AMD XCKU040-3FBVA676E

Overview

XCKU040-3FBVA676E from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,160 DSP slices, and 28.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and operates at -3 speed grade with extended temperature range (-40°C to +100°C). Used in high-bandwidth data acquisition systems requiring deterministic latency and real-time signal processing.

For engineers reviewing the XCKU040-3FBVA676E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates (up to 16.3 Gb/s), and configuration interface options (SPIx4, BPI, SelectMAP).

Technical Context

The XCKU040-3FBVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, 10/25G Ethernet, and memory controllers. It integrates 24 GTY transceivers supporting PAM4 and NRZ modulation schemes, and includes dedicated clock management tiles with MMCM and PLL resources.

Configuration is performed via master SPI or JTAG, with support for dual-boot and secure bitstream encryption using AES-256 and HMAC-SHA-256. The device uses 2.5D stacked silicon interconnect technology with multiple die in a single package, enabling high logic density without compromising timing closure.

Key Specifications

Pinout & Package

Package: FBVA676 (676-ball fine-pitch BGA, 0.8 mm pitch, 27 mm × 27 mm body, 1.19 mm height). Thermal pad on underside for enhanced heat transfer to PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU040-3FBVA676E, the XCKU060-2FFVA1156I offers higher logic capacity in a larger package, while the XCKU115-2FLVD1924E delivers significantly greater DSP and memory resources-both require PCB redesign due to different ball counts and thermal profiles.

Availability

XCKU040-3FBVA676E is available at Aetrix Electronics and suitable for radar signal processing, 5G infrastructure, and medical imaging systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU040-3FBVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale family targets applications demanding high I/O bandwidth, deterministic latency, and hardware-accelerated signal processing-especially where ASIC-level performance is needed with FPGA flexibility.

FAQ

What is the maximum supported DDR4 data rate for XCKU040-3FBVA676E?

The XCKU040-3FBVA676E supports DDR4 memory interfaces up to 2400 Mbps per pin. This is achieved using its integrated hard memory controller with 128-bit data bus width and on-die termination. The -3 speed grade ensures reliable operation at this rate across the extended temperature range (-40°C to +100°C), making XCKU040-3FBVA676E suitable for thermally demanding environments.

Does XCKU040-3FBVA676E support partial reconfiguration?

Yes, XCKU040-3FBVA676E fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic updating of specific logic regions while the rest of the design remains operational. XCKU040-3FBVA676E leverages UltraScale+ architecture features such as frame-based configuration and hierarchical design checkpoints to enable runtime adaptation in radar, communications, and test equipment applications.

What transceiver protocols are natively supported by XCKU040-3FBVA676E?

XCKU040-3FBVA676E natively supports PCIe Gen3, 10/25G Ethernet, CPRI, and DisplayPort 1.4 via its 24 GTY transceivers. Each GTY lane operates up to 16.3 Gb/s and supports both NRZ and PAM4 signaling. The hardened protocol stacks reduce logic resource usage and improve timing predictability compared to soft IP implementations in XCKU040-3FBVA676E designs.

What is the core voltage requirement for XCKU040-3FBVA676E?

XCKU040-3FBVA676E requires a nominal VCCINT supply of 0.85V ±3% for the programmable logic fabric. This low-voltage rail must be delivered with tight regulation and low noise, especially under dynamic switching loads. The XCKU040-3FBVA676E datasheet specifies ripple limits and decoupling requirements to ensure timing stability and avoid configuration errors during operation.

Is XCKU040-3FBVA676E compatible with AMD Vivado 2023.1 toolchain?

Yes, XCKU040-3FBVA676E is fully supported in AMD Vivado 2023.1, including synthesis, implementation, and bitstream generation. Device-specific IP cores, constraint templates, and timing models for the XCKU040-3FBVA676E are included in the installation. Users targeting XCKU040-3FBVA676E should select the "Kintex UltraScale" part family and verify that the installed device definition matches the -3 speed grade and FBVA676 package.