AMD XCKU040-3FBVA900E

Overview

XCKU040-3FBVA900E from AMD (formerly Xilinx) is a Kintex UltraScale FPGA featuring 444,480 logic cells, 2,400 DSP slices, and 28.5 Mb of block RAM. It supports up to 48 GTY transceivers operating at 32.75 Gb/s, and is packaged in a 900-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-bandwidth data processing in 5G radio units and radar signal conditioning.

For engineers reviewing the XCKU040-3FBVA900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (-3), thermal performance of the FBVA900 package, I/O bank voltage flexibility (1.2 V to 1.8 V), and configuration interface options (JTAG, SelectMAP, SPI).

Technical Context

The XCKU040-3FBVA900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x8, 100G Ethernet MAC), and multi-rate transceivers. Its -3 speed grade guarantees timing closure at maximum operating frequencies across industrial temperature range (–40°C to +100°C junction).

Configuration is supported via dual-boot QSPI flash or JTAG, with bitstream encryption and HMAC authentication enabled. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.

Key Specifications

Pinout & Package

Package: 900-pin Flip-Chip Ball Grid Array (FBVA900), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU040-2FBVA900E, the XCKU040-3FBVA900E delivers higher transceiver bandwidth and tighter timing margins; compared with XCKU060-3FBVA900E, it offers identical footprint and thermal profile at lower cost and power for mid-scale workloads.

Availability

XCKU040-3FBVA900E is available at Aetrix Electronics and suitable for 5G infrastructure, automotive radar, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU040-3FBVA900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Kintex UltraScale family targets high-throughput, low-latency applications in wired/wireless communications, aerospace, and instrumentation where performance-per-watt and I/O flexibility are critical.

FAQ

What is the maximum operating junction temperature for the XCKU040-3FBVA900E?

The XCKU040-3FBVA900E is rated for a maximum junction temperature of +100°C under industrial conditions. This specification is validated per AMD's Kintex UltraScale DC and Switching Characteristics documentation. Thermal design must ensure adequate heatsinking and airflow to maintain this limit during sustained GTY transceiver activity and full logic utilization. The XCKU040-3FBVA900E thermal lid supports standard clip-on heat sink mounting.

Does the XCKU040-3FBVA900E support JESD204C interface natively?

Yes, the XCKU040-3FBVA900E supports JESD204C through its GTY transceivers, which are configurable for 6.375–32.75 Gb/s operation with built-in 64b/66b encoding and deterministic latency features. The XCKU040-3FBVA900E requires appropriate transceiver wizard configuration and link-layer RTL to implement JESD204C subclass 1 operation. Reference designs and IP cores are available in AMD Vivado 2023.1+.

Can the XCKU040-3FBVA900E be configured via quad-SPI flash?

Yes, the XCKU040-3FBVA900E supports dual-boot configuration from quad-SPI flash using the dedicated CONFIG_IO bank. It supports both single-image and dual-image fallback modes with CRC verification. The XCKU040-3FBVA900E boot process initiates automatically on power-up when mode pins are set to SPIx4 configuration, and supports encrypted bitstreams loaded from secure flash devices.

What I/O standards does the XCKU040-3FBVA900E support in HP I/O banks?

The XCKU040-3FBVA900E HP I/O banks support LVDS, BLVDS, RSDS, and differential SSTL at 1.2 V and 1.35 V. These banks are optimized for high-speed memory interfaces and serial protocols, with calibrated output impedance and programmable input termination. The XCKU040-3FBVA900E HP banks do not support 1.8 V signaling-only HR banks provide that voltage level.

Is partial reconfiguration supported on the XCKU040-3FBVA900E?

Yes, partial reconfiguration is fully supported on the XCKU040-3FBVA900E using AMD Vivado's hierarchical design flow and ICAP interface. This capability enables dynamic logic module updates without resetting the entire device-a key requirement for adaptive radar and software-defined radio. The XCKU040-3FBVA900E maintains all non-reconfigured logic and I/O states during the process.