AMD XCKU040-L1FBVA676I
- Part No.:
- XCKU040-L1FBVA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU040-L1FBVA676I.pdf
- Description:
- IC FPGA 312 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU040-L1FBVA676I from AMD is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,520 DSP slices, and 28.4 Mb of block RAM. It supports up to 48 GTY transceivers operating at 16.3 Gb/s, and is packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. This device targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU040-L1FBVA676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope (100°C junction), and configuration interface compatibility with SPIx4 or BPI.
Technical Context
The XCKU040-L1FBVA676I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC), and memory controllers for DDR4/LPDDR4. Its GTY transceivers support PAM4 and NRZ modulation with integrated clock data recovery.
Configuration is performed via Master SPI or SelectMAP mode using external flash or processor-controlled initialization. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational/sequential logic capacity for custom datapaths |
| DSP Slices | 2,520 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 28.4 Mb - supports large on-chip buffering for packet assembly or video frame storage |
| GTY Transceivers | 48 × 16.3 Gb/s - delivers aggregate bandwidth for multi-lane 100G Ethernet or CPRI interfaces |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows direct interfacing with ADCs, DACs, and memory without level shifters |
| Junction Temp | 100°C - defines maximum allowable silicon temperature under full static/dynamic load |
Pinout & Package
Package: 676-pin Flip-Chip Ball Grid Array (FCBGA), 27×27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/BPI/Slave SelectMAP) and configuration width |
| CCLK | Configuration Clock | Drives internal configuration state machine during bitstream loading |
| DONE | Configuration Status | Asserted high when configuration completes successfully and device enters user mode |
| INIT_B | Initialization Status | Active-low open-drain signal indicating readiness for configuration start |
| GTY_RXN/TXN | Differential Transceiver | High-speed serial lanes supporting 16.3 Gb/s with embedded CDR and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 | Reduces RTL integration effort and guarantees timing closure for host interface subsystems |
| DDR4/LPDDR4 Memory Controller | Enables direct connection to 2400 MT/s memory with built-in calibration and error correction |
| Partial Reconfiguration Support | Allows runtime update of functional blocks without resetting entire system or losing I/O state |
| UltraScale+ SelectIO Technology | Provides simultaneous multi-standard I/O operation across banks with independent VCCO control |
Applications
| 5G Massive MIMO Baseband | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time beam steering and channel estimation across 64+ antenna elements in sub-6 GHz 5G base stations. IC Role / Device Role / Timing Role: FPGA fabric executes OFDM symbol processing, MIMO precoding, and layer-1 protocol stack acceleration. Use Value: XCKU040-L1FBVA676I delivers deterministic latency and scalable logic density required for concurrent multi-user scheduling. | Use Scenario: Phase-coherent signal synthesis and adaptive nulling in ground-based phased array radar systems. IC Role / Device Role / Timing Role: XCKU040-L1FBVA676I hosts digital down-conversion chains and adaptive filter coefficient updates per antenna channel. Use Value: GTY transceivers interface directly with RF sampling ADCs/DACs at 4 GSPS, eliminating analog front-end bottlenecks. |
| High-Speed Test Equipment | Medical Imaging Data Pipeline |
Use Scenario: Protocol-aware pattern generation and real-time error injection for PCIe 4.0 and USB 3.2 compliance testing. IC Role / Device Role / Timing Role: XCKU040-L1FBVA676I implements protocol analyzers, serializer/deserializers, and deterministic jitter injection engines. Use Value: Hardened PCIe Gen3 x16 and 16.3 Gb/s GTY lanes enable loopback validation at native link speeds. | Use Scenario: Real-time CT image reconstruction and spectral analysis from multi-slice detector arrays. IC Role / Device Role / Timing Role: XCKU040-L1FBVA676I performs back-projection acceleration, noise reduction filtering, and DICOM compression offload. Use Value: 2,520 DSP slices execute parallelized convolution kernels while block RAM buffers intermediate sinogram data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-L1FFVA676I | Fewer logic cells (371,200), reduced DSP count (2,160), same package and GTY count | Suitable for lower-throughput 5G small cells or entry-level test equipment | Select when design fits within reduced resource budget and thermal envelope is tighter |
| XCKU060-L2FFVA676E | Higher speed grade (–2), increased logic (590,400), more DSP (3,384), extended temp (–40°C to +125°C) | Required for aerospace-grade radar or harsh-environment 5G macro sites | Choose when higher performance, extended temperature, or faster transceiver locking is mandatory |
Compared with XCKU040-L1FBVA676I, the XCKU035 offers cost and power savings at resource margin, while the XCKU060 provides headroom for future feature expansion and wider environmental operation-both share identical pinout and footprint but differ in speed grade, resource allocation, and thermal rating.
