AMD XCKU040-3SFVA784E

Overview

XCKU040-3SFVA784E from AMD is a Kintex UltraScale FPGA with 443,200 logic cells, 2,520 DSP slices, and 28.4 Mb of block RAM; supports PCIe Gen3 x16, DDR4-2400, and 16.3 Gb/s transceivers; used in high-throughput data acceleration and reconfigurable computing systems.

For engineers reviewing the XCKU040-3SFVA784E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 784-pin FCBGA packages, and support for hardened IP including PCIe and memory controllers.

Technical Context

The XCKU040-3SFVA784E implements a heterogeneous architecture with programmable logic fabric, hardened ARM Cortex-R5F processors (in Zynq UltraScale+ MPSoC variants), and dedicated transceivers - though this specific part is FPGA-only and excludes processing subsystems. It features 24 UltraScale+ transceiver quads supporting up to 16.3 Gb/s PAM4 or NRZ per lane.

I/O banks support selectable VCCO voltages (1.2 V to 1.8 V) across 16 banks, with HP and HR bank types enabling mixed-voltage interface design. The -3 speed grade guarantees timing closure at 750 MHz for register-to-register paths under worst-case conditions.

Key Specifications

Pinout & Package

The XCKU040-3SFVA784E is housed in a 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package designated SFVA784, with 23 mm × 23 mm footprint, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in air-cooled systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU040-3SFVA784E, the XCKU060 offers headroom for future feature expansion but increases PCB area and cooling requirements, while the XCKU035 trades logic capacity for lower cost and power - both require layout changes due to differing package footprints or I/O counts.

Availability

XCKU040-3SFVA784E is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-speed test equipment requiring stable component supply over extended production lifecycles.

Supply support for XCKU040-3SFVA784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, delivering scalable silicon and software platforms for data centers, AI, and edge applications.

The Kintex UltraScale family targets applications demanding high logic density, bandwidth, and power efficiency - specifically optimized for reconfigurable acceleration in communications, instrumentation, and imaging systems.

FAQ

What is the maximum supported DDR4 data rate for XCKU040-3SFVA784E?

The XCKU040-3SFVA784E supports DDR4 memory interfaces up to 2400 MT/s using its hardened memory controller. This capability applies to both single- and dual-rank configurations with on-die termination and write-leveling calibration. The controller integrates ECC support and operates across I/O banks configured for 1.2 V VCCO. XCKU040-3SFVA784E achieves this rate without external PHY, reducing system complexity and board area.

Does XCKU040-3SFVA784E include a built-in processor subsystem?

No, the XCKU040-3SFVA784E is an FPGA-only device and does not integrate ARM processor cores or a processing system (PS). It belongs to the Kintex UltraScale series, which is distinct from Zynq UltraScale+ MPSoC devices. All processing must be implemented in programmable logic or interfaced externally. XCKU040-3SFVA784E retains full access to hardened IP such as PCIe and memory controllers, but lacks the PS-PL AXI interconnect found in SoC variants.

What thermal management is recommended for XCKU040-3SFVA784E in continuous operation?

XCKU040-3SFVA784E requires active or forced-air cooling when operating at full utilization, especially with transceivers running at 16.3 Gb/s. AMD specifies a maximum junction temperature of 100°C for the -3 speed grade. Recommended PCB layout includes thermal vias under the package, a 2-oz copper inner layer, and a heatsink attached to the thermal lid. XCKU040-3SFVA784E thermal performance is validated using JEDEC JESD51-2 compliant airflow conditions.

Can XCKU040-3SFVA784E support partial reconfiguration in production systems?

Yes, XCKU040-3SFVA784E fully supports partial reconfiguration (PR) as defined in AMD Vivado Design Suite v2020.2 and later. PR allows dynamic swapping of logic modules without resetting the entire device, enabling adaptive compute workloads. XCKU040-3SFVA784E implements frame-based PR with secure bitstream loading and CRC checking. Verified use cases include runtime protocol switching and algorithm updates in 5G baseband and test equipment.

What configuration modes are supported by XCKU040-3SFVA784E?

XCKU040-3SFVA784E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Configuration bitstreams can be loaded from flash memory (x4 or x8 mode), external processors, or boundary-scan tools. The device includes bitstream encryption and HMAC authentication for secure boot. XCKU040-3SFVA784E also supports fallback configuration and multi-boot with watchdog timer recovery - all configurable via AMD's ICAP and STARTUP blocks.