AMD XCKU040-2SFVA784I

Overview

XCKU040-2SFVA784I from AMD is a Kintex UltraScale FPGA with 443,200 logic cells, 2,156 DSP slices, and 28.4 Mb of block RAM; supports PCIe Gen3 x16, DDR4-2400, and 16.3 Gb/s transceivers; used in high-throughput data acceleration and reconfigurable computing systems.

For engineers reviewing the XCKU040-2SFVA784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 784-pin FC-BGA packages, and support for hardened IP including PCIe and memory controllers.

Technical Context

The XCKU040-2SFVA784I implements a heterogeneous architecture with programmable logic fabric, hardened memory controllers (DDR4/LPDDR4), and multi-protocol transceivers operating up to 16.3 Gb/s. It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC variant-but this part is FPGA-only, without processing system.

It features SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards across 24 I/O banks; configuration via quad-SPI or JTAG; and operates at -40°C to +100°C junction temperature under Industrial grade rating.

Key Specifications

Pinout & Package

The XCKU040-2SFVA784I is housed in a 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FC-BGA) package with 23 mm × 23 mm body size, 0.8 mm ball pitch, and integrated thermal lid for industrial-grade thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU035-2FFVA676I and XCKU060-2FFVA1156I, the XCKU040-2SFVA784I delivers optimal balance of transceiver bandwidth, logic capacity, and thermal footprint for air-cooled 1U systems requiring deterministic real-time processing without over-provisioning.

Availability

XCKU040-2SFVA784I is available at Aetrix Electronics and suitable for 5G infrastructure, financial data acceleration, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCKU040-2SFVA784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, and GPU technologies.

The Kintex UltraScale family targets high-throughput, power-efficient reconfigurable computing in communications, test & measurement, and aerospace applications-designed for deterministic latency and scalable bandwidth.

FAQ

What is the maximum supported DDR4 memory speed for XCKU040-2SFVA784I?

The XCKU040-2SFVA784I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s with 64-bit bus width and ECC capability. This is validated across all I/O banks configured for DDR4 interface, and requires compliant DIMM or discrete DRAM layout per AMD UG576 guidelines. The XCKU040-2SFVA784I does not support DDR5 or LPDDR5.

Does XCKU040-2SFVA784I include an integrated ARM processor subsystem?

No, the XCKU040-2SFVA784I is a pure FPGA device without any embedded ARM processor cores. It belongs to the Kintex UltraScale FPGA family-not the Zynq UltraScale+ MPSoC family. All processing must be implemented in programmable logic or offloaded to external processors. The XCKU040-2SFVA784I relies on external configuration devices and host interfaces for system control.

What transceiver protocols are natively supported by XCKU040-2SFVA784I?

The XCKU040-2SFVA784I transceivers natively support PCIe Gen3, 10GBASE-R, CPRI, JESD204B, and SATA 3.0 through hardened physical layer blocks. Protocol stack implementation (e.g., PCIe endpoint logic) requires soft IP or AMD-provided IP cores. The XCKU040-2SFVA784I does not support native JESD204C or PCIe Gen4 without retiming or external SerDes.

What is the thermal design power (TDP) range for XCKU040-2SFVA784I under typical operation?

The XCKU040-2SFVA784I has a typical TDP range of 18–28 W depending on logic utilization, transceiver count active, and I/O toggle rate. AMD's XPE tool calculates precise power estimates based on user design constraints. The XCKU040-2SFVA784I is rated for industrial temperature and supports passive cooling in 784-pin FC-BGA layouts with ≥6 thermal vias per power ball.

Can XCKU040-2SFVA784I be configured via quad-SPI flash memory?

Yes, the XCKU040-2SFVA784I supports master quad-SPI configuration mode using dedicated CONFIG_IO pins, enabling fast, secure, and space-efficient boot from serial NOR flash. Configuration bitstream encryption and HMAC authentication are supported. The XCKU040-2SFVA784I also supports JTAG and BPI modes for development and production programming.