. IC Role / Device Role / Timing Role: Real-time digital downconverter and spectral estimator using pipelined FFT engines and streaming DMA. Use Value: XCKU040-2SFVA784E achieves 16k-point FFT in <1.2 μs with zero pipeline stalls across 128 channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | Fewer logic cells (375,000), reduced DSP count (1,728), smaller 676-pin FCBGA package | Limited bandwidth for >100G transport or dual-polarization radar processing | Select when system I/O count and transceiver lane requirements are ≤72 and cost sensitivity outweighs scalability needs. |
| XCKU060-2FFVA1156E | Higher logic density (562,500 cells), more DSP slices (2,688), larger 1156-pin FCBGA with increased power envelope | Required for full 400G Ethernet MAC stacking or multi-beam satellite ground station processing | Choose when XCKU040-2SFVA784E resource utilization exceeds 85% in critical paths or thermal budget allows higher TDP. |
Compared with XCKU035-2FFVA676E and XCKU060-2FFVA1156E, the XCKU040-2SFVA784E provides optimal balance of transceiver bandwidth, logic capacity, and thermal footprint for mid-tier 5G and defense electronics where board space and power are constrained but performance must exceed Kintex-7 capabilities.
Availability
XCKU040-2SFVA784E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and optical transport equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU040-2SFVA784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding hardened interfaces, high-speed transceivers, and scalable logic resources for next-generation communications and sensing systems.
FAQ
What is the maximum supported transceiver line rate for XCKU040-2SFVA784E?
The XCKU040-2SFVA784E supports transceiver line rates up to 16.3 Gb/s per lane. This capability enables compliance with JESD204C, CPRI Option 10, and 100G Ethernet KR4 standards. The actual achievable rate depends on PCB stackup, reference clock stability, and signal integrity margin. XCKU040-2SFVA784E transceivers are calibrated during configuration and support adaptive equalization for varying channel loss profiles.
Does XCKU040-2SFVA784E support partial reconfiguration?
Yes, XCKU040-2SFVA784E fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules without resetting the entire device or disrupting active I/O or memory interfaces. XCKU040-2SFVA784E implements frame-based reconfiguration with CRC-protected bitstream segments and secure authentication options for field-upgradable functions.
What memory interfaces does XCKU040-2SFVA784E natively support?
XCKU040-2SFVA784E integrates hardened DDR4, LPDDR4, and RLDRAM3 memory controllers with PHY layers. It supports DDR4-2400 with 64-bit bus width, ECC, and AXI4 interface. The controller includes write leveling, read leveling, and training sequences compliant with JEDEC specifications. XCKU040-2SFVA784E does not support DDR3 or GDDR6 natively.
Is XCKU040-2SFVA784E qualified for extended temperature operation?
Yes, XCKU040-2SFVA784E is rated for operation from -40°C to +100°C ambient temperature. This extended temperature grade is verified per JEDEC JESD22-A104 and JESD22-A108 reliability testing. The device uses thermal monitoring diodes and dynamic thermal throttling to maintain safe junction temperatures. XCKU040-2SFVA784E is commonly deployed in outdoor 5G base stations and airborne radar enclosures.
What configuration methods are supported by XCKU040-2SFVA784E?
XCKU040-2SFVA784E supports Master SPI, Slave SelectMAP, and PCIe-based configuration. Master SPI mode uses internal oscillator and external flash; SelectMAP allows parallel loading via microprocessor bus; PCIe configuration enables direct host-initiated programming without external storage. All modes support encrypted bitstreams and HMAC authentication. XCKU040-2SFVA784E also supports fallback configuration from secondary flash if primary fails.
XCKU040-2SFVA784E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 784-BFBGA, FCCSP
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 468
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCCSPBGA (23x23)
XCKU040-2SFVA784E FAQ
1.How can I place an order for XCKU040-2SFVA784E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-2SFVA784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-2SFVA784E reliable?
The price and inventory of XCKU040-2SFVA784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-2SFVA784E is usually 5 days.
3.What payment methods are accepted for XCKU040-2SFVA784E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-2SFVA784E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-2SFVA784E?
XCKU040-2SFVA784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-2SFVA784E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-2SFVA784E?
For technical support, including XCKU040-2SFVA784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-2SFVA784E requirements.
6.How does Aetrix verify that XCKU040-2SFVA784E is sourced from the original manufacturer or authorized distributors?
All XCKU040-2SFVA784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-2SFVA784E meets industry standards.
7.What is the process for return or replacement of XCKU040-2SFVA784E?
All XCKU040-2SFVA784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-2SFVA784E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-2SFVA784E part is unused and in its original packaging.
Return procedure for XCKU040-2SFVA784E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU040-2SFVA784E Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

.jpg)