AMD XCKU040-L1FFVA1156I

Overview

XCKU040-L1FFVA1156I from AMD (formerly Xilinx) is a Kintex UltraScale FPGA featuring 443,200 logic cells, 2,496 DSP slices, and 28.4 Mb of block RAM. It integrates 64 GTY transceivers supporting up to 32.75 Gb/s, and operates across industrial temperature range (–40°C to +100°C) in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package. It is deployed in high-throughput packet processing systems requiring deterministic latency and multi-protocol serial connectivity.

For engineers reviewing the XCKU040-L1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope for air-cooled 1U systems, and support for PCI Express Gen3 x16 root complex operation.

Technical Context

The XCKU040-L1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16 endpoint/root complex, 10/25/100G Ethernet MACs, and integrated memory controllers for DDR4/LPDDR4. Its L1 speed grade guarantees timing closure at 800 MHz for system clocks and 1600 MT/s for DDR4 interfaces.

It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY, with per-bank I/O voltage ranging from 1.2 V to 1.8 V. Configuration occurs via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication enabled by integrated AES-256 and SHA-256 engines.

Key Specifications

Pinout & Package

Package: 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU040-L2FFVA1156I, the XCKU040-L1FFVA1156I trades peak timing margin for lower power and cost in thermally constrained deployments; versus XCKU035-L1FFVA1156I, it delivers 55% more logic and 30% more transceivers within identical board space and thermal envelope.

Availability

XCKU040-L1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU040-L1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets.

The Kintex UltraScale family targets high-throughput, low-latency applications in wired communications, radar, and instrumentation where performance-per-watt and I/O flexibility are critical.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU040-L1FFVA1156I?

The XCKU040-L1FFVA1156I supports GTY transceivers rated up to 32.75 Gb/s per lane. This rating is guaranteed under industrial temperature conditions and applies to protocols including 100G Ethernet, CPRI, and OTN. The transceiver PLLs and PMA circuitry are characterized to maintain BER <10⁻¹² at this rate with standard reference clocks and typical PCB loss profiles.

Does the XCKU040-L1FFVA1156I include a hardened PCIe Gen3 controller?

Yes, the XCKU040-L1FFVA1156I integrates a hardened PCIe Gen3 x16 root complex controller. It supports both endpoint and root complex modes, with full configuration space access, MSI/MSI-X interrupt handling, and DMA engines. The controller is implemented in dedicated silicon and does not consume programmable logic resources, ensuring deterministic latency for host-FPGA communication in the XCKU040-L1FFVA1156I.

What I/O standards are supported by the HR banks on the XCKU040-L1FFVA1156I?

The HR (High-Range) I/O banks on the XCKU040-L1FFVA1156I support SSTL15, SSTL18, HSTL_I_18, HSTL_I_15, POD12, and LVCMOS12/15/18/25/33. Each HR bank operates independently and can be configured for different VCCO voltages between 1.2 V and 1.8 V, enabling mixed-voltage interface coexistence on the same device in the XCKU040-L1FFVA1156I.

Is bitstream encryption available on the XCKU040-L1FFVA1156I?

Yes, the XCKU040-L1FFVA1156I includes AES-256 bitstream encryption with HMAC-SHA-256 authentication. Configuration bitstreams must be encrypted and signed before loading; the device verifies signature integrity and decrypts on-the-fly during startup. This security feature is enabled by dedicated on-die cryptographic engines and is active in all operating modes of the XCKU040-L1FFVA1156I.

What is the operating temperature range specified for the XCKU040-L1FFVA1156I?

The XCKU040-L1FFVA1156I is rated for industrial temperature operation from –40°C to +100°C. This range applies to junction temperature under specified airflow and thermal pad mounting conditions. The device meets JEDEC JESD22-A104 reliability testing for this temperature grade and is qualified for use in fanless or convection-cooled enclosures where ambient temperatures may exceed 70°C in the XCKU040-L1FFVA1156I.