Availability
XCKU040-L1FBVA676I is available at Aetrix Electronics and suitable for 5G infrastructure, radar signal processing, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XCKU040-L1FBVA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Kintex UltraScale family targets high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources-optimized for wireless infrastructure, defense electronics, and instrumentation.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU040-L1FBVA676I?
The XCKU040-L1FBVA676I supports GTY transceivers operating at up to 16.3 Gb/s per lane. This rate is validated under industrial temperature conditions and applies to all 48 GTY channels. The transceivers include built-in clock data recovery and adaptive equalization, enabling reliable operation over FR4 PCB traces and passive cables. XCKU040-L1FBVA676I achieves this performance without requiring external retimers in most board-level implementations.
Does the XCKU040-L1FBVA676I support DDR4 memory interfaces?
Yes, the XCKU040-L1FBVA676I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s. It includes on-die termination, write leveling, read/write leveling, and parity support. The controller connects directly to external DDR4 components via dedicated I/O banks with programmable drive strength and fine-grained delay control. XCKU040-L1FBVA676I also supports LPDDR4 at 4266 Mbps in mobile-optimized configurations.
What configuration modes are supported by the XCKU040-L1FBVA676I?
The XCKU040-L1FBVA676I supports Master SPI, Slave SelectMAP, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI uses a single quad-SPI flash device; Slave SelectMAP allows processor-driven configuration over 8/16-bit bus; BPI supports high-speed parallel programming via dedicated flash interface. XCKU040-L1FBVA676I does not support JTAG-only configuration for production deployment.
Is partial reconfiguration supported on the XCKU040-L1FBVA676I?
Yes, the XCKU040-L1FBVA676I fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logical modules while the rest of the design remains operational. Critical I/O states, clock domains, and memory contents are preserved during reconfiguration. XCKU040-L1FBVA676I requires bitstream encryption and CRC checking to be enabled for secure partial bitstream loading.
What is the operating temperature range for the XCKU040-L1FBVA676I?
The XCKU040-L1FBVA676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the L1 speed grade and FBVA676 package variant. Thermal management must ensure junction temperature stays within this limit under worst-case static and dynamic power conditions. XCKU040-L1FBVA676I includes on-die temperature sensors accessible via JTAG or ICAP for real-time monitoring.
XCKU040-L1FBVA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 30300
- Number of Logic Elements/Cells:
- 530250
- Total RAM Bits:
- 21606000
- Number of I/O:
- 312
- Number of Gates:
- -
- Voltage - Supply:
- 0.880V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU040-L1FBVA676I FAQ
1.How can I place an order for XCKU040-L1FBVA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU040-L1FBVA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU040-L1FBVA676I reliable?
The price and inventory of XCKU040-L1FBVA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU040-L1FBVA676I is usually 5 days.
3.What payment methods are accepted for XCKU040-L1FBVA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU040-L1FBVA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU040-L1FBVA676I?
XCKU040-L1FBVA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU040-L1FBVA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU040-L1FBVA676I?
For technical support, including XCKU040-L1FBVA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU040-L1FBVA676I requirements.
6.How does Aetrix verify that XCKU040-L1FBVA676I is sourced from the original manufacturer or authorized distributors?
All XCKU040-L1FBVA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU040-L1FBVA676I meets industry standards.
7.What is the process for return or replacement of XCKU040-L1FBVA676I?
All XCKU040-L1FBVA676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU040-L1FBVA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU040-L1FBVA676I part is unused and in its original packaging.
Return procedure for XCKU040-L1FBVA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